CN103076551A - Thermal resistance composition test device and method for LED (light emitting diode) lamp - Google Patents
Thermal resistance composition test device and method for LED (light emitting diode) lamp Download PDFInfo
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- CN103076551A CN103076551A CN2013100008615A CN201310000861A CN103076551A CN 103076551 A CN103076551 A CN 103076551A CN 2013100008615 A CN2013100008615 A CN 2013100008615A CN 201310000861 A CN201310000861 A CN 201310000861A CN 103076551 A CN103076551 A CN 103076551A
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- 230000002123 temporal effect Effects 0.000 claims description 5
- 238000013461 design Methods 0.000 abstract description 9
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Abstract
The invention relates to a thermal resistance composition test device and a thermal resistance composition method for an LED (light emitting diode) lamp, and belongs to the technical field of semiconductor LED illumination and display reliability design and checking. The device and the method provided by the invention have the main invention points that in the actual LED lamp, partial LEDs are selected and isolated to be used as temperature measuring elements, synchronous switching modes and devices for controlling an external lamp power supply are designed, the transient state temperature rise process curve collection line and methods are utilized, and the real thermal resistance composition of the LED lamp is measured on line. When the LED lamp adopts different heat radiators or the contact between the heat radiator and an LED device is poor, the heat resistance of each part is different, the heat radiation design of the LED lamp can be optimized through measuring the thermal resistance composition in different designs and equipment, the highest junction temperature of the lamp is reduced, and the service life and the quality of the LED lamp are ensured. The device and the method provided by the invention are mainly used for fast determining the thermal resistance composition of the LED lamp in a nondestructive way.
Description
Technical field:
This technology belongs to semi-conductor LED illuminating and shows reliability design and the examination technical field.This invention is mainly used in fast, non-destructive is determined the method and apparatus that LED light fixture thermal resistance consists of.
Background technology:
Semiconductor LED illuminating lamp tool or display panel use the power led device of some as light source, can produce a large amount of heat during its work, cause the temperature at semiconductor PN place to raise hydraulic performance decline.General heat sink or the increase heat abstractors etc. of adopting export to external environment condition with heat by the led chip concentrated area, guarantee that junction temperature is lower than safe temperature, guarantee the quality of whole light fixture.
But, the thermal resistance of single led chip can only be measured in the prior art, and the thermal resistance behind the composition light fixture can't be measured, method commonly used is just measured the temperature of its surface by the temperature probe of LED lamp surface.This is to actual LED Design of Luminaires and use extremely not convenient.The present invention utilizes and gathers led chip transient temperature rise conditional curve technology, can convenient, nondestructively obtain the information that LED light fixture thermal resistance consists of, and for optimal design LED lamp heat-radiating device, improves heat dispersion, has obvious advance.
Summary of the invention:
Main inventive point of the present invention is: in actual LED light fixture, choose, isolated part LED is as temperature element, synchro switch mode and the device of controlling outside lamp power have been designed, utilize collection circuit and the method for transient temperature rise conditional curve, the thermal resistance of the actual LED light fixture of on-line measurement consists of.
LED light fixture thermal resistance consists of tester device, it is characterized in that:
This device comprises: have the tester 100 that can measure led chip temperature rise and thermal resistance, tested LED light fixture working power switch 200, LED lamp power 201, thermometric LED unit block 301 and the tested LED light fixture 300 of tested person instrument 100 controls;
Wherein the relation of thermometric LED unit block 301 and tested LED light fixture 300 is as follows; Before this some LED series connection of LED connected mode in the light fixture, the then LED of a plurality of series connection access power supply in parallel again; From multi-path parallel LEDs, isolate a channel Temperature Measuring LED unit block 301, remaining LED is tested LED light fixture 300; Consistent on the thermal resistance on the channel Temperature Measuring LED unit block 301 that isolates, its environment temperature distribution situation and the work of actual LED light fixture, just represented whole light fixture thermal resistance;
Thermometric LED unit block 301 is connected respectively to led chip working current source 104, thermometric LED unit testing current source 103, capture card 102 and voltage and current collecting unit 106 in the tester 100, tested LED light fixture 300 is connected to tested LED light fixture working power switch 200, lamp power 201 connects 200, tested led chip power supply 105 is connected 104, and tested LED light fixture working power switch 200 and led chip working current source 104 are connected to computing machine 101; Computing machine 101 connects capture card 102/ thermometric LED unit testing current source 103 and voltage and current collecting unit 106.
