CN103926517A - Device and method for testing thermal resistance of power type LED - Google Patents

Device and method for testing thermal resistance of power type LED Download PDF

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CN103926517A
CN103926517A CN201410171198.XA CN201410171198A CN103926517A CN 103926517 A CN103926517 A CN 103926517A CN 201410171198 A CN201410171198 A CN 201410171198A CN 103926517 A CN103926517 A CN 103926517A
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power
type led
unit
optical parametric
optical
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CN103926517B (en
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刘显明
赖伟
陈伟民
程星福
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Shaoxing Manjia Intellectual Property Co ltd
Shenzhen Boshi Intellectual Property Operation Co ltd
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Chongqing University
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Abstract

The invention discloses a device for testing the thermal resistance of a power type LED. The device comprises the power type LED, a heating and cooling unit, a power source/testing unit, a temperature control unit, an optical parameter testing unit and a computer. The computer is used for controlling the power source/testing unit to output different currents to the power type LED and testing the corresponding electric power. The computer controls the temperature control unit to control the heating and cooling unit to generate different temperature values. The optical parameter testing unit is used for collecting optical parameters of the power type LED and the optical parameters are transmitted to the computer so that analytical calculation can be accomplished by the computer, The power source/testing unit is connected with the heating and cooling unit and used in cooperation with the computer for controlling the heating and cooling unit to generate different temperature values. A novel method for testing the thermal resistance of the power type LED obtains an efficiency-junction temperature coefficient ke, thermal power, an electric power conversion coefficient kh and the thermal resistance Rhs of an external radiator of the LED to obtain the thermal resistance value of the LED, testing cost is reduced, and operation is simple.

Description

The proving installation of power-type LED thermal resistance and method
Technical field
The invention belongs to photoelectricity test technical field, be specifically related to a kind of method of testing of measured power type LED thermal resistance.
Background technology
Power-type LED is the core devices of field of semiconductor illumination, but in the normal work of LED, having more than 70% electric energy conversion is heat energy, and LED chip junction temperature is significantly raise, have a strong impact on the photoelectric properties of LED, cause light output attenuatoin, life-span minimizing, reliability reduction etc.Therefore need the thermal characteristic parameters such as power-type LED thermal resistance to test quickly and accurately, for LED encapsulation and heat sink design provide design parameter and carry out effective heat management.
The method of measuring at present LED thermal characteristic both at home and abroad mainly contains infrared thermography, spectroscopic methodology, luminous power method, pin temperature method and electrical parameter method.Electrical parameter method is linear based on LED two ends forward voltage drop and junction temperature, and during by quick handover measurement electric current and heating current, the variation of measuring junction voltage obtains junction temperature, further calculates LED thermal resistance.The method does not need to destroy LED encapsulating structure, and measuring accuracy is high, speed is fast, is at present general standard method in the world.But major defect is that in current conversion process, thermal loss causes thermo-resistance measurement error larger, the variation that detects in addition forward voltage on PN junction needs very high-precision data acquisition instrument, is difficult to reduce R&D costs.
Summary of the invention
Given this, the object of this invention is to provide a kind of method and device of new measured power type LED thermal resistance, adopt the method and install the system cost that can effectively reduce power-type LED thermo-resistance measurement, and simple to operate, there is certain engineering using value.
One of object of the present invention is to realize by such technical scheme, and the heat resistance test apparatus of power-type LED comprises power-type LED, heating cooling unit, power supply/measuring unit, temperature control unit, optical parameter measurement unit and computing machine;
Described computing machine is exported different electric currents and is measured corresponding electric power to power-type LED for controlling power supply/measuring unit;
Described computing machine produces different temperature values by controlling temperature control unit control heating cooling unit;
Described optical parametric test cell is for gathering the optical parametric of power-type LED, and this optical parametric is transferred to computing machine completes analytical calculation by computing machine;
Described power supply/measuring unit is connected with heating cooling unit, produces different temperature values for coupled computer control heating cooling unit.
Further, described heating cooling unit comprises successively connect heat sink, semiconductor thermoelectric refrigeration sheet and heating radiator; Described power-type LED is arranged on heat sink upper, and described semiconductor thermoelectric refrigeration sheet is connected with temperature control unit.
