KR101811902B1 - 전자 디바이스에서 접지를 위한 시스템 - Google Patents

전자 디바이스에서 접지를 위한 시스템 Download PDF

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Publication number
KR101811902B1
KR101811902B1 KR1020137000055A KR20137000055A KR101811902B1 KR 101811902 B1 KR101811902 B1 KR 101811902B1 KR 1020137000055 A KR1020137000055 A KR 1020137000055A KR 20137000055 A KR20137000055 A KR 20137000055A KR 101811902 B1 KR101811902 B1 KR 101811902B1
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KR
South Korea
Prior art keywords
electronic board
ground plane
electronic
footprint
board
Prior art date
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Application number
KR1020137000055A
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English (en)
Korean (ko)
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KR20130089228A (ko
Inventor
쟝-마르크 르 풀곡
필리프 르?
필리프 르?t
쟝-피에르 베르땅
Original Assignee
톰슨 라이센싱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 톰슨 라이센싱 filed Critical 톰슨 라이센싱
Publication of KR20130089228A publication Critical patent/KR20130089228A/ko
Application granted granted Critical
Publication of KR101811902B1 publication Critical patent/KR101811902B1/ko
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/02—Carrying-off electrostatic charges by means of earthing connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/006—Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
KR1020137000055A 2010-07-02 2011-07-01 전자 디바이스에서 접지를 위한 시스템 Active KR101811902B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1055388 2010-07-02
FR1055388 2010-07-02
PCT/EP2011/061150 WO2012001161A1 (en) 2010-07-02 2011-07-01 A system for grounding in an electronic device

Publications (2)

Publication Number Publication Date
KR20130089228A KR20130089228A (ko) 2013-08-09
KR101811902B1 true KR101811902B1 (ko) 2018-01-25

Family

ID=43385126

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137000055A Active KR101811902B1 (ko) 2010-07-02 2011-07-01 전자 디바이스에서 접지를 위한 시스템

Country Status (6)

Country Link
US (1) US9179530B2 (enExample)
EP (1) EP2589269B1 (enExample)
JP (1) JP5938404B2 (enExample)
KR (1) KR101811902B1 (enExample)
CN (1) CN103081577B (enExample)
WO (1) WO2012001161A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016028977A1 (en) * 2014-08-21 2016-02-25 Fci Asia Pte. Ltd Strain relief assembly for conductive cables
TWI596996B (zh) * 2016-01-08 2017-08-21 和碩聯合科技股份有限公司 電路板組合
CN110113923B (zh) * 2016-06-20 2020-10-30 海信集团有限公司 激光影院设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111115A (ja) 2007-10-30 2009-05-21 Sharp Corp シールドケースおよびそれを備えた高周波受信装置

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US3694689A (en) 1971-02-24 1972-09-26 Tektronix Inc Electron beam deflection apparatus
JPS53127262U (enExample) * 1977-03-18 1978-10-09
JPS622297U (enExample) * 1985-06-19 1987-01-08
JPH04284661A (ja) * 1991-03-13 1992-10-09 Toshiba Corp 半導体装置
EP0598028B1 (en) 1991-08-09 1998-11-25 Tandem Computers Incorporated Electronic assembly with improved grounding and emi
JPH0622297A (ja) 1992-06-29 1994-01-28 Canon Inc 動き補償符号化装置
US5613860A (en) * 1994-12-14 1997-03-25 Molex Incorporated Universal grounding clip for card-receiving connector
JP2951224B2 (ja) 1994-12-26 1999-09-20 三洋電機株式会社 電子機器のアース接続構造
JP3529992B2 (ja) * 1997-09-12 2004-05-24 株式会社ケンウッド 電子機器のグラウンド端子取付構造
US6149443A (en) 1997-09-26 2000-11-21 Qualcomm Incorporated Ground connection apparatus
US5984697A (en) 1997-12-03 1999-11-16 Qualcomm Incorporated Ground clip apparatus for circuit boards
JP3068557B2 (ja) * 1998-04-30 2000-07-24 北川工業株式会社 プリント配線板の接地構造及び当該接地構造に用いられる導電部材
JP2004523908A (ja) * 2001-01-17 2004-08-05 ハネウェル・インターナショナル・インコーポレーテッド プラスチックリード付きチップキャリア（ｐｌｃｃ）および他の表面実装技術（ｓｍｔ）チップキャリアのためのアダプタ
US6464514B1 (en) 2001-12-11 2002-10-15 Hon Hai Precision Ind. Co., Ltd. Card edge connector with grounding pad
US20040105243A1 (en) * 2002-10-03 2004-06-03 Kuang-Hua Lee Electronic device having a plurality of metallic balls for transmitting signals between two circuit boards
US7259969B2 (en) 2003-02-26 2007-08-21 Wavezero, Inc. Methods and devices for connecting and grounding an EMI shield to a printed circuit board
JP4164520B2 (ja) * 2006-07-26 2008-10-15 日本圧着端子製造株式会社 プリント配線板間接続コネクタ
US7278865B1 (en) 2006-09-07 2007-10-09 Universal Scientific Industrial Co., Ltd. Electronic device with a grounding mechanism
TWM324375U (en) 2007-05-21 2007-12-21 Universal Scient Ind Co Ltd Stacked packaging structure for communication module
TWI347049B (en) 2007-06-04 2011-08-11 Hon Hai Prec Ind Co Ltd Electrical card connector
CN101360390B (zh) * 2007-08-03 2011-05-04 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构
KR101400853B1 (ko) * 2007-11-14 2014-06-27 삼성전자주식회사 휴대용 무선 단말기의 심카드 커넥터 장치
CN101453826B (zh) 2007-11-28 2011-12-21 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构
CN101282594B (zh) * 2008-04-10 2013-06-05 苏州敏芯微电子技术有限公司 具有双面贴装电极的微机电传声器的封装结构
JP5125773B2 (ja) 2008-05-30 2013-01-23 富士通株式会社 電子機器およびグラウンド接続構造
KR101258317B1 (ko) * 2009-03-26 2013-04-25 쿄세라 코포레이션 휴대 전자 기기
US20130083494A1 (en) * 2011-10-04 2013-04-04 Sierra Wireless, Inc. Three-dimensional electronics packaging
US10091918B2 (en) * 2012-12-11 2018-10-02 Qualcomm Incorporated Methods and apparatus for conformal shielding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111115A (ja) 2007-10-30 2009-05-21 Sharp Corp シールドケースおよびそれを備えた高周波受信装置

Also Published As

Publication number Publication date
US20130114180A1 (en) 2013-05-09
JP5938404B2 (ja) 2016-06-22
JP2013532389A (ja) 2013-08-15
CN103081577A (zh) 2013-05-01
CN103081577B (zh) 2016-06-08
US9179530B2 (en) 2015-11-03
EP2589269B1 (en) 2020-09-02
KR20130089228A (ko) 2013-08-09
WO2012001161A1 (en) 2012-01-05
EP2589269A1 (en) 2013-05-08

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