CN103094653B - 电子电路、电子电路的制造方法和安装部件 - Google Patents

电子电路、电子电路的制造方法和安装部件 Download PDF

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Publication number
CN103094653B
CN103094653B CN201210413331.9A CN201210413331A CN103094653B CN 103094653 B CN103094653 B CN 103094653B CN 201210413331 A CN201210413331 A CN 201210413331A CN 103094653 B CN103094653 B CN 103094653B
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China
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ended
conductors
transmission path
electronic circuit
differential transmission
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Expired - Fee Related
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CN201210413331.9A
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English (en)
Chinese (zh)
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CN103094653A (zh
Inventor
板垣智有
川崎研
川崎研一
安仲健太郎
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/293—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/223—Differential pair signal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Near-Field Transmission Systems (AREA)
CN201210413331.9A 2011-11-04 2012-10-25 电子电路、电子电路的制造方法和安装部件 Expired - Fee Related CN103094653B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-241943 2011-11-04
JP2011241943A JP5861868B2 (ja) 2011-11-04 2011-11-04 電子回路および電子回路の製造方法

Publications (2)

Publication Number Publication Date
CN103094653A CN103094653A (zh) 2013-05-08
CN103094653B true CN103094653B (zh) 2017-09-22

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Country Link
US (1) US9596750B2 (https=)
JP (1) JP5861868B2 (https=)
CN (1) CN103094653B (https=)

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KR101975440B1 (ko) 2011-05-12 2019-08-23 디퍼이 신테스 프로덕츠, 인코포레이티드 내시경용 개선된 이미지 센서
HK1207550A1 (en) 2012-07-26 2016-02-05 橄榄医疗公司 Camera system with minimal area monolithic cmos image sensor
CN103889149B (zh) * 2012-12-21 2017-07-14 华为终端有限公司 电子装置和栅格阵列模块
BR112015022884A2 (pt) 2013-03-15 2017-07-18 Olive Medical Corp minimizar o sensor de imagem i/o e as contagens do condutor em aplicações de endoscópio
CN105246394B (zh) 2013-03-15 2018-01-12 德普伊新特斯产品公司 无输入时钟和数据传输时钟的图像传感器同步
US9955568B2 (en) * 2014-01-24 2018-04-24 Dell Products, Lp Structure to dampen barrel resonance of unused portion of printed circuit board via
CN105990633A (zh) * 2015-01-29 2016-10-05 安弗施无线射频系统（上海）有限公司 传输线、传输装置以及移相设备
JP2017121032A (ja) * 2015-06-30 2017-07-06 住友電気工業株式会社 高周波装置
CN105636341A (zh) * 2016-01-01 2016-06-01 广州兴森快捷电路科技有限公司 一种具有空腔结构的pcb板及其制作方法
CN105808491A (zh) * 2016-03-03 2016-07-27 北京小米移动软件有限公司 带状差分线、智能设备及改善智能设备usb眼图的方法
CN106255316B (zh) * 2016-08-17 2018-10-02 信丰共赢发展电子有限公司 一种基于高厚径比深孔电镀技术高频高速电子线路板
CN110915309B (zh) * 2017-06-02 2022-11-01 三菱电机株式会社 印刷电路基板
WO2019187013A1 (ja) 2018-03-30 2019-10-03 三菱電機株式会社 電子回路
CN109888473B (zh) * 2019-01-30 2020-11-24 东南大学 一种与芯片键合的宽带贴片天线
JP7286389B2 (ja) * 2019-04-15 2023-06-05 キヤノン株式会社 無線通信装置、無線通信システムおよび通信方法
US11270972B2 (en) * 2019-06-12 2022-03-08 Nxp B.V. Package with conductive underfill ground plane
US11367697B2 (en) * 2020-05-15 2022-06-21 Qualcomm Incorporated High-density flip chip package for wireless transceivers
US12477654B2 (en) * 2022-04-01 2025-11-18 Macom Technology Solutions Holdings, Inc. RF power pallet with management daughter board

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WO1999040627A1 (en) * 1998-01-26 1999-08-12 Giga A/S An electrical connecting element and a method of making such an element
CN1297323A (zh) * 1999-11-02 2001-05-30 佳能株式会社 印刷线路板
JP2004304134A (ja) * 2003-04-01 2004-10-28 Toshiba Corp 配線基板及びその製造方法
CN1617120A (zh) * 2003-07-28 2005-05-18 大塚宽治 信号传输系统和信号传输线路

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CN1297323A (zh) * 1999-11-02 2001-05-30 佳能株式会社 印刷线路板
JP2004304134A (ja) * 2003-04-01 2004-10-28 Toshiba Corp 配線基板及びその製造方法
CN1617120A (zh) * 2003-07-28 2005-05-18 大塚宽治 信号传输系统和信号传输线路

Also Published As

Publication number Publication date
JP2013098888A (ja) 2013-05-20
CN103094653A (zh) 2013-05-08
JP5861868B2 (ja) 2016-02-16
US20130114218A1 (en) 2013-05-09
US9596750B2 (en) 2017-03-14

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