Use the method for testing that said apparatus carries out LED light fixture thermal resistance, it is characterized in that:
During measurement, the thermometric LED unit block 301 that the LED light fixture is isolated is linked into respectively the thermometric LED unit block working power switch 104 in the tester 100, thermometric LED unit testing current source 103, capture card 102 and voltage and current collecting unit 106, with the tested LED light fixture working power switch 200 of tested LED light fixture 300 accesses, and link LED lamp power 201, with thermometric LED unit block working power 105 access thermometric LED unit block working power switches 104, LED power source switch for lamp set 200 and thermometric LED unit block working power switch 104 access computing machines 101 are subjected to computer control synchronously;
After starting process of measurement, computing machine 101 sends instruction thermometric LED unit testing current source 103 is loaded into thermometric LED unit block 301 always, through capture card 102, collects the thermometric LED unit block 301 both end voltage V that do not apply this moment under the working current
0
Then, computing machine sends instruction thermometric LED unit block working power 105 is loaded into thermometric LED unit block 301 through thermometric LED unit block working power switch 104, simultaneously LED lamp power 201 is loaded into tested LED light fixture 300 through tested LED light fixture working power switch 200; The computing machine voltage and current collecting unit 106 that sends instructions collects operating voltage and the electric current of thermometric LED unit block 301, and calculates the operating power P=VI that gathers thermometric LED unit block 301;
Treating that tested LED light fixture 300 temperature no longer change reaches stable state, computing machine 101 sends instruction, turn-off simultaneously thermometric LED unit block working power 105 and lamp power 201, and the voltage temporal evolution V (t) on the tested LED unit block 301 of triggering collection card 102 collections;
The temperature coefficient of thermometric LED unit block 301 is α, LED unit block 301 temperature rise temporal evolution Δ T (t)=[V (t)-V
0]/α, the power P=VI that loads during thermometric LED unit block 301 work, tester calculates Δ T (t) curve, and the thermal resistance that the draws LED unit block 301 namely thermal resistance of tested LED light fixture 300 consists of.
Conditional curve to Fig. 2 temperature rise and heat time heating time adopts the structure function method to process, and such as the algorithm process among the U.S. equipment thermal resistance tester Phase 11, obtains thermal resistance schematic diagram corresponding to fitting structure, sees Fig. 3.
General main packaged LED and the heating radiator of comprising of LED light fixture closely connects between the two.The thermal source of light fixture is led chip, and namely the PN junction place produces heat.Main heat radiation approach is that heat is delivered to the packaged LED outside through scolder, shell in the atmospheric environment, by shell and spreader surface contact the slit after pass to heating radiator, finally be delivered to the atmospheric exterior environment.
Shown in Fig. 3, the physical arrangement of LED light fixture heat radiation approach consists of with the space thermal resistance that the differential structrue functional arrangement reflects can be corresponding one by one.The first peak value horizontal ordinate is that led chip is to the shell thermal resistance value among the structure function figure, the second peak value horizontal ordinate is that chip arrives the spreader surface thermal resistance value, the difference of two peak values is that shell is to the thermal contact resistance value between the spreader surface, the 3rd peak value horizontal ordinate be chip to the thermal resistance value of the external environment conditions such as atmosphere, the difference of second and third peak value is heat radiator thermal resistance value.
The y axle represents the differential action of electric capacity among the figure, value represents the thermal resistance value of different materials on x axle corresponding to its peak value, the curve of the rightmost side represents the thermal resistance that the LED light fixture is total, the thermal resistance of the value representation chip on x axle corresponding to leftmost peak value, and the difference between all the other peak values represents the thermal resistance of diverse location;
Main inventive point:
1, designed by actual LED light fixture and drawn thermometric LED unit block as the circuit of temperature element;
2, design and Implement LED light fixture simultaneous switching circuit with thermometric LED unit block, guarantee that the thermal resistance of measuring actual LED light fixture consists of;
3, expanded LED one single chip thermal resistance measurement function.
Description of drawings
Fig. 1 is that LED light fixture thermal resistance consists of the proving installation schematic diagram.
Wherein-101: computing machine; 102: capture card; 103: thermometric LED unit testing current source; 104: thermometric LED unit block working power switch; 105: thermometric LED unit block working power; 106: thermometric LED cell operation electric current and voltage collecting unit; 200: tested LED light fixture working power switch; The 201:LED lamp power;
301: thermometric LED unit block; 300: tested LED light fixture.