Further, described optical parametric test cell is light collecting type parameter testing unit, described light collecting type optical parametric test cell comprises light collecting device and light spy device, and described power-type LED is arranged on the light inlet place of light collecting device, and described light detection device is arranged on the receipts light mouth place of light collecting device; Described light collecting device is integrating sphere, and described light detection device is luminosity probe or radiation probe.
Further, described optical parametric test cell is non-light collecting type parameter testing unit, and described non-light collecting type parameter testing unit comprises light detection device, and described light detection device is arranged on power-type LED optical axis; Described light detection device is luminosity probe or radiation probe.
The thermo-resistance measurement method of power-type LED, measure power-type LED optical parametric to electric power variation relation, wherein optical parametric is any one in the parameters such as total light flux, partial luminous flux, illuminance, luminous power, axial light power, axial light illumination, relative radiation intensity, and optical parametric-electric power curves is carried out to nonlinear least-square matching, obtain the electric power at optical parametric extreme value place; The functional relation of power-type LED thermal resistance and extreme value place electric power is formula (1), further obtains k e, k hand R hsthe value of three parameters, can obtain power-type LED thermal resistance R jc;
R jc = - 1 2 k e k h P d max - R hs - - - ( 1 )
In formula (1), P dmaxcorresponding electric power during for optical parametric extreme value, k efor efficiency-junction temperature coefficient, k hfor the conversion coefficient of thermal power and electric power, R jcfor the thermal resistance of power-type LED, R hsfor the thermal resistance of LED external heat sink and known.
Further, obtain P dmaxmethod comprise following sub-step:
S61: computer control power supply/measuring unit is exported different electric currents to power-type LED, utilizes power supply/measuring unit to record electrical power P under different Injection Currents d; Utilize optical parameter measurement unit to record optical parametric P simultaneously o, obtain relation curve P between the two o-P d;
S62: optical parametric P owith electrical power P dmeet formula (2) relation:
P O＝E p0[P d+k ek h(R jc+R hs)P d 2] (2)
As optical parametric P owhen extreme value, electrical power P dmaxcan be expressed as formula (3):
P d max = - 1 2 k e k h ( R jc + R hs ) - - - ( 3 )
Wherein E p0for environment temperature is T 0time optical parameter-electrical power efficiency, k efor efficiency-junction temperature coefficient, k hfor the conversion coefficient of thermal power and electric power, R jcfor the thermal resistance of power-type LED, R hsfor the thermal resistance of LED external heat sink;
S63: according to formula (2), to P o-P drelation curve carries out nonlinear least-square matching, obtains the electrical power P at optical parametric extreme value place dmax.
Further, obtain k hmethod comprise following sub-step:
S71: computer control power supply/measuring unit is exported rated operational current to power-type LED, utilizes power supply/measuring unit to record electrical power P under rated current d; Utilize optical parameter measurement unit to record luminous power P l, utilize formula (4) to obtain the conversion coefficient k of thermal power and electric power h;
k h = P d - P L P d - - - ( 4 )
Further, obtain k emethod comprise following sub-step:
S81: computer control power supply/measuring unit is exported suitable working current to power-type LED, does not produce obvious thermal effect but LED can be lighted; Utilize temperature control unit control heating cooling unit to produce different temperature values; Utilize power supply/measuring unit to measure electrical power P under different temperatures d; Utilize optical parameter measurement unit to record optical parameter value P simultaneously o, calculate optical parameter-electrical power efficiency E and junction temperature T jrelation curve E-T j;
S82: adopt the principle of least square to E-T jcurve data carries out linear fit, obtains the coefficient value k of efficiency and junction temperature e;
E＝E p0[1+k e(T j-T 0)] (5)
Wherein E is optical parameter-electrical power efficiency, E p0for environment temperature is T 0time optical parameter-electrical power efficiency.
Owing to having adopted technique scheme, the present invention has advantages of as follows:
1, use conventional measurement data to analyze, method is simple and workable, and data result is with a high credibility.
2, do not need high-precision special data acquisition instrument, only need conventional photoelectric measurement equipment, therefore required testing cost is low, is very suitable for the engineering application of enterprise.
