CN112285518A - Simulation test method and system for thermal resistance of LED in module - Google Patents
Simulation test method and system for thermal resistance of LED in module Download PDFInfo
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Abstract
The invention provides a method and a system for simulating and testing thermal resistance of an LED in a module, which comprises the following steps: detecting the actual working current of the module, the actual welding leg temperature of the target LED and the actual environment temperature of the target LED; intercepting the target LED and the PCB where the target LED is positioned, and putting the target LED and the PCB into thermal resistance testing equipment; setting the temperature of the thermal resistance testing equipment to be consistent with the actual environment temperature, and setting the testing current of the thermal resistance testing equipment to be consistent with the actual working current; when the temperature of the thermal resistance testing equipment is stable, detecting the current leg temperature of the target LED; and when the current welding leg temperature is consistent with the actual welding leg temperature, controlling the thermal resistance testing equipment to test the thermal resistance of the target LED. The thermal resistance of the target LED under the condition is tested by utilizing the equivalence of the temperature of the welding leg and the ambient temperature.
Description
Technical Field
The invention relates to the technical field of LED performance testing, in particular to a method and a system for simulating and testing LED thermal resistance in a module.
Background
With the development of scientific technology and the increasing shortage of energy, the research of semiconductor lighting has been greatly improved, and semiconductor products have many advantages and development potentials of low power consumption, long service life, short response time and the like, and have shown the trend of gradually replacing traditional lighting products. The LED is a key device in semiconductor illumination, and as the power is larger and larger, the dissipated power of the high-power LED can cause the junction temperature of a PN junction of an LED chip to rise, so that the luminosity, the chromaticity and the electrical parameters of the LED are obviously influenced, and even the device can be failed. Therefore, in the application of the complete machine and the module of the LED, such as a television module, the LED with low thermal resistance and low junction temperature is preferably considered. Meanwhile, a manufacturer of the whole module not only focuses on measuring the thermal resistance and junction temperature of a single LED, but also focuses on the real thermal resistance of the LED of the inner light bar in the whole or module state, so that powerful support is provided for the reliability design of the module.
The traditional method for testing the thermal resistance of the LED is to use a T3ster device, place the LED in a thermostatic bath, calculate the coefficient of a thermosensitive parameter K by adjusting the voltage obtained by testing at different temperatures, then increase and decrease the temperature to obtain a cooling curve, perform a structural function on the cooling curve through the T3ster device, and then obtain the thermal resistance of the LED by differentiating the structural function and integrating the structural function.
However, the testing method can only test the thermal resistance of a single LED, and because the television module cannot be placed in a T3ster thermostatic bath, and meanwhile, the temperature cannot be rapidly increased and decreased to obtain a temperature reduction curve, the thermal resistance of the LED in the module state cannot be tested.
Therefore, the prior art has defects and needs to be improved and developed.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a method and a system for simulating and testing thermal resistance of an LED in a module, aiming at solving the problem that the thermal resistance of the LED in the module state cannot be tested when the thermal resistance of the LED is measured in the prior art.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a simulation test method for thermal resistance of an LED in a module comprises the following steps:
detecting the actual working current of the module, the actual welding leg temperature of the target LED and the actual environment temperature of the target LED;
intercepting the target LED and the PCB where the target LED is positioned, and putting the target LED and the PCB into thermal resistance testing equipment;
setting the temperature of the thermal resistance testing equipment to be consistent with the actual environment temperature, and setting the testing current of the thermal resistance testing equipment to be consistent with the actual working current;
when the temperature of the thermal resistance testing equipment is stable, detecting the current leg temperature of the target LED;
and when the current welding leg temperature is consistent with the actual welding leg temperature, controlling the thermal resistance testing equipment to test the thermal resistance of the target LED.
Further, the step of detecting the actual working current of the module, the actual leg temperature of the target LED and the actual ambient temperature where the target LED is located specifically includes:
detecting the actual working current of the module;
after the module is stewed for a preset time, detecting the actual leg temperature of the LED in the module, and determining a target LED with the highest actual leg temperature;
and detecting the actual ambient temperature of the target LED.
Further, the step of intercepting the target LED and the PCB where the target LED is located, and placing the target LED and the PCB into thermal resistance testing equipment specifically includes:
intercepting a target LED and a PCB where the target LED is located according to a standard size range, and recording the size parameters of the PCB;
and putting the target LED and the PCB into thermal resistance testing equipment.
Further, when the temperature of the thermal resistance testing device is stable, the step of detecting the current leg temperature of the target LED specifically includes:
when the temperature of the thermal resistance testing equipment is stable, recording the current leg temperature of the target LED;
if current leg temperature with actual leg temperature is inconsistent, then the adjustment the size of PCB board, until current leg temperature with actual leg temperature is consistent.
Further, if the current leg temperature is inconsistent with the actual leg temperature, adjusting the size of the PCB panel until the step of the current leg temperature being consistent with the actual leg temperature specifically includes:
if the current leg temperature is inconsistent with the actual leg temperature, judging the magnitude relation between the current leg temperature and the actual leg temperature;
if current leg temperature is less than actual leg temperature, then reduce the size of PCB board, until current leg temperature with actual leg temperature is unanimous.
Further, if the current fillet temperature is inconsistent with the actual fillet temperature, the step of determining the magnitude relationship between the current fillet temperature and the actual fillet temperature further includes:
if current leg temperature is greater than actual leg temperature, then increase the size of PCB board, until current leg temperature with actual leg temperature is unanimous.
Further, when the current fillet temperature is consistent with the actual fillet temperature, the step of controlling the thermal resistance testing device to test the thermal resistance of the target LED specifically includes:
when the current leg temperature is consistent with the actual leg temperature, controlling thermal resistance testing equipment to test the K coefficient and the cooling curve of the target LED under the final PCB size;
and extracting a structure function from the cooling curve, carrying out an integral structure and a differential structure, and automatically analyzing the thermal resistance of the target LED from the structure function.
Further, when the current fillet temperature is consistent with the actual fillet temperature, the step of controlling the thermal resistance testing device to test the thermal resistance of the target LED further includes:
testing the thermal resistance of the target LED to obtain the thermal resistance value of the target LED;
and comparing the thermal resistance value of the target LED with the standard thermal resistance value range to obtain a comparison result.
Further, after testing the thermal resistance of the target LED, the step of obtaining the thermal resistance value of the target LED further includes:
calculating the theoretical thermal resistance value of the target LED by utilizing a known theoretical calculation formula according to the actual working current, the actual welding leg temperature of the target LED and the actual environment temperature of the target LED;
and comparing the thermal resistance value of the target LED with the theoretical thermal resistance value.
The invention also provides a system for simulating and testing the thermal resistance of the LED in the module, wherein the system comprises:
the current tester is used for detecting the actual working current of the module after being connected with the module;
the temperature tester is used for being connected with the PCB where the LEDs in the module are located and detecting the actual welding leg temperature of the target LED and the actual environment temperature where the target LED is located;
and the thermal resistance testing equipment is connected with the temperature tester and is used for placing the intercepted target LED and the PCB where the target LED is positioned, and testing the thermal resistance of the target LED when the temperature is the actual environment temperature, the current is the actual working current, and the current welding leg temperature is consistent with the actual welding leg temperature.
The invention provides a method and a system for simulating and testing thermal resistance of an LED in a module, which comprises the following steps: detecting the actual working current of the module, the actual welding leg temperature of the target LED and the actual environment temperature of the target LED; intercepting the target LED and the PCB where the target LED is positioned, and putting the target LED and the PCB into thermal resistance testing equipment; setting the temperature of the thermal resistance testing equipment to be consistent with the actual environment temperature, and setting the testing current of the thermal resistance testing equipment to be consistent with the actual working current; when the temperature of the thermal resistance testing equipment is stable, detecting the current leg temperature of the target LED; and when the current welding leg temperature is consistent with the actual welding leg temperature, controlling the thermal resistance testing equipment to test the thermal resistance of the target LED. The invention utilizes the equivalence of the temperature of the welding leg and the ambient temperature to ensure that the actual ambient temperature and the actual temperature of the target LED welding leg are the same as the ambient temperature and the temperature of the welding leg in the thermal resistance testing equipment under the module state, thereby testing the thermal resistance of the target LED.
Drawings
FIG. 1 is a flow chart of a method for simulating and testing thermal resistance of an LED in a module according to a preferred embodiment of the present invention.
FIG. 2 is a schematic diagram of the connection of LEDs in a module according to the present invention.
FIG. 3 is a schematic structural diagram of a target LED in a thermostatic bath in a preferred embodiment of the simulation test method for thermal resistance of an LED in a module according to the present invention.
FIG. 4 is a diagram of the transient temperature curves corresponding to the L1 and L2 sizes obtained from the K factor and the condensation curve in the preferred embodiment of the method for simulating and testing the thermal resistance of the LED in the module of the present invention.
FIG. 5 is a diagram showing the thermal resistance corresponding to the dimensions of L1 and L2 obtained by substituting a structure function in the preferred embodiment of the method for simulating and testing the thermal resistance of the LED in the module of the present invention.
FIG. 6 is a functional block diagram of a preferred embodiment of a thermal resistance simulation test system for LEDs in a module according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
At present, a common Method for measuring the thermal resistance of the LED in the industry is an electrical parameter Method, T3Ster equipment is used, and the T3Ster is based on an advanced JEDEC 'Static Method' test Method (JESD51-1), so that the temperature of the device is changed by changing the input power of an electronic device, but the equipment can only measure the thermal resistance of the LED of a small module with the dimension within 30MM, and cannot measure the thermal resistance of the LED in the state of a complete machine or a module. That is to say, no test module or no thermal resistance test method of the internal light bar LED in the complete machine state exists in the industry at present, the test method adopted by the invention is based on the principle of an electrical parameter method, and meanwhile, the thermal resistance of the module or the internal light bar LED in the complete machine can be truly simulated by using an equivalent method of 'welding leg temperature, environment temperature' and the like, so that the thermal resistance test method has better scientific research reference value and higher practical value.
Referring to fig. 1, fig. 1 is a flow chart of a method for simulating and testing thermal resistance of an LED in a module according to the present invention. As shown in fig. 1, the method for simulating and testing the thermal resistance of the LED in the module according to the embodiment of the present invention includes the following steps:
s100, detecting the actual working current of the module, the actual welding leg temperature of the target LED and the actual environment temperature of the target LED.
In one implementation, the step S100 specifically includes:
and S110, detecting the actual working current of the module.
Specifically, a current tester is provided, the current tester is connected to the module through a connecting line, and the current tester is used for testing the actual working current IF of the module.
And S120, detecting the actual welding leg temperature of the LED in the module after the module cooker is heated for a preset time, and determining the target LED with the highest actual welding leg temperature.
Specifically, provide temperature tester, pass through the connecting wire with temperature tester and connect on the inside LED lamp strip of module. The LED with the highest temperature rise in the module is selected as the target LED. Generally, during selection, since a developer performs a temperature test on the internal LED after the module is produced, the developer can directly know the LED with the highest temperature rise in the module. Of course, after the machine is stewed for a preset time, the connecting wire of the temperature tester can be connected to the welding feet of the LEDs, so that the temperature of the welding feet of the LEDs is tested, and the LED with the highest temperature of the welding feet is selected as the target LED.
The most temperature-rising LED is typically located close to the power board. In addition, the actual fillet temperature Tc1 of the highest temperature-rising target LED can be tested after 2 hours of the pot machine.
And S130, detecting the actual environment temperature of the target LED.
Specifically, as shown in fig. 2, probe 1 tests the actual fillet temperature of the target LED41, and probe 2 is placed near the target LED41, testing the ambient temperature Ta1 at which the target LED41 is located in the module.
The step S100 is followed by: s200, intercepting the target LED and the PCB where the target LED is located, and placing the target LED and the PCB into thermal resistance testing equipment.
In one implementation, the step S200 specifically includes:
s210, intercepting a target LED and a PCB where the target LED is located according to a standard size range, and recording size parameters of the PCB;
s220, placing the target LED and the PCB into thermal resistance testing equipment.
Specifically, the thermal resistance testing device is a T3ster thermal resistance tester and is provided with a thermostatic bath. The PCB board of the target LED is cut off, and the length is recorded as L1, but the width of the PCB board may be recorded. The standard size range refers to an empirical value range so as to improve the accuracy of interception and improve the testing efficiency. The lead wires including the connecting wires for testing temperature rise and thermal resistance are soldered by digging holes on the copper foil of the PCB board, and as shown in FIG. 3, the target LED41 and the PCB board 42 are placed in the thermostatic bath 31 of the T3ster thermal resistance tester.
The step S200 is followed by: s300, setting the temperature of the thermal resistance testing equipment to be consistent with the actual environment temperature, and setting the testing current of the thermal resistance testing equipment to be consistent with the actual working current.
Specifically, the temperature of the thermostatic bath of the thermal resistance test apparatus was set to Ta2, and Ta1 was made Ta 2; at the same time, the test current is set to IF. After the temperature stabilized, the target LED temperature rise at this time of length L1 was recorded as Tc 2.
The step S300 is followed by: s400, when the temperature of the thermal resistance testing equipment is stable, the current welding leg temperature of the target LED is detected.
In one implementation, the step S400 specifically includes:
s410, recording the current leg temperature of the target LED when the temperature of the thermal resistance testing equipment is stable;
s420, if the current welding leg temperature is inconsistent with the actual welding leg temperature, adjusting the size of the PCB until the current welding leg temperature is consistent with the actual welding leg temperature.
That is, the present invention utilizes the equivalence of "leg temperature, ambient temperature", and by designing the corresponding PCB specification, the leg temperature and the ambient temperature of the target LED measured by the T3ster thermal resistance tester are equivalent to the LED leg and the ambient temperature in the real module or the complete machine state, and the thermal resistance measured by the target LED is equivalent to the LED thermal resistance in the module or the complete machine state. The tested target LED module and the whole machine/module original light bar LED have the same environmental temperature, LED specification, heat dissipation material, driving current and the same welding leg temperature, so that the thermal resistance of the target LED is equivalent to that of the original light bar LED in the original whole machine/module.
Further, step S420 specifically further includes:
s421, if the current leg temperature is inconsistent with the actual leg temperature, judging the magnitude relation between the current leg temperature and the actual leg temperature;
s422a, if the current solder leg temperature is less than the actual solder leg temperature, reducing the size of the PCB until the current solder leg temperature is consistent with the actual solder leg temperature.
That is, if Tc1 is larger than Tc2, the PCB continues to be downsized until Tc1 becomes Tc 2. And shrinking the PCB, namely, continuously cutting off the PCB. Generally, according to the empirical value, the PCB is firstly cut into a size slightly larger than the empirical value, so as to facilitate subsequent cutting, so as to prevent the size of the PCB from being too small.
Further, the step S421 further includes:
s422b, if the current solder leg temperature is greater than the actual solder leg temperature, increasing the size of the PCB until the current solder leg temperature is consistent with the actual solder leg temperature.
That is, if Tc1 < Tc2, the size of the PCB panel is increased until Tc1 becomes Tc 2. The way of increasing the size of the PCB board is generally to replace the target LED and the PCB board with a large-sized PCB board with the same material and other parameters.
The step S400 is followed by: s500, when the current welding leg temperature is consistent with the actual welding leg temperature, controlling the thermal resistance testing equipment to test the thermal resistance of the target LED.
In one implementation, the step S500 specifically includes:
s510, when the current leg temperature is consistent with the actual leg temperature, controlling thermal resistance testing equipment to test the K coefficient and the cooling curve of the target LED under the final PCB size;
s520, extracting a structure function from the cooling curve, carrying out an integral structure and a differential structure, and automatically analyzing the thermal resistance of the target LED from the structure function.
That is, after Ta1 ═ Ta2 and Tc1 ═ Tc2 are satisfied, the K coefficient and the cooling curve of the target LED at the PCB length (L2) are tested, and then the structure function is extracted from the cooling curve, and the integral structure and the differential structure are performed, so that the thermal resistance of the LED is automatically analyzed from the structure function, as shown in fig. 4 and 5.
Specifically, the process of testing the thermal resistance of the LED by the T3ster thermal resistance tester comprises the following steps: placing a sample, testing the voltage (a linear curve is a K coefficient) at different temperatures, testing a cooling curve, a curve structure function, and obtaining a curve by integration and differentiation, and obtaining the thermal resistance at different positions from the curve. Wherein, the K coefficient means that under the condition of small current, the voltage and the temperature are in a linear relation, and the linear relation formula is as follows: k ═ Δ T/Δ V, Rth ═ Δ T/P ═ K ═ Δ V)/P. The cooling curve means that under small current, the LED PN junction hardly generates heat, and the voltage is high; at high currents, the LED PN temperature is approximately equal to Tj. The structural function refers to a special calculation theory of the T3ster thermal resistance tester, and the thermal resistance of different layers of the LED can be obtained by analyzing the structural function. The integral and differential curves are converted into more visual curves, so that the thermal resistance of each layer can be conveniently confirmed. The process of testing the thermal resistance of the LED by the T3ster thermal resistance tester is the prior art and is not described herein again.
In one implementation, the step S500 is followed by:
s610, testing the thermal resistance of the target LED to obtain the thermal resistance value of the target LED;
s620, comparing the thermal resistance value of the target LED with the standard thermal resistance value range to obtain a comparison result.
That is, the thermal resistance of the target LED is tested, that is, the thermal resistance of the LED in the state of the module (such as a TV module) is simulated, the module has a standard thermal resistance value range, and the thermal resistance value of the target LED is compared with the standard thermal resistance value range to obtain a comparison result, thereby determining whether the distribution of the heat of the LED meets the range requirement.
In a further implementation manner, the step S500 is followed by:
s710, calculating a theoretical thermal resistance value of the target LED by utilizing a known theoretical calculation formula according to the actual working current, the actual welding leg temperature of the target LED and the actual environment temperature of the target LED;
s720, comparing the thermal resistance value of the target LED with the theoretical thermal resistance value.
Specifically, the theoretical calculation formula is: rth ═ t j-Tc)/P;
wherein, Tj is the junction temperature of the LED to be tested when the temperature is stable, namely the temperature of the chip in the LED; tc is the temperature of the leg in a stable environment; p is the dissipation power of the LED to be tested on the heat conduction channel; rth is the thermal resistance between the P-N junction of the LED to be measured and a specified reference point (point C). In addition, the value of Tj is derived during the testing of Rth.
According to the method, the thermal resistance of the LED is basically consistent with that of the LED calculated by the theoretical calculation formula after the test and verification are carried out in the television modules of 32 inches, 43 inches, 50 inches, 55 inches and 65 inches according to the method, so that the thermal resistance of the LED in the state of the television TV module can be simulated by the test method, and whether the design requirements are met or not can be confirmed.
That is, the traditional LED thermal resistance test needs to be fixed in a T3ster thermostatic bath, and a cooling curve needs to be tested, so that the thermal resistance of an LED in a module state cannot be tested, the invention realizes that the ambient temperature Ta1 and the LED soldering temperature Tc1 in the module state are the same as the ambient temperature Ta2 and the LED soldering temperature Tc2 in the T3ster thermostatic bath by changing the PCB size of the LED by utilizing the equivalence of the soldering temperature and the ambient temperature, and simulates the thermal resistance of a light bar LED in the module, so as to confirm whether the heat distribution of the LED meets the requirements, whether the design is standard or not, and improve the accuracy, the scientificity and the reliability of the LED service life evaluation method of the whole module.
The invention also discloses a system for simulating and testing the thermal resistance of the LED in the module, please refer to FIG. 6, which includes:
the current tester 10 is used for detecting the actual working current of the module 40 after being connected with the module 40; as particularly described above;
the temperature tester 20 is used for being connected with a PCB where the LEDs in the module 40 are located and detecting the actual welding leg temperature of the target LED41 and the actual environment temperature of the target LED 41; as particularly described above;
the thermal resistance testing device 30 is connected with the temperature tester 20, and the thermal resistance testing device 30 is used for placing the PCB where the intercepted target LED41 and the intercepted target LED41 are located, and testing the thermal resistance of the target LED41 when the temperature is the actual environment temperature, the current is the actual working current, and the current leg temperature is consistent with the actual leg temperature; as described above.
In summary, the present invention discloses a method and a system for simulation test of thermal resistance of an LED in a module, including: detecting the actual working current of the module, the actual welding leg temperature of the target LED and the actual environment temperature of the target LED; intercepting the target LED and the PCB where the target LED is positioned, and putting the target LED and the PCB into thermal resistance testing equipment; setting the temperature of the thermal resistance testing equipment to be consistent with the actual environment temperature, and setting the testing current of the thermal resistance testing equipment to be consistent with the actual working current; when the temperature of the thermal resistance testing equipment is stable, detecting the current leg temperature of the target LED; and when the current welding leg temperature is consistent with the actual welding leg temperature, controlling the thermal resistance testing equipment to test the thermal resistance of the target LED. The invention utilizes the equivalence of the temperature of the welding leg and the ambient temperature to ensure that the actual ambient temperature and the actual temperature of the target LED welding leg are the same as the ambient temperature and the temperature of the welding leg in the thermal resistance testing equipment under the module state, thereby testing the thermal resistance of the target LED.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. A simulation test method for thermal resistance of an LED in a module is characterized by comprising the following steps:
detecting the actual working current of the module, the actual welding leg temperature of the target LED and the actual environment temperature of the target LED;
intercepting the target LED and the PCB where the target LED is positioned, and putting the target LED and the PCB into thermal resistance testing equipment;
setting the temperature of the thermal resistance testing equipment to be consistent with the actual environment temperature, and setting the testing current of the thermal resistance testing equipment to be consistent with the actual working current;
when the temperature of the thermal resistance testing equipment is stable, detecting the current leg temperature of the target LED;
and when the current welding leg temperature is consistent with the actual welding leg temperature, controlling the thermal resistance testing equipment to test the thermal resistance of the target LED.
2. The method for simulating and testing the thermal resistance of the LED in the module as claimed in claim 1, wherein the steps of detecting the actual working current of the module, the actual leg temperature of the target LED and the actual environment temperature of the target LED specifically comprise:
detecting the actual working current of the module;
after the module is stewed for a preset time, detecting the actual leg temperature of the LED in the module, and determining a target LED with the highest actual leg temperature;
and detecting the actual ambient temperature of the target LED.
3. The method for simulating and testing the thermal resistance of the LED in the module according to claim 1, wherein the step of intercepting the target LED and the PCB where the target LED is located and placing the target LED and the PCB into thermal resistance testing equipment specifically comprises the following steps:
intercepting a target LED and a PCB where the target LED is located according to a standard size range, and recording the size parameters of the PCB;
and putting the target LED and the PCB into thermal resistance testing equipment.
4. The method for simulating and testing the thermal resistance of the LED in the module according to claim 1, wherein the step of detecting the current leg temperature of the target LED when the temperature of the thermal resistance testing equipment is stable specifically comprises the following steps:
when the temperature of the thermal resistance testing equipment is stable, recording the current leg temperature of the target LED;
if current leg temperature with actual leg temperature is inconsistent, then the adjustment the size of PCB board, until current leg temperature with actual leg temperature is consistent.
5. The method for simulating and testing the thermal resistance of the LED in the module according to claim 4, wherein if the current fillet temperature is not consistent with the actual fillet temperature, the step of adjusting the size of the PCB until the current fillet temperature is consistent with the actual fillet temperature specifically comprises:
if the current leg temperature is inconsistent with the actual leg temperature, judging the magnitude relation between the current leg temperature and the actual leg temperature;
if current leg temperature is less than actual leg temperature, then reduce the size of PCB board, until current leg temperature with actual leg temperature is unanimous.
6. The method for simulating and testing the thermal resistance of the LED in the module set according to claim 5, wherein if the current fillet temperature is not consistent with the actual fillet temperature, the step of determining the magnitude relation between the current fillet temperature and the actual fillet temperature further comprises the following steps:
if current leg temperature is greater than actual leg temperature, then increase the size of PCB board, until current leg temperature with actual leg temperature is unanimous.
7. The method for simulating and testing the thermal resistance of the LED in the module according to claim 1, wherein when the current leg temperature is consistent with the actual leg temperature, the step of controlling the thermal resistance testing equipment to test the thermal resistance of the target LED specifically comprises the steps of:
when the current leg temperature is consistent with the actual leg temperature, controlling thermal resistance testing equipment to test the K coefficient and the cooling curve of the target LED under the final PCB size;
and extracting a structure function from the cooling curve, carrying out an integral structure and a differential structure, and automatically analyzing the thermal resistance of the target LED from the structure function.
8. The method for simulating and testing the thermal resistance of the LED in the module according to claim 1, wherein the step of controlling the thermal resistance testing equipment to test the thermal resistance of the target LED when the current leg temperature is consistent with the actual leg temperature further comprises the following steps:
testing the thermal resistance of the target LED to obtain the thermal resistance value of the target LED;
and comparing the thermal resistance value of the target LED with the standard thermal resistance value range to obtain a comparison result.
9. The method for simulating and testing the thermal resistance of the LED in the module according to claim 8, wherein after the step of testing the thermal resistance of the target LED, obtaining the thermal resistance value of the target LED further comprises:
calculating the theoretical thermal resistance value of the target LED by utilizing a known theoretical calculation formula according to the actual working current, the actual welding leg temperature of the target LED and the actual environment temperature of the target LED;
and comparing the thermal resistance value of the target LED with the theoretical thermal resistance value.
10. The utility model provides a LED thermal resistance simulation test system in module which characterized in that includes:
the current tester is used for detecting the actual working current of the module after being connected with the module;
the temperature tester is used for being connected with the PCB where the LEDs in the module are located and detecting the actual welding leg temperature of the target LED and the actual environment temperature where the target LED is located;
and the thermal resistance testing equipment is connected with the temperature tester and is used for placing the intercepted target LED and the PCB where the target LED is positioned, and testing the thermal resistance of the target LED when the temperature is the actual environment temperature, the current is the actual working current, and the current welding leg temperature is consistent with the actual welding leg temperature.
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