Fig. 2 is the conditional curve figure of temperature rise and heat time heating time.
Fig. 3 is thermal resistance schematic diagram corresponding to fitting structure.
Fig. 4 is thermal resistance schematic diagram corresponding to fitting structure in the embodiment.
Embodiment:
The LED Down lamp of selecting bright source, Zhuhai to produce with safe Electronics Co., Ltd. uses this patent to test its led chip to the thermal resistance formation of heating radiator.This fitting structure is the rear parallel connections of connecting first of some high-power LED chips, and the led chip shell directly coheres in spreader surface, and radiating mode is heat pipe for thermal conductivity.Before the test, first with tested light fixture 300 unsettled being fixed in the confined space, selected and separate wherein one group of thermometric LED unit block 301 as being linked to each other with thermometric LED unit block working power switch 104 interfaces separately by the thermometric device, by measuring thermometric LED unit block 301 to the thermal resistance formation of heating radiator, reach the purpose of obtaining the heat radiator thermal resistance size, all the other LED link to each other and are connected with tested LED light fixture working power switch 200.During test, at first send instruction by control computing machine 101, thermometric LED unit testing current source 103 interfaces are connected thermometric LED unit block 301 with little electric current, and capture card 102 gathers the undressed junction voltage V that makes thermometric LED unit block 301 under the electric current
0Then 101 send instruction, by thermometric LED unit block working power 105 and thermometric LED unit block working power switch 104, access thermometric LED unit block 301, and synchro control 200 is connected LED lamp power 201, make light fixture 300 be in the illumination work state, thermometric LED cell operation electric current and voltage collecting unit 106 gathers voltage V and the electric current I of thermometric LED unit block 301, obtains power P=VI; When temperature reaches stable state, computing machine 101 sends instruction, turn-offs simultaneously the LED lamp power 201 of thermometric LED unit block 301 thermometric LED unit block working powers 105 and tested LED light fixture 300, starts capture card 102, gather on the thermometric LED unit block 301 under the little measuring current junction voltage V
j(t) in time temperature-fall period curve is until V
j(t) no longer change, reach new stable state.(V (t)-V at this moment
0)/α is exactly LED lamp temperatures temporal evolution conditional curve; Divided by power P, be thermal resistance R again
Th=(V (t)-V
0)/α P can obtain the cooling response curve of thermometric LED unit block 301 thus, and its curve is implemented structure function processing capacity in thermal resistance tester, and the thermal resistance that namely obtains from the thermal source led chip to the light fixture external environment condition consists of curve.
Measurement result as shown in Figure 3.As can be seen from the figure R
1=0.8K/W is that LED ties shell thermal resistance, R on the tested light fixture thermometric LED unit block 301
2=2.3K/W arrives spreader surface thermal resistance, R for knot
1With R
2Difference 1.5K/W be that the LED shell is to the thermal contact resistance between the spreader surface, R
3=4.97K/W arrives atmosphere thermal resistance, R for knot
2With R
3Difference 2.67K/W be heat radiator thermal resistance, this model light fixture is the heat pipe heat radiation mode, so heat radiator thermal resistance value is less.If environment temperature is T in addition
0, the LED junction temperature was R when this light fixture was operated in stable state
3* P+ T
0
When the practical different heating radiator of LED light fixture, or heating radiator and LED device contacts are bad, the thermal resistance of its each several part is just different, consist of by the thermal resistance of measuring under different designs and the equipment, can optimize the heat dissipation design of LED light fixture, reduce the maximum junction temperature of light fixture, guarantee LED light fixture serviceable life and quality.
Claims (2)
1.LED the light fixture thermal resistance consists of tester device, it is characterized in that:
This device comprises: have the tester that can measure led chip temperature rise and thermal resistance, tested LED light fixture working power switch, LED lamp power, thermometric LED unit block and the tested LED light fixture of tested person instrument control;
Tester comprises computing machine, capture card, thermometric LED unit testing current source, computer-controlled thermometric LED unit block working power switch, thermometric LED unit block working power and thermometric LED cell operation electric current and voltage collecting unit;
Wherein the relation of thermometric LED unit block and tested LED light fixture is as follows; Before this some LED series connection of LED connected mode in the light fixture, the then LED of a plurality of series connection access power supply in parallel again; From multi-path parallel LEDs, isolate a channel Temperature Measuring LED unit block, remaining LED is tested LED light fixture; Consistent on the thermal resistance on the channel Temperature Measuring LED unit block that isolates, its environment temperature distribution situation and the work of actual LED light fixture, just represented whole light fixture thermal resistance;
Thermometric LED unit block is connected respectively to led chip working current source, thermometric LED unit testing current source, capture card and voltage and current collecting unit in the tester, tested LED light fixture is connected to tested LED light fixture working power switch, lamp power connects, tested led chip power supply is connected, and tested LED light fixture working power switch and led chip working current source are connected to computing machine; Computing machine connects capture card/thermometric LED unit testing current source and voltage and current collecting unit.
