CN103080392A - 铠装线内芯片元件的容纳 - Google Patents

铠装线内芯片元件的容纳 Download PDF

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CN103080392A
CN103080392A CN2011800407811A CN201180040781A CN103080392A CN 103080392 A CN103080392 A CN 103080392A CN 2011800407811 A CN2011800407811 A CN 2011800407811A CN 201180040781 A CN201180040781 A CN 201180040781A CN 103080392 A CN103080392 A CN 103080392A
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J·布龙
L·兰康
D·维卡德
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Abstract

一种用来形成铠装线的方法，包括如下步骤：使芯部（20）轴向地穿过铠装区域（32）前进；在铠装区域内将铠装纤维（24）缠绕在芯部周围；和在铠装区域（32），以这样一种方式提供一串微电子芯片元件（10）（其每一个都具有线部（12）），使得绕在芯部周围的铠装纤维也围绕芯片元件和其线部，以形成合并有分隔开的芯片元件的铠装线。

Description

铠装线内芯片元件的容纳
技术领域
本发明涉及微电子芯片元件，其最大尺寸可小于一毫米。该发明更具体地涉及一种用于封装这种芯片元件以使其容易存储和处理（manipulation）的方法
背景技术
图1示意性地示出了小型无线射频收发装置，其例如用于无接触识别（contactless identification）（RFID-型装置）。该装置包括芯片元件10，其具有大致的平行六面体形状，合并有集成了全部RFID功能的芯片
该装置包括由两个导线部分12a和12b形成的偶极天线（dipoleantenna）。这些部分（其与元件10的两个相对的表面相连接）与芯片的端子连接，且沿相反方向延伸。
由于芯片元件10的大边可小于1mm，这些装置不能使用适用于较大装置的方法来制造和处理。
专利申请WO2009004243描述了用来形成图1类型的RFID装置的方法的实例。形成之后，这些装置并入到待识别的物体内。这引起了操作问题，因为天线应该保持为实质上直线的，或至少不应该通过扭曲而被变短。
发明内容
从而，需要使尺寸非常小的单个芯片元件的操作变得容易的解决方法，特别是当所述元件具有希望被保持为实质上直线的线部时。
为了尽量满足该需求，提供了一种用来形成铠装线的方法，包括如下步骤：使芯部轴向地穿过铠装区域前进；在铠装区域内将铠装纤维绕在芯部周围；和在铠装区域，以这样一种方式提供具有线部的微电子芯片元件，使得绕在芯部周围的铠装纤维也绕在芯片元件和其线部周围。
根据替换性实施例，将一串芯片元件（其具有它们的线部）提供在铠装区域内，以形成合并有分隔开的芯片元件的铠装线。
本发明还提供了一种包括芯部的铠装线，所述芯部具有围绕其的铠装纤维。所述铠装线包括固定（caught）在芯部和铠装纤维之间的、沿铠装线分隔开的微电子芯片元件，每个芯片元件具有也固定在芯部和铠装纤维之间的至少一个线部。
附图说明
根据本发明的具体实施例的以下描述，其他特征和优势更加明显，所述具体实施例仅出于非限制性实例的目的而给出，且在附图中描述，其中：
前面已经描述，图1示意性地显示了具有偶极天线的芯片元件；
图2示意性地显示了用来将芯片元件分隔开地并入在连续的线内的铠装装置；
图2b显示了图2的装置的细节的替换性实施例；
图3显示了通过图2的装置形成的铠装线部分；
图4A和4B以俯视图和端部视图显示了以链的形式封装的芯片元件；
图5示意性地显示了芯片元件链的实施例，其使得元件并入在铠装线内的自动操作变得容易；和
图6显示了能够为支撑线产生凹口的芯片元件的实施例。
具体实施方式
为了使尺寸非常小（可能小于1mm）的单个芯片元件的操作变得容易，提出了将它们以分隔开的方式并入在铠装线内。芯片元件将被固定在线的芯部与螺旋状地绕在芯部周围的铠装纤维之间。
为了避免芯片元件有在铠装纤维的连续螺旋之间逃出的趋势，所述元件将具有也固定在芯部和铠装纤维之间的线部。该铠装部分可以有利地是芯片元件的偶极天线，所述偶极天线集成了射频发送-接收功能或RFID。
绕在线轴上的铠装线可以容易地处理。线除了可以用于制造织物这一事实之外，可以人工地或以自动化地方式将其切断和并入其他物体内，限制芯片元件丢失或使偶极天线扭曲的风险。
图2示意性地显示了传统的铠装装置，通过简单修改，其能够用来将芯片元件并入在铠装线内。这种装置在例如专利US4262480中进行了描述。
芯部20从供给线轴（supply spool）22展开，轴向地穿过两个连续的卷轴（reel）24和26，继而缠绕在接收线轴28上。卷轴24和26中的每一个存储有铠装纤维，并且与旋转机构相关联，所述旋转机构绕前进的芯部旋转，且将铠装纤维绕在芯部周围。两个绕线机构以相反方向旋转，从而出去的铠装线包括形成为相反方向的螺旋的两个铠装纤维层。芯部前进速度与绕线机构的旋转速度的比限定了螺旋的螺距。
