JP2013532389A5 - - Google Patents

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Publication number
JP2013532389A5
JP2013532389A5 JP2013517319A JP2013517319A JP2013532389A5 JP 2013532389 A5 JP2013532389 A5 JP 2013532389A5 JP 2013517319 A JP2013517319 A JP 2013517319A JP 2013517319 A JP2013517319 A JP 2013517319A JP 2013532389 A5 JP2013532389 A5 JP 2013532389A5
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JP
Japan
Prior art keywords
electronic
ground plane
electronic substrate
footprint
metal member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013517319A
Other languages
English (en)
Japanese (ja)
Other versions
JP5938404B2 (ja
JP2013532389A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2011/061150 external-priority patent/WO2012001161A1/en
Publication of JP2013532389A publication Critical patent/JP2013532389A/ja
Publication of JP2013532389A5 publication Critical patent/JP2013532389A5/ja
Application granted granted Critical
Publication of JP5938404B2 publication Critical patent/JP5938404B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013517319A 2010-07-02 2011-07-01 電子装置における接地のためのシステム Active JP5938404B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1055388 2010-07-02
FR1055388 2010-07-02
PCT/EP2011/061150 WO2012001161A1 (en) 2010-07-02 2011-07-01 A system for grounding in an electronic device

Publications (3)

Publication Number Publication Date
JP2013532389A JP2013532389A (ja) 2013-08-15
JP2013532389A5 true JP2013532389A5 (enExample) 2014-08-14
JP5938404B2 JP5938404B2 (ja) 2016-06-22

Family

ID=43385126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013517319A Active JP5938404B2 (ja) 2010-07-02 2011-07-01 電子装置における接地のためのシステム

Country Status (6)

Country Link
US (1) US9179530B2 (enExample)
EP (1) EP2589269B1 (enExample)
JP (1) JP5938404B2 (enExample)
KR (1) KR101811902B1 (enExample)
CN (1) CN103081577B (enExample)
WO (1) WO2012001161A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016028977A1 (en) * 2014-08-21 2016-02-25 Fci Asia Pte. Ltd Strain relief assembly for conductive cables
TWI596996B (zh) * 2016-01-08 2017-08-21 和碩聯合科技股份有限公司 電路板組合
CN110113923B (zh) * 2016-06-20 2020-10-30 海信集团有限公司 激光影院设备

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694689A (en) 1971-02-24 1972-09-26 Tektronix Inc Electron beam deflection apparatus
JPS53127262U (enExample) * 1977-03-18 1978-10-09
JPS622297U (enExample) * 1985-06-19 1987-01-08
JPH04284661A (ja) * 1991-03-13 1992-10-09 Toshiba Corp 半導体装置
EP0598028B1 (en) 1991-08-09 1998-11-25 Tandem Computers Incorporated Electronic assembly with improved grounding and emi
JPH0622297A (ja) 1992-06-29 1994-01-28 Canon Inc 動き補償符号化装置
US5613860A (en) * 1994-12-14 1997-03-25 Molex Incorporated Universal grounding clip for card-receiving connector
JP2951224B2 (ja) 1994-12-26 1999-09-20 三洋電機株式会社 電子機器のアース接続構造
JP3529992B2 (ja) * 1997-09-12 2004-05-24 株式会社ケンウッド 電子機器のグラウンド端子取付構造
US6149443A (en) 1997-09-26 2000-11-21 Qualcomm Incorporated Ground connection apparatus
US5984697A (en) 1997-12-03 1999-11-16 Qualcomm Incorporated Ground clip apparatus for circuit boards
JP3068557B2 (ja) * 1998-04-30 2000-07-24 北川工業株式会社 プリント配線板の接地構造及び当該接地構造に用いられる導電部材
JP2004523908A (ja) * 2001-01-17 2004-08-05 ハネウェル・インターナショナル・インコーポレーテッド プラスチックリード付きチップキャリア（ｐｌｃｃ）および他の表面実装技術（ｓｍｔ）チップキャリアのためのアダプタ
US6464514B1 (en) 2001-12-11 2002-10-15 Hon Hai Precision Ind. Co., Ltd. Card edge connector with grounding pad
US20040105243A1 (en) * 2002-10-03 2004-06-03 Kuang-Hua Lee Electronic device having a plurality of metallic balls for transmitting signals between two circuit boards
US7259969B2 (en) 2003-02-26 2007-08-21 Wavezero, Inc. Methods and devices for connecting and grounding an EMI shield to a printed circuit board
JP4164520B2 (ja) * 2006-07-26 2008-10-15 日本圧着端子製造株式会社 プリント配線板間接続コネクタ
US7278865B1 (en) 2006-09-07 2007-10-09 Universal Scientific Industrial Co., Ltd. Electronic device with a grounding mechanism
TWM324375U (en) 2007-05-21 2007-12-21 Universal Scient Ind Co Ltd Stacked packaging structure for communication module
TWI347049B (en) 2007-06-04 2011-08-11 Hon Hai Prec Ind Co Ltd Electrical card connector
CN101360390B (zh) * 2007-08-03 2011-05-04 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构
JP2009111115A (ja) * 2007-10-30 2009-05-21 Sharp Corp シールドケースおよびそれを備えた高周波受信装置
KR101400853B1 (ko) * 2007-11-14 2014-06-27 삼성전자주식회사 휴대용 무선 단말기의 심카드 커넥터 장치
CN101453826B (zh) 2007-11-28 2011-12-21 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构
CN101282594B (zh) * 2008-04-10 2013-06-05 苏州敏芯微电子技术有限公司 具有双面贴装电极的微机电传声器的封装结构
JP5125773B2 (ja) 2008-05-30 2013-01-23 富士通株式会社 電子機器およびグラウンド接続構造
KR101258317B1 (ko) * 2009-03-26 2013-04-25 쿄세라 코포레이션 휴대 전자 기기
US20130083494A1 (en) * 2011-10-04 2013-04-04 Sierra Wireless, Inc. Three-dimensional electronics packaging
US10091918B2 (en) * 2012-12-11 2018-10-02 Qualcomm Incorporated Methods and apparatus for conformal shielding

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