2. application rights requires 1 described device to carry out the method for testing of LED light fixture thermal resistance, it is characterized in that:
During measurement, the thermometric LED unit block that the LED light fixture is isolated is linked into respectively thermometric LED unit block working power switch, thermometric LED unit testing current source, capture card and the voltage and current collecting unit in the tester, tested LED light fixture is accessed tested LED light fixture working power switch, and link the LED lamp power, with thermometric LED unit block working power access thermometric LED unit block working power switch, LED power source switch for lamp set and thermometric LED unit block working power switch access computing machine are subjected to computer control synchronously;
After starting process of measurement, computing machine sends instruction thermometric LED unit testing current source is loaded into thermometric LED unit block always, through capture card, collects the thermometric LED unit block both end voltage V that does not apply this moment under the working current
0
Then, computing machine sends instruction thermometric LED unit block working power is loaded into thermometric LED unit block through thermometric LED unit block working power switch, simultaneously the LED lamp power is loaded into tested LED light fixture through tested LED light fixture working power switch; The computing machine voltage and current collecting unit that sends instructions collects operating voltage and the electric current of thermometric LED unit block, and calculates the operating power P=VI that gathers thermometric LED unit block;
Treating that tested LED lamp temperatures no longer changes reaches stable state, and computing machine sends instruction, turn-offs simultaneously thermometric LED unit block working power and lamp power, and the triggering collection card gathers the voltage temporal evolution V (t) on the tested LED unit block;
The temperature coefficient of thermometric LED unit block is α, LED unit block temperature rise temporal evolution Δ T (t)=[V (t)-V
0]/α, power P=VI that thermometric LED unit block when work loads, tester calculates Δ T (t) curve, and the thermal resistance that the draws the LED unit block namely thermal resistance of tested LED light fixture consists of.
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| CN103293183A (en) * | 2013-05-15 | 2013-09-11 | 苏州大学 | Novel method for extracting heat capacity and thermal time constant of light-emitting diode (LED) system |
| CN103454568A (en) * | 2013-09-03 | 2013-12-18 | 南京华鼎电子有限公司 | Method for monitoring running state of LED illuminating lamp through temperature measurement |
| CN103605085A (en) * | 2013-10-31 | 2014-02-26 | 桂林机床电器有限公司 | LED thermal characteristic test method based on structure function |
| CN103630851A (en) * | 2013-12-09 | 2014-03-12 | 天津工大瑞工光电技术研究院有限公司 | Method and system for measuring entire thermal resistance of LED (light emitting diode) radiating module |
| CN103926517A (en) * | 2014-04-24 | 2014-07-16 | 重庆大学 | Device and method for testing thermal resistance of power type LED |
| CN104391004A (en) * | 2014-11-27 | 2015-03-04 | 陕西科技大学 | Device and method for testing heat radiation performance of lossless lamp |
| CN104407280A (en) * | 2014-12-01 | 2015-03-11 | 苏州立瓷电子技术有限公司 | Thermal resistance measuring method of LED lamp |
| CN104470114A (en) * | 2014-12-01 | 2015-03-25 | 苏州立瓷电子技术有限公司 | Power supply circuit of LED lamp thermal resistance measurement system |
| CN104569049A (en) * | 2015-02-13 | 2015-04-29 | 重庆大学 | Method for rapidly assessing heat dissipation performance of solid crystal layer of non-cold-plate high-power LED (light-emitting diode) device |
| CN105241921A (en) * | 2015-11-07 | 2016-01-13 | 北京工业大学 | Method and device for nondestructive measurement of heat resistance of travelling wave tube |
| RU2624406C1 (en) * | 2016-03-29 | 2017-07-03 | Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук | Method of measuring the thermal impedance of leds |