如图所示，通常从底部至顶部垂直地工作，即，供给线轴22位于底部，接收线轴28位于顶部。图2中提供绕线机构，以在芯部20穿过卷轴（沿芯部前进方向）之后将铠装纤维绕在芯部20周围。
为了将芯片元件并入在形成的线内，提供了插入装置30，其优选地在第一卷轴24的水平。该插入装置（例如形式为具有适合芯片元件10的直径的管子的插入装置）将芯片元件10一直引导至铠装区域32，其中卷轴24的铠装纤维在此处被绕在芯部20上。该管子从底部穿过卷轴24至顶部，并在区域32附近显露出来。
单个的元件10例如依靠压缩空气被射出而穿过管子30，一直到达区域32，其中在所述区域32处它们被缠绕的铠装纤维所固定。
图2b显示了具有其绕线机构的卷轴24的另一种可能的常见配置。围绕芯部20缠绕铠装纤维发生在卷轴入口（沿芯部20的前进方向）。从而铠装区域32位于卷轴24的入口处。这种配置使得能够使用更短的插入装置30，因为它不再必须穿过卷轴24。这使插入装置供应芯片元件10变得容易。
为了使得可以通过重力供应插入装置30（其将进一步简化该方法），可以预见倒转该装置，即使芯部20从顶部向底部前进。
图3显示了在第一卷轴24的出口处获得的铠装线部分，其示出了芯片元件10和其线部12a和12b被固定在芯部20和螺旋状地缠绕的铠装纤维之间，所述铠装线来自卷轴24。如图所示，需要使线部12a和12b实质上平行于芯部20。
将芯片元件10传送至铠装区域32的优选方式在下文中讨论。
图4A和4B示意性地显示了微电子芯片元件10的链40，其可以例如通过专利申请EP2099060中描述的方法形成。
图4A以俯视图显示了链40的一部分。几个芯片元件10连接在两个平行的支撑线12a和12b之间。
图4B以端部视图显示了芯片元件10中的一个。该元件具有两个侧面凹槽，其中支撑导线12a和12b嵌在其内。在支撑线是导体且用来传送电信号的情况中，这种凹槽可具有电连接垫片（pad）。
通过选择具有足够刚度的线12a和12b，可以沿着插入管30推送该链40而同时保持芯片元件10之间的间距。当位于链端部的元件10到达铠装区域32时，其由缠绕的铠装纤维所固定，并被拉离链的其余部分。（此后，“元件10”用来指代芯片元件10，其可能具有其线部12。）
可以以小于芯部20前进速度的平均速度连续地或间歇地供应链40。产生的铠装线将包括，依照与链节距成比例且与芯部速度与链供应速度之比成比例的节距而规则地分隔开的芯片元件，。
为了使链40在管子30内的前进变得容易，管壁可以纵向地具有沿链前进方向倾斜的一串通道，压缩空气通过所述通道吹进。
用例如到目前为止所描述的这种方法，链的线12在链端部元件10被固定的时刻的断开点难以控制。如图2所示，如果插入管30与芯部20的前进方向对齐，断开可发生在管子30内的链部的任何位置。
为了促进链端部的两个元件10之间的线12断开，管子30优选地相对于芯部20的轴线倾斜，如图2b所示。从而，施加在出来的元件10上的拉伸应力使得下一个元件10卡在管子30的排出口的边缘之间。由此被卡住的这个元件避免了拉伸应力传送至链40的其余部分。一旦拉伸应力由于线12的断开而停止，卡住的元件将被释放。
根据一种变体，为了控制线的断开，可以在管子30的端部提供在出来的元件10提供在铠装区域内时阻碍将要从管子出来的元件10的机构。针对此目的提供了挠性滚子，其被布置以夹住链，并通过摩擦力驱动链。滚子在元件10每次通过后停下来，持续在先的元件被固定在铠装区域内的必要时间。
尽管由此能够确保线12的断开发生在链端部处的两个元件10之间，但尽管如此，这两个元件之间的断开位置不受控制。这不适用于形成偶极天线。
图5显示了链40的实施例，其允许线12受控地断开，尤其是为了使得保持附接于每个已脱离的芯片元件的线部具有选定的长度。
两个元件10之间的线部12a和12b各自都具有凹口，分别为50a和50b。这些凹口限定了优先断点，或有意为之的初始断开点，以便当足够的拉伸应力施加在链40上时，其先于线的任何其他点断开。
可以以不同的方式制造凹口，例如，通过锯痕、刀片的推进、局部腐蚀或局部熔化。
凹口50a和50b显示为处在两个芯片元件10之间的线部的中心处。在线除了参与将单个芯片元件保持在芯部和铠装线的铠装纤维之间（图3）以外不具有进一步的功能的情况中，这是方便的。
如果希望将相互连接的几个连续的芯片元件的群组并入在铠装线内，线12仅在第一群组的最后一个芯片元件和下一群组的第一个元件之间有凹口。继而以对应于群组长度的节距进行链供应。节距同步为使得出去的群组以芯部20的前进速度供应，当下一群组内的第一个芯片元件达到插入管30的排出口边缘时供应停止。继而，即将出去的群组在出口边缘处的元件的前方的线部内的凹口位置处脱离链的其余部分。
如果线作为RFID元件的偶极天线使用，则更合适在线部12a和12b的相反侧提供凹口52a和52b。从而，当拉伸应力施加在链上时，元件10与沿相反方向的天线部分分离，如图1所示。这意味着链内的元件10之间的节距对应于天线的长度。
图6以侧视图显示了芯片元件10的实施例，所述芯片元件10允许在形成链时为线12开凹口。元件10包括线12（12a或12b）插入其内的凹槽。在凹槽的一端处，凹槽的一个侧壁包括穿过凹槽的部分宽度延伸的尖锐肋片60。当所述线被连接至芯片元件时，肋片为线12开凹口。通过为每个芯片元件的两个凹槽提供这种肋片，不需要附加步骤即可形成图5的凹口52a和52b。

