CN103081577B - 电子设备中用于接地的系统 - Google Patents

电子设备中用于接地的系统 Download PDF

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Publication number
CN103081577B
CN103081577B CN201180042261.4A CN201180042261A CN103081577B CN 103081577 B CN103081577 B CN 103081577B CN 201180042261 A CN201180042261 A CN 201180042261A CN 103081577 B CN103081577 B CN 103081577B
Authority
CN
China
Prior art keywords
electronic board
ground plane
grounding
electronic
footprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180042261.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN103081577A (zh
Inventor
J-M.莱弗尔戈克
P.莱波伊尔
J-P.伯丁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Licensing SAS
International Digital Madison Patent Holding SAS
Original Assignee
THOMSON LICENSING CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THOMSON LICENSING CORP filed Critical THOMSON LICENSING CORP
Publication of CN103081577A publication Critical patent/CN103081577A/zh
Application granted granted Critical
Publication of CN103081577B publication Critical patent/CN103081577B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/02—Carrying-off electrostatic charges by means of earthing connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/006—Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
CN201180042261.4A 2010-07-02 2011-07-01 电子设备中用于接地的系统 Expired - Fee Related CN103081577B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1055388 2010-07-02
FR1055388 2010-07-02
PCT/EP2011/061150 WO2012001161A1 (en) 2010-07-02 2011-07-01 A system for grounding in an electronic device

Publications (2)

Publication Number Publication Date
CN103081577A CN103081577A (zh) 2013-05-01
CN103081577B true CN103081577B (zh) 2016-06-08

Family

ID=43385126

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180042261.4A Expired - Fee Related CN103081577B (zh) 2010-07-02 2011-07-01 电子设备中用于接地的系统

Country Status (6)

Country Link
US (1) US9179530B2 (enExample)
EP (1) EP2589269B1 (enExample)
JP (1) JP5938404B2 (enExample)
KR (1) KR101811902B1 (enExample)
CN (1) CN103081577B (enExample)
WO (1) WO2012001161A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016028977A1 (en) * 2014-08-21 2016-02-25 Fci Asia Pte. Ltd Strain relief assembly for conductive cables
TWI596996B (zh) * 2016-01-08 2017-08-21 和碩聯合科技股份有限公司 電路板組合
CN110113923B (zh) * 2016-06-20 2020-10-30 海信集团有限公司 激光影院设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5613860A (en) * 1994-12-14 1997-03-25 Molex Incorporated Universal grounding clip for card-receiving connector
CN101453826A (zh) * 2007-11-28 2009-06-10 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构

Family Cites Families (27)

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US3694689A (en) 1971-02-24 1972-09-26 Tektronix Inc Electron beam deflection apparatus
JPS53127262U (enExample) * 1977-03-18 1978-10-09
JPS622297U (enExample) * 1985-06-19 1987-01-08
JPH04284661A (ja) * 1991-03-13 1992-10-09 Toshiba Corp 半導体装置
EP0598028B1 (en) 1991-08-09 1998-11-25 Tandem Computers Incorporated Electronic assembly with improved grounding and emi
JPH0622297A (ja) 1992-06-29 1994-01-28 Canon Inc 動き補償符号化装置
JP2951224B2 (ja) 1994-12-26 1999-09-20 三洋電機株式会社 電子機器のアース接続構造
JP3529992B2 (ja) * 1997-09-12 2004-05-24 株式会社ケンウッド 電子機器のグラウンド端子取付構造
US6149443A (en) 1997-09-26 2000-11-21 Qualcomm Incorporated Ground connection apparatus
US5984697A (en) 1997-12-03 1999-11-16 Qualcomm Incorporated Ground clip apparatus for circuit boards
JP3068557B2 (ja) * 1998-04-30 2000-07-24 北川工業株式会社 プリント配線板の接地構造及び当該接地構造に用いられる導電部材
JP2004523908A (ja) * 2001-01-17 2004-08-05 ハネウェル・インターナショナル・インコーポレーテッド プラスチックリード付きチップキャリア（ｐｌｃｃ）および他の表面実装技術（ｓｍｔ）チップキャリアのためのアダプタ
US6464514B1 (en) 2001-12-11 2002-10-15 Hon Hai Precision Ind. Co., Ltd. Card edge connector with grounding pad
US20040105243A1 (en) * 2002-10-03 2004-06-03 Kuang-Hua Lee Electronic device having a plurality of metallic balls for transmitting signals between two circuit boards
US7259969B2 (en) 2003-02-26 2007-08-21 Wavezero, Inc. Methods and devices for connecting and grounding an EMI shield to a printed circuit board
JP4164520B2 (ja) * 2006-07-26 2008-10-15 日本圧着端子製造株式会社 プリント配線板間接続コネクタ
US7278865B1 (en) 2006-09-07 2007-10-09 Universal Scientific Industrial Co., Ltd. Electronic device with a grounding mechanism
TWM324375U (en) 2007-05-21 2007-12-21 Universal Scient Ind Co Ltd Stacked packaging structure for communication module
TWI347049B (en) 2007-06-04 2011-08-11 Hon Hai Prec Ind Co Ltd Electrical card connector
CN101360390B (zh) * 2007-08-03 2011-05-04 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构
JP2009111115A (ja) * 2007-10-30 2009-05-21 Sharp Corp シールドケースおよびそれを備えた高周波受信装置
KR101400853B1 (ko) * 2007-11-14 2014-06-27 삼성전자주식회사 휴대용 무선 단말기의 심카드 커넥터 장치
CN101282594B (zh) * 2008-04-10 2013-06-05 苏州敏芯微电子技术有限公司 具有双面贴装电极的微机电传声器的封装结构
JP5125773B2 (ja) 2008-05-30 2013-01-23 富士通株式会社 電子機器およびグラウンド接続構造
KR101258317B1 (ko) * 2009-03-26 2013-04-25 쿄세라 코포레이션 휴대 전자 기기
US20130083494A1 (en) * 2011-10-04 2013-04-04 Sierra Wireless, Inc. Three-dimensional electronics packaging
US10091918B2 (en) * 2012-12-11 2018-10-02 Qualcomm Incorporated Methods and apparatus for conformal shielding

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5613860A (en) * 1994-12-14 1997-03-25 Molex Incorporated Universal grounding clip for card-receiving connector
CN101453826A (zh) * 2007-11-28 2009-06-10 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构

Also Published As

Publication number Publication date
US20130114180A1 (en) 2013-05-09
KR101811902B1 (ko) 2018-01-25
JP5938404B2 (ja) 2016-06-22
JP2013532389A (ja) 2013-08-15
CN103081577A (zh) 2013-05-01
US9179530B2 (en) 2015-11-03
EP2589269B1 (en) 2020-09-02
KR20130089228A (ko) 2013-08-09
WO2012001161A1 (en) 2012-01-05
EP2589269A1 (en) 2013-05-08

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20190201

Address after: Paris France

Patentee after: International Digital Madison Patent Holding Co.

Address before: I Si Eli Murli Nor, France

Patentee before: THOMSON LICENSING

Effective date of registration: 20190201

Address after: I Si Eli Murli Nor, France

Patentee after: THOMSON LICENSING

Address before: I Si Eli Murli Nor, France

Patentee before: THOMSON LICENSING

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160608

CF01 Termination of patent right due to non-payment of annual fee