CN103072099B - 丙烯酸酯聚氨酯化学机械抛光层 - Google Patents

丙烯酸酯聚氨酯化学机械抛光层 Download PDF

Info

Publication number
CN103072099B
CN103072099B CN201210370017.7A CN201210370017A CN103072099B CN 103072099 B CN103072099 B CN 103072099B CN 201210370017 A CN201210370017 A CN 201210370017A CN 103072099 B CN103072099 B CN 103072099B
Authority
CN
China
Prior art keywords
acrylate
chemical mechanical
isocyanate
polishing pad
mechanical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210370017.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN103072099A (zh
Inventor
J·谢
D·B·詹姆斯
C·H·董
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROHM AND HAAS ELECTRONIC MATER
Dow Global Technologies LLC
Original Assignee
ROHM AND HAAS ELECTRONIC MATER
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROHM AND HAAS ELECTRONIC MATER, Dow Global Technologies LLC filed Critical ROHM AND HAAS ELECTRONIC MATER
Publication of CN103072099A publication Critical patent/CN103072099A/zh
Application granted granted Critical
Publication of CN103072099B publication Critical patent/CN103072099B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4825—Polyethers containing two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
    • C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polyurethanes Or Polyureas (AREA)
CN201210370017.7A 2011-09-29 2012-09-27 丙烯酸酯聚氨酯化学机械抛光层 Active CN103072099B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/248,123 US8512427B2 (en) 2011-09-29 2011-09-29 Acrylate polyurethane chemical mechanical polishing layer
US13/248,123 2011-09-29

Publications (2)

Publication Number Publication Date
CN103072099A CN103072099A (zh) 2013-05-01
CN103072099B true CN103072099B (zh) 2015-06-17

Family

ID=47878728

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210370017.7A Active CN103072099B (zh) 2011-09-29 2012-09-27 丙烯酸酯聚氨酯化学机械抛光层

Country Status (7)

Country Link
US (1) US8512427B2 (https=)
JP (1) JP6073099B2 (https=)
KR (1) KR101929055B1 (https=)
CN (1) CN103072099B (https=)
DE (1) DE102012018523A1 (https=)
FR (1) FR2980798B1 (https=)
TW (1) TWI472546B (https=)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9238296B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9233451B2 (en) * 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
CN105408379B (zh) * 2013-08-20 2019-02-01 陶氏环球技术有限责任公司 用于液压泵的聚氨基甲酸酯弹性密封件
US9102034B2 (en) * 2013-08-30 2015-08-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a substrate
US20150065013A1 (en) * 2013-08-30 2015-03-05 Dow Global Technologies Llc Chemical mechanical polishing pad
US20150059254A1 (en) * 2013-09-04 2015-03-05 Dow Global Technologies Llc Polyurethane polishing pad
JP6365869B2 (ja) * 2014-03-19 2018-08-01 Dic株式会社 ウレタン組成物及び研磨材
US9259820B2 (en) * 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9064806B1 (en) * 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9333620B2 (en) 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
JP7066608B2 (ja) * 2015-09-25 2022-05-13 シーエムシー マテリアルズ，インコーポレイティド 化学機械的研磨パッド、基板を化学機械的に研磨する方法、及び化学機械的研磨パッドを製造する方法
CN110167985A (zh) * 2017-01-12 2019-08-23 巴斯夫欧洲公司 聚氨酯的物理性能改进
US11179822B2 (en) * 2017-08-31 2021-11-23 Hubei Dinghui Microelectronics Materials Co., Ltd Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material
US10465097B2 (en) 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
JP7099827B2 (ja) * 2018-01-26 2022-07-12 ニッタ・デュポン株式会社 研磨パッド
KR102197481B1 (ko) * 2019-06-27 2020-12-31 에스케이씨 주식회사 연마패드 및 이의 제조방법
US12006442B2 (en) * 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
US12122013B2 (en) 2019-10-23 2024-10-22 Sk Enpulse Co., Ltd. Composition for polishing pad and polishing pad
TWI851930B (zh) * 2020-10-19 2024-08-11 美商Ｃｍｃ材料有限責任公司 用於化學機械拋光墊之可uv固化樹脂
KR102488115B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
KR102488112B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
CN114434318B (zh) * 2020-11-06 2024-06-14 Sk恩普士有限公司 抛光垫及其制备方法以及使用其的半导体器件的制造方法
US11679531B2 (en) 2021-10-13 2023-06-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
US12220784B2 (en) 2021-10-13 2025-02-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
US12528152B2 (en) * 2022-06-02 2026-01-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having ultra expanded polymer microspheres
US12544958B2 (en) * 2022-06-02 2026-02-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making low specific gravity polishing pads
US20230406984A1 (en) * 2022-06-15 2023-12-21 Cmc Materials Llc Uv-curable resins for chemical mechanical polishing pads
CN115415931B (zh) * 2022-07-26 2024-03-15 安徽禾臣新材料有限公司 一种半导体加工用化学机械抛光垫
CN117247739B (zh) * 2023-09-20 2026-03-17 上海宗易工贸有限公司 一种半导体晶片抛光材料及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1265618A (zh) * 1997-08-06 2000-09-06 罗德尔控股公司 改进的抛光垫及其相关的方法
CN1474735A (zh) * 2000-09-15 2004-02-11 PPG��ҵ����˾ 包含粒状聚合物和交联聚合物粘结剂的抛光垫
CN1830627A (zh) * 2005-03-08 2006-09-13 罗门哈斯电子材料Cmp控股股份有限公司 水基抛光垫及其制造方法
US7371160B1 (en) * 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
CN101649164A (zh) * 2008-08-04 2010-02-17 罗门哈斯电子材料Cmp控股股份有限公司 化学机械抛光组合物及其相关方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057431A (en) 1975-09-29 1977-11-08 The Goodyear Tire & Rubber Company Ethylenically polyurethane unsaturated composition
US4721751A (en) 1987-03-26 1988-01-26 Ppg Industries, Inc. Polyurea-polyurethane acrylate dispersions
US4855184A (en) 1988-02-02 1989-08-08 Minnesota Mining And Manufacturing Company Radiation-curable protective coating composition
US5341799A (en) 1991-12-23 1994-08-30 Hercules Incorporated Urethane polymers for printing plate compositions
US5965460A (en) 1997-01-29 1999-10-12 Mac Dermid, Incorporated Polyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing pads
CN100496896C (zh) 2000-12-01 2009-06-10 东洋橡膠工业株式会社 研磨垫
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
JP4576095B2 (ja) * 2003-04-24 2010-11-04 東洋インキ製造株式会社 両面粘着シート及び研磨布積層体
US20050171224A1 (en) 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
JP4475404B2 (ja) * 2004-10-14 2010-06-09 Ｊｓｒ株式会社 研磨パッド
TWI372108B (en) * 2005-04-06 2012-09-11 Rohm & Haas Elect Mat Method for forming a porous reaction injection molded chemical mechanical polishing pad
US7169030B1 (en) 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
JP2008221367A (ja) * 2007-03-09 2008-09-25 Toyo Tire & Rubber Co Ltd 研磨パッド

