CN103137556A - 导电图案形成方法和导电图案形成系统 - Google Patents

导电图案形成方法和导电图案形成系统 Download PDF

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Publication number
CN103137556A
CN103137556A CN2012104805015A CN201210480501A CN103137556A CN 103137556 A CN103137556 A CN 103137556A CN 2012104805015 A CN2012104805015 A CN 2012104805015A CN 201210480501 A CN201210480501 A CN 201210480501A CN 103137556 A CN103137556 A CN 103137556A
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CN
China
Prior art keywords
fluid
pattern
conductive pattern
conducting polymer
functional fluid
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Pending
Application number
CN2012104805015A
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English (en)
Chinese (zh)
Inventor
胜村学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
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Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN103137556A publication Critical patent/CN103137556A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN2012104805015A 2011-11-22 2012-11-22 导电图案形成方法和导电图案形成系统 Pending CN103137556A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011255279A JP5529835B2 (ja) 2011-11-22 2011-11-22 導電性パターン形成方法及び導電性パターン形成システム
JP2011-255279 2011-11-22

Publications (1)

Publication Number Publication Date
CN103137556A true CN103137556A (zh) 2013-06-05

Family

ID=47290676

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012104805015A Pending CN103137556A (zh) 2011-11-22 2012-11-22 导电图案形成方法和导电图案形成系统

Country Status (4)

Country Link
US (1) US20130129916A1 (enExample)
EP (1) EP2597694A3 (enExample)
JP (1) JP5529835B2 (enExample)
CN (1) CN103137556A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110248465A (zh) * 2019-06-20 2019-09-17 天津荣事顺发电子有限公司 一种厚膜和覆铜一体陶瓷电路板及其制备方法
CN117957069A (zh) * 2021-09-24 2024-04-30 富士胶片株式会社 图案形成基板制造方法及液体排出装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015054784A1 (en) * 2013-10-15 2015-04-23 1835963 Alberta Ltd. Sensing element compositions and sensor system for detecting and monitoring structures for hydrocarbons
MX2014012688A (es) * 2013-11-29 2015-05-28 Müller Martini Holding AG Un metodo para aplicar una sustancia fluida.
JP6137049B2 (ja) * 2014-05-13 2017-05-31 株式会社村田製作所 セラミック電子部品の製造方法
JP6170238B1 (ja) * 2015-12-25 2017-07-26 技術研究組合次世代３Ｄ積層造形技術総合開発機構 ３次元積層造形装置、３次元積層造形装置の制御方法および３次元積層造形装置の制御プログラム
KR101832411B1 (ko) * 2016-04-20 2018-02-26 한국과학기술연구원 비아홀 형성 방법, 다층 연성 인쇄회로기판, 및 그 제조 방법
US11400477B2 (en) * 2018-01-30 2022-08-02 Ford Motor Company Reversible nozzle in ultrasonic atomizer for clog prevention
JP7428677B2 (ja) * 2021-03-19 2024-02-06 東レエンジニアリング株式会社 膜パターン形成方法及びインクジェット塗布装置
WO2023058613A1 (ja) * 2021-10-07 2023-04-13 富士フイルム株式会社 膜の形成方法、電子デバイスの製造方法、及び膜形成装置
WO2023058612A1 (ja) * 2021-10-07 2023-04-13 富士フイルム株式会社 膜の形成方法及び電子デバイスの製造方法
EP4415490A4 (en) * 2021-10-08 2024-12-11 Fuji Corporation CIRCUIT FORMING METHOD AND INFORMATION PROCESSING DEVICE
WO2023058227A1 (ja) * 2021-10-08 2023-04-13 株式会社Fuji 配線形成方法、および情報処理装置
TW202411079A (zh) * 2022-09-02 2024-03-16 美商凱特伊夫公司 多區段邊緣校正

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1545453A (zh) * 2001-08-20 2004-11-10 ������������ʽ���� 基材上图案层的制作方法
JP2005028275A (ja) * 2003-07-11 2005-02-03 Seiko Epson Corp 膜形成方法、デバイス製造方法、電気光学装置、並びに電子機器
JP2010539651A (ja) * 2007-09-10 2010-12-16 メドトロニック，インコーポレイテッド 印刷した電極の性質を少なくとも二元的に制御する方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693418A (ja) 1992-09-11 1994-04-05 Omron Corp 超微粒子膜パターンの形成方法
JP4269748B2 (ja) 2003-04-01 2009-05-27 セイコーエプソン株式会社 表示装置の製造方法
JP4042737B2 (ja) * 2004-10-27 2008-02-06 セイコーエプソン株式会社 パターン形成システム
US20060158497A1 (en) * 2005-01-14 2006-07-20 Karel Vanheusden Ink-jet printing of compositionally non-uniform features
JP4725577B2 (ja) * 2007-12-28 2011-07-13 カシオ計算機株式会社 表示装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1545453A (zh) * 2001-08-20 2004-11-10 ������������ʽ���� 基材上图案层的制作方法
JP2005028275A (ja) * 2003-07-11 2005-02-03 Seiko Epson Corp 膜形成方法、デバイス製造方法、電気光学装置、並びに電子機器
CN1933101A (zh) * 2003-07-11 2007-03-21 精工爱普生株式会社 形成薄膜的方法以及制造器件的方法
JP2010539651A (ja) * 2007-09-10 2010-12-16 メドトロニック，インコーポレイテッド 印刷した電極の性質を少なくとも二元的に制御する方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110248465A (zh) * 2019-06-20 2019-09-17 天津荣事顺发电子有限公司 一种厚膜和覆铜一体陶瓷电路板及其制备方法
CN110248465B (zh) * 2019-06-20 2024-03-19 上海铠琪科技有限公司 一种厚膜和覆铜一体陶瓷电路板及其制备方法
CN117957069A (zh) * 2021-09-24 2024-04-30 富士胶片株式会社 图案形成基板制造方法及液体排出装置

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US20130129916A1 (en) 2013-05-23
EP2597694A2 (en) 2013-05-29
JP5529835B2 (ja) 2014-06-25
JP2013110315A (ja) 2013-06-06
EP2597694A3 (en) 2014-10-22

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