Brief description of the drawings
In order to make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, the present invention is described in further detail, wherein:
Fig. 1 is proving installation theory diagram;
Fig. 2 is luminous flux-electric power and light efficiency-junction temperature test philosophy figure;
Fig. 3 is that luminous flux is with electric power change curve and matched curve figure;
Fig. 4 is light efficiency and variations injunction temperature curve and matched curve figure;
Wherein, 1, power-type LED; 2, heat sink; 3, semiconductor thermoelectric refrigeration sheet; 4, heating radiator; 5, heating cooling unit; 6, power supply/measuring unit; 7, temperature control unit; 8, integrating sphere; 9, luminosity probe or radiation probe; 10, optical parameter measurement unit; 11, computing machine.
Embodiment
Below with reference to accompanying drawing, the preferred embodiments of the present invention are described in detail; Should be appreciated that preferred embodiment is only for the present invention is described, instead of in order to limit the scope of the invention.
As shown in Figure 1, 2, the heat resistance test apparatus of power-type LED, comprises power-type LED 1, heating cooling unit 5, power supply/measuring unit 6, temperature control unit 7, optical parameter measurement unit 10 and computing machine 11;
Described computing machine is exported different electric currents and is measured corresponding electric power to power-type LED for controlling power supply/measuring unit;
Described computing machine produces different temperature values by controlling temperature control unit control heating cooling unit;
Described optical parametric test cell is for gathering the optical parametric of power-type LED, and this optical parametric is transferred to computing machine completes analytical calculation by computing machine; Wherein optical parametric comprises total light flux, partial luminous flux, illuminance, luminous power, axial light power, axial light illumination, relative radiation intensity etc., and optical parametric test cell 10 is for gathering the total light flux of power-type LED in the present embodiment.
Described power supply/measuring unit is connected with heating cooling unit, produces different temperature values for coupled computer control heating cooling unit.
Described heating cooling unit comprises successively connect heat sink 2, semiconductor thermoelectric refrigeration sheet 3 and heating radiator 4; Described power-type LED 1 is arranged on heat sink upper, and described semiconductor thermoelectric refrigeration sheet is connected with temperature control unit.
In the present embodiment, optical parameter test cell is light collecting type parameter testing unit, in the present embodiment, adopt integrating sphere 8 as light collecting device, adopt luminosity probe 9 (or radiation probe) to visit device as light, power-type LED is arranged on the light inlet place of integrating sphere, and luminosity probe (or radiation probe) is arranged on the receipts light mouth place of integrating sphere.
Certainly adopt non-light collecting type optical parametric test cell also can realize the collection to power-type LED optical parametric, in the time gathering non-light collecting type optical parametric test, only luminosity probe 9 (or radiation probe) need be arranged on power-type LED optical axis.
Use above-mentioned proving installation to carry out the method that power-type LED thermal resistance is tested, measure power-type LED optical parametric to electric power variation relation, optical parametric P obe chosen for total light flux Φ v, and total light flux-electric power curves is carried out to nonlinear least-square matching, obtain the electric power at total light flux extreme value place.The functional relation of power-type LED thermal resistance and extreme value place electric power is formula (1), further obtains k e, k hand R hsthe value of three parameters, can obtain power-type LED thermal resistance R jc;
R jc = - 1 2 k e k h P d max - R hs - - - ( 1 )
In formula (1), P dmaxcorresponding electric power during for optical parametric extreme value, k efor efficiency-junction temperature coefficient, k hfor the conversion coefficient of thermal power and electric power, R jcfor the thermal resistance of power-type LED, R hsfor the thermal resistance of LED external heat sink and known.
Obtain P dmaxmethod comprise following sub-step:
Computing machine 11 is controlled power supply/measuring unit (SMU) 6 and is exported different electric currents to power-type LED, utilizes SMU to record electrical power P under different Injection Currents d; Utilize optical parameter measurement unit to record total light flux Φ simultaneously v, obtain relation curve Φ between the two v-P d.
Luminous flux phi vwith electrical power P dmeet formula (2) funtcional relationship.
Φ v＝E p0[P d+k ek h(R jc+R hs)P d 2] (2)
As total light flux Φ vwhen extreme value, electrical power P dmaxcan be expressed as formula (3).