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1265618A (zh) * 1997-08-06 2000-09-06 罗德尔控股公司 改进的抛光垫及其相关的方法
CN1474735A (zh) * 2000-09-15 2004-02-11 PPG��ҵ����˾ 包含粒状聚合物和交联聚合物粘结剂的抛光垫
CN1830627A (zh) * 2005-03-08 2006-09-13 罗门哈斯电子材料Cmp控股股份有限公司 水基抛光垫及其制造方法
US7371160B1 (en) * 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
CN101649164A (zh) * 2008-08-04 2010-02-17 罗门哈斯电子材料Cmp控股股份有限公司 化学机械抛光组合物及其相关方法

Also Published As

Publication number Publication date
KR101929055B1 (ko) 2018-12-13
JP2013078839A (ja) 2013-05-02
TWI472546B (zh) 2015-02-11
JP6073099B2 (ja) 2017-02-01
FR2980798A1 (fr) 2013-04-05
KR20130035225A (ko) 2013-04-08
FR2980798B1 (fr) 2016-06-17
TW201323466A (zh) 2013-06-16
CN103072099A (zh) 2013-05-01
DE102012018523A1 (de) 2013-04-04
US20130084702A1 (en) 2013-04-04
US8512427B2 (en) 2013-08-20

Similar Documents

Publication Publication Date Title
CN103072099B (zh) 丙烯酸酯聚氨酯化学机械抛光层
CN107813219B (zh) 高平坦化效率化学机械抛光垫和制备方法
TWI597355B (zh) 柔軟且可調理之化學機械硏磨墊
CN105014528B (zh) 化学机械抛光垫
US20100035529A1 (en) Chemical mechanical polishing pad
TWI776813B (zh) 高移除率化學機械拋光墊及製造方法
TWI574793B (zh) 軟且可修整化學機械硏磨墊堆疊體
FR3022815A1 (fr) Procede de polissage mecano-chimique
TWI846748B (zh) 化學機械拋光墊及拋光方法
KR101600393B1 (ko) 연마 패드 및 이의 제조 방법
CN108789135B (zh) 化学机械抛光垫
CN102310366B (zh) 具有低缺陷整体窗的化学机械抛光垫
KR102394799B1 (ko) 화학적 기계적 연마 층의 제조 방법
JP2023157918A (ja) 研磨パッド及び研磨加工物の製造方法
TWI842767B (zh) 用於拋光襯底的具有正ζ電勢之化學機械拋光墊
WO2022210037A1 (ja) 研磨パッド及び研磨パッドの製造方法
JP2022153967A (ja) 研磨パッド及び研磨パッドの製造方法
CN118893874B (zh) 多层材料及其使用的研磨材料和应用
KR101769328B1 (ko) 연마 패드의 제조 방법
TW202517702A (zh) 由雙重固化劑形成的拋光墊

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant