JPS54151375A - Inspection method for semiconductor device - Google Patents
Inspection method for semiconductor deviceInfo
- Publication number
- JPS54151375A JPS54151375A JP6027578A JP6027578A JPS54151375A JP S54151375 A JPS54151375 A JP S54151375A JP 6027578 A JP6027578 A JP 6027578A JP 6027578 A JP6027578 A JP 6027578A JP S54151375 A JPS54151375 A JP S54151375A
- Authority
- JP
- Japan
- Prior art keywords
- distribution
- symmetrical
- temperature rise
- heat sink
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
PURPOSE: To simplify the inspection of device causing time aging variation, by discriminating the device as non-defective device when the distribution is symmetrical through the observation of temperature rise at every part, in inspecting the semiconductor device pressure-welding the both ends of the semiconductor chip with power applicatiin.
CONSTITUTION: The forward current corresponding to the rated permissible loss is flowed to the double heat sink diode in which the semiconductor chip 1 is pressure- welded to the heat sinks 3 and 4, and the surface temperature rise of the glass seal part 5 is measured by using an infrared ray thermometer. The temperature rise distribution thus obtained is observed, and it is discriminated that the chip 1 and the heat sink 3 and the bump 2 and the heat sink 4 are in perfect connection when this distribution is symmetrical. If the contact is incomplete, the distribution is not symmetrical. Accordingly, the judgement is simplified to enable shipment of non- defective devices.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6027578A JPS54151375A (en) | 1978-05-19 | 1978-05-19 | Inspection method for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6027578A JPS54151375A (en) | 1978-05-19 | 1978-05-19 | Inspection method for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54151375A true JPS54151375A (en) | 1979-11-28 |
Family
ID=13137417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6027578A Pending JPS54151375A (en) | 1978-05-19 | 1978-05-19 | Inspection method for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54151375A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103076551A (en) * | 2013-01-01 | 2013-05-01 | 北京工业大学 | Thermal resistance composition test device and method for LED (light emitting diode) lamp |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5337385A (en) * | 1976-09-20 | 1978-04-06 | Hitachi Ltd | Inspecting method of arrayed devices |
-
1978
- 1978-05-19 JP JP6027578A patent/JPS54151375A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5337385A (en) * | 1976-09-20 | 1978-04-06 | Hitachi Ltd | Inspecting method of arrayed devices |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103076551A (en) * | 2013-01-01 | 2013-05-01 | 北京工业大学 | Thermal resistance composition test device and method for LED (light emitting diode) lamp |
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