P d max = - 1 2 k e k h ( R jc + R hs ) - - - ( 3 )
Wherein E p0for environment temperature is T 0time total light flux-electrical power efficiency, k efor efficiency-junction temperature coefficient, k hfor the conversion coefficient of thermal power and electric power, R jcfor the thermal resistance of power-type LED, R hsfor the thermal resistance of LED external heat sink.
According to formula (2), to Φ v-P drelation curve carries out nonlinear least-square matching, obtains the electrical power P at total light flux extreme value place dmax, its luminous flux with electric power change curve as shown in Figure 3.
Obtain k hmethod comprise following sub-step:
Computing machine 11 is controlled power supply/measuring unit (SMU) 6 to power-type LED output rated operational current, utilizes SMU to record electrical power P under rated current d; Luminosity probe is replaced with to radiation probe, record luminous power P l, utilize formula (4) to obtain the conversion coefficient k of thermal power and electric power h.
k h = P d - P L P d - - - ( 4 )
Obtain k emethod comprise following sub-step:
Computing machine 11 is controlled power supply/measuring unit (SMU) 6 to power-type LED output 5mA working current.Utilize temperature control unit 7 to control heating cooling units 5 and produce the different temperatures values such as 40 DEG C, 50 DEG C, 60 DEG C, 70 DEG C, 80 DEG C.Utilize SMU to measure electrical power P under different temperatures d; Utilize optical parameter measurement unit to record total light flux Φ simultaneously v, calculate total light flux Φ v-electrical power efficiency E (total light flux/electric power) and junction temperature T jrelation curve E-T j.
Adopt the principle of least square to E-T jcurve data carries out linear fit, obtains the coefficient value k of efficiency and junction temperature e.
E＝E p0[1+k e(T j-T 0)] (5)
Its light efficiency and variations injunction temperature curve are as shown in Figure 4.
Utilizing formula (3) to obtain power-type LED thermal resistance is formula (6), by R hs, k h, k esubstitution, can calculate thermal resistance value.In this example, the power-type LED thermal resistance value recording is 9.2 (DEG C/W), and nominal thermal resistance value is 8 (DEG C/W).
R jc = - 1 2 k e k h P d max - R hs - - - ( 6 )
The present invention adopts a kind of method of new measured power type LED thermal resistance, and the method is by obtaining efficiency-junction temperature coefficient k e, the conversion coefficient k of thermal power and electric power h, and be the thermal resistance R of LED external heat sink hsthe thermal resistance value that obtains power-type LED, has reduced cost of testing system, and simple to operate, has certain engineering using value.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the present invention.Like this, if these amendments of the present invention and within modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.

Claims (8)

1. the heat resistance test apparatus of power-type LED, is characterized in that: comprise power-type LED, heating cooling unit, power supply/measuring unit, temperature control unit, optical parameter measurement unit and computing machine;
Described computing machine is exported different electric currents and is measured corresponding electric power to power-type LED for controlling power supply/measuring unit;
Described computing machine produces different temperature values by controlling temperature control unit control heating cooling unit;
Described optical parametric test cell is for gathering the optical parametric of power-type LED, and this optical parametric is transferred to computing machine completes analytical calculation by computing machine;
Described power supply/measuring unit is connected with heating cooling unit, produces different temperature values for coupled computer control heating cooling unit.
2. the heat resistance test apparatus of power-type LED according to claim 1, is characterized in that: described heating cooling unit comprises successively connect heat sink, semiconductor thermoelectric refrigeration sheet and heating radiator; Described power-type LED is arranged on heat sink upper, and described semiconductor thermoelectric refrigeration sheet is connected with temperature control unit.
3. power-type LED heat resistance test apparatus according to claim 1, it is characterized in that: described optical parametric test cell is light collecting type parameter testing unit, described light collecting type optical parametric test cell comprises light collecting device and light spy device, described power-type LED is arranged on the light inlet place of light collecting device, and described light detection device is arranged on the receipts light mouth place of light collecting device; Described light collecting device is integrating sphere, and described light detection device is luminosity probe or radiation probe.
4. power-type LED heat resistance test apparatus according to claim 1, it is characterized in that: described optical parametric test cell is non-light collecting type parameter testing unit, described non-light collecting type parameter testing unit comprises light detection device, and described light detection device is arranged on power-type LED optical axis; Described light detection device is luminosity probe or radiation probe.