Claims (9)

1.一种用来形成铠装线的方法，包括如下步骤：
使芯部（20）穿过铠装区域（32）轴向地前进；
在铠装区域内将铠装纤维（24）缠绕在芯部周围；
其特征在于其包括以下步骤：
在铠装区域（32）内，以这样一种方式提供各自都具有线部（12）的一串微电子芯片元件（10），使得围绕芯部的铠装纤维也缠绕芯片元件和其线部，以形成合并有分隔开的芯片元件的铠装线。
2.如权利要求1所述的方法，其中以链（40）的形式提供芯片元件串，所述链（40）包括附接至具有凹口（52a）的支撑线（12a）的芯片元件（10），所述凹口（52a）限定了当线承受拉伸应力时的优先断裂点。
3.如权利要求2所述的方法，其中链（40）通过引导装置（30）提供在铠装区域内。
4.如权利要求2所述的方法，其中链（40）通过管子（30）提供在铠装区域内，所述管子（30）相对芯部（20）的轴线倾斜。
5.如权利要求2所述的方法，其中链通过滚子之间的摩擦被朝向铠装区域驱动，芯片元件每次通过后滚子暂时地停止。
6.如权利要求2所述的方法，其中链以低于芯部（20）的前进速度的速度被提供在铠装区域（32）内。
7.一种铠装线，其包括周围缠绕有铠装纤维的芯部（20），所述铠装线的特征在于，其包括固定在芯部和铠装纤维之间、沿铠装线分隔开的微电子芯片元件（10），每个芯片元件具有也固定在芯部和铠装纤维之间的至少一个线部（12a）。
8.如权利要求7所述的铠装线，其特征在于，每个芯片元件（10）具有实质上平行于芯部（20）的两个导线部分（12a、12b），形成偶极天线，所述偶极天线与集成到该元件的芯片的射频收发电路相连接。
9.如权利要求7所述的铠装线，其特征在于，每个芯片元件都具有线部（12）插在其内的凹槽，该凹槽在其一端附近包括限定了线部的端部的脊部（60）。
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