| CN107490736A (en) * | 2017-08-07 | 2017-12-19 | 北京工业大学 | The method and device that a kind of nondestructive measurement electronic functional module internal temperature and thermal resistance are formed |
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| CN109813751A (en) * | 2019-02-01 | 2019-05-28 | 山东开元电子有限公司 | LED street lamp radiator thermo-resistance measurement heating module |
| CN112285518A (en) * | 2020-10-12 | 2021-01-29 | 深圳康佳电子科技有限公司 | Simulation test method and system for thermal resistance of LED in module |
| RU2772930C1 (en) * | 2021-08-06 | 2022-05-27 | Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук | Method for measuring the thermal resistance of the junction-to-body led |
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| CN103293183A (en) * | 2013-05-15 | 2013-09-11 | 苏州大学 | Novel method for extracting heat capacity and thermal time constant of light-emitting diode (LED) system |
| CN103293183B (en) * | 2013-05-15 | 2016-08-03 | 苏州大学 | A kind of method extracting LED information display system thermal capacitance and thermal time constant |
| CN103454568B (en) * | 2013-09-03 | 2015-09-09 | 南京华鼎电子有限公司 | A kind of method by temperature survey monitoring LED illumination lamp running status |
| CN103454568A (en) * | 2013-09-03 | 2013-12-18 | 南京华鼎电子有限公司 | Method for monitoring running state of LED illuminating lamp through temperature measurement |
| CN103605085A (en) * | 2013-10-31 | 2014-02-26 | 桂林机床电器有限公司 | LED thermal characteristic test method based on structure function |
| CN103630851A (en) * | 2013-12-09 | 2014-03-12 | 天津工大瑞工光电技术研究院有限公司 | Method and system for measuring entire thermal resistance of LED (light emitting diode) radiating module |
| CN103630851B (en) * | 2013-12-09 | 2015-12-30 | 天津工大瑞工光电技术研究院有限公司 | A kind of LED radiating module entire thermal resistance measuring method and measuring system |
| CN103926517A (en) * | 2014-04-24 | 2014-07-16 | 重庆大学 | Device and method for testing thermal resistance of power type LED |
| CN103926517B (en) * | 2014-04-24 | 2016-08-17 | 重庆大学 | The test device and method of power type LED thermal resistance |
| CN104391004A (en) * | 2014-11-27 | 2015-03-04 | 陕西科技大学 | Device and method for testing heat radiation performance of lossless lamp |
| CN104470114A (en) * | 2014-12-01 | 2015-03-25 | 苏州立瓷电子技术有限公司 | Power supply circuit of LED lamp thermal resistance measurement system |
| CN104407280A (en) * | 2014-12-01 | 2015-03-11 | 苏州立瓷电子技术有限公司 | Thermal resistance measuring method of LED lamp |
| CN104569049A (en) * | 2015-02-13 | 2015-04-29 | 重庆大学 | Method for rapidly assessing heat dissipation performance of solid crystal layer of non-cold-plate high-power LED (light-emitting diode) device |
| CN104569049B (en) * | 2015-02-13 | 2017-03-08 | 重庆大学 | A kind of high power LED device die bond layer heat dispersion fast evaluation method of no cold drawing |
| CN105241921A (en) * | 2015-11-07 | 2016-01-13 | 北京工业大学 | Method and device for nondestructive measurement of heat resistance of travelling wave tube |
| CN105241921B (en) * | 2015-11-07 | 2018-09-04 | 北京工业大学 | A kind of method and device of nondestructive measurement travelling-wave tubes thermal resistance |
| RU2624406C1 (en) * | 2016-03-29 | 2017-07-03 | Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук | Method of measuring the thermal impedance of leds |
| CN107490736A (en) * | 2017-08-07 | 2017-12-19 | 北京工业大学 | The method and device that a kind of nondestructive measurement electronic functional module internal temperature and thermal resistance are formed |
| CN109541428A (en) * | 2018-12-18 | 2019-03-29 | 北京工业大学 | A kind of be shorted using source and drain reduces the self-oscillatory method and apparatus of HEMT thermal resistance measurement |
| CN109813751A (en) * | 2019-02-01 | 2019-05-28 | 山东开元电子有限公司 | LED street lamp radiator thermo-resistance measurement heating module |
| CN112285518A (en) * | 2020-10-12 | 2021-01-29 | 深圳康佳电子科技有限公司 | Simulation test method and system for thermal resistance of LED in module |
| RU2772930C1 (en) * | 2021-08-06 | 2022-05-27 | Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук | Method for measuring the thermal resistance of the junction-to-body led |
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