5. the thermo-resistance measurement method of power-type LED, it is characterized in that: measure power-type LED optical parametric to electric power variation relation, wherein optical parametric is any one in the parameters such as total light flux, partial luminous flux, illuminance, luminous power, axial light power, axial light illumination, relative radiation intensity, and optical parametric-electric power curves is carried out to nonlinear least-square matching, obtain the electric power at optical parametric extreme value place; The functional relation of power-type LED thermal resistance and extreme value place electric power is formula (1), further obtains k e, k hand R hsthe value of three parameters, can obtain power-type LED thermal resistance R jc;
R jc = - 1 2 k e k h P d max - R hs - - - ( 1 )
In formula (1), P dmaxcorresponding electric power during for optical parametric extreme value, k efor efficiency-junction temperature coefficient, k hfor the conversion coefficient of thermal power and electric power, R jcfor the thermal resistance of power-type LED, R hsfor the thermal resistance of LED external heat sink and known.
6. the thermo-resistance measurement method of power-type LED according to claim 6, is characterized in that: obtain P dmaxmethod comprise following sub-step:
S61: computer control power supply/measuring unit is exported different electric currents to power-type LED, utilizes power supply/measuring unit to record electrical power P under different Injection Currents d; Utilize optical parameter measurement unit to record optical parametric P simultaneously o, obtain relation curve P between the two o-P d;
S62: optical parametric P owith electrical power P dmeet formula (2) relation:
P O＝E p0[P d+k ek h(R jc+R hs)P d 2] (2)
As optical parametric P owhen extreme value, electrical power P dmaxcan be expressed as formula (3):
P d max = - 1 2 k e k h ( R jc + R hs ) - - - ( 3 )
Wherein E p0for environment temperature is T 0time optical parameter-electrical power efficiency, k efor efficiency-junction temperature coefficient, k hfor the conversion coefficient of thermal power and electric power, R jcfor the thermal resistance of power-type LED, R hsfor the thermal resistance of LED external heat sink; S63: according to formula (2), to P o-P drelation curve carries out nonlinear least-square matching, obtains the electrical power P at optical parametric extreme value place dmax.
7. the thermo-resistance measurement method of power-type LED according to claim 6, is characterized in that: obtain k hmethod comprise following sub-step:
S71: computer control power supply/measuring unit is exported rated operational current to power-type LED, utilizes power supply/measuring unit to record electrical power P under rated current d; Utilize optical parameter measurement unit to record luminous power P l, utilize formula (4) to obtain the conversion coefficient k of thermal power and electric power h;
k h = P d - P L P d - - - ( 4 ) .
8. the thermo-resistance measurement method of power-type LED according to claim 6, is characterized in that: obtain k emethod comprise following sub-step:
S81: computer control power supply/measuring unit is exported suitable working current to power-type LED, does not produce obvious thermal effect but LED can be lighted; Utilize temperature control unit control heating cooling unit to produce different temperature values; Utilize power supply/measuring unit to measure electrical power P under different temperatures d; Utilize optical parameter measurement unit to record optical parameter value P simultaneously o, calculate optical parameter-electrical power efficiency E and junction temperature T jrelation curve E-T j;
S82: adopt the principle of least square to E-T jcurve data carries out linear fit, obtains the coefficient value k of efficiency and junction temperature e;
E＝E p0[1+k e(T j-T 0)] (5)
Wherein E is optical parameter-electrical power efficiency, E p0for environment temperature is T 0time optical parameter-electrical power efficiency.
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CN105974334A (en) * 2016-08-02 2016-09-28 惠勇 Testing system for LED lamp drive power source
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CN104569065B (en) * 2015-02-13 2017-03-01 重庆大学 A kind of fast evaluation method of high power LED device die bond layer heat dispersion
CN105044583A (en) * 2015-06-05 2015-11-11 江苏理工学院 Test apparatus for LED junction temperature K coefficient
CN105974334A (en) * 2016-08-02 2016-09-28 惠勇 Testing system for LED lamp drive power source
CN109444704A (en) * 2018-10-25 2019-03-08 江苏理工学院 LEDbulb lamp photoelectric properties on-line detecting system
CN110927617A (en) * 2019-12-13 2020-03-27 嘉兴市光泰照明有限公司 LED vehicle lamp quality detection method based on infrared thermal imaging

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