CN103059267A - 含有过量环氧树脂的环氧热固性组合物及其制备方法 - Google Patents
含有过量环氧树脂的环氧热固性组合物及其制备方法 Download PDFInfo
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- CN103059267A CN103059267A CN2012103902287A CN201210390228A CN103059267A CN 103059267 A CN103059267 A CN 103059267A CN 2012103902287 A CN2012103902287 A CN 2012103902287A CN 201210390228 A CN201210390228 A CN 201210390228A CN 103059267 A CN103059267 A CN 103059267A
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- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- QZQIWEZRSIPYCU-UHFFFAOYSA-N trithiole Chemical class S1SC=CS1 QZQIWEZRSIPYCU-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 150000003732 xanthenes Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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| CN103059267A true CN103059267A (zh) | 2013-04-24 |
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| CN200880015360A Pending CN101679603A (zh) | 2007-05-09 | 2008-04-22 | 含有过量环氧树脂的环氧热固性组合物及其制备方法 |
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Country Status (8)
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| US (1) | US20100144965A1 (https=) |
| EP (1) | EP2147034B1 (https=) |
| JP (1) | JP2010526907A (https=) |
| KR (1) | KR20100017712A (https=) |
| CN (2) | CN103059267A (https=) |
| BR (1) | BRPI0810290A2 (https=) |
| TW (1) | TWI372766B (https=) |
| WO (1) | WO2008140906A1 (https=) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MX2012013529A (es) | 2010-05-21 | 2013-01-24 | Dow Global Technologies Llc | Composiciones curables. |
| US20110319564A1 (en) | 2010-06-24 | 2011-12-29 | Larry Steven Corley | Epoxy systems for composites |
| KR20140045954A (ko) | 2011-06-24 | 2014-04-17 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 조성물 및 섬유-보강된 복합체를 제조하는 방법 |
| WO2013003202A1 (en) | 2011-06-30 | 2013-01-03 | Dow Global Technologies Llc | Curable epoxy resin systems containing mixtures of amine hardeners and an excess of epoxide groups |
| WO2013095908A2 (en) * | 2011-12-20 | 2013-06-27 | Dow Global Technologies Llc | Epoxy resin composites |
| WO2014062407A2 (en) | 2012-10-19 | 2014-04-24 | Dow Global Technologies Llc | Anhydride-cured epoxy resin systems containing divinylarene dioxides |
| KR102131211B1 (ko) | 2012-11-13 | 2020-07-08 | 다우 글로벌 테크놀로지스 엘엘씨 | 수지 이송 성형 공정을 위한 폴리에틸렌 테트라아민을 함유하는 에폭시 수지 시스템 |
| WO2014078218A1 (en) | 2012-11-13 | 2014-05-22 | Dow Global Technologies Llc | Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes |
| JP2016501970A (ja) * | 2012-12-21 | 2016-01-21 | ダウ グローバル テクノロジーズ エルエルシー | チオール硬化弾性エポキシ樹脂 |
| BR112015014761A2 (pt) | 2012-12-21 | 2017-07-11 | Dow Global Technologies Llc | método para produzir uma junção de cabo |
| CN104968703B (zh) | 2012-12-21 | 2018-04-10 | 陶氏环球技术有限责任公司 | 相分段的非异氰酸酯弹性体 |
| BR112016005017B1 (pt) | 2013-09-16 | 2021-02-17 | Dow Global Technologies Llc | processo para montar segmentos de tubo |
| EP3083749B1 (en) | 2013-12-18 | 2020-01-22 | Dow Global Technologies LLC | Process for forming an organic polymer in a reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents |
| WO2015103427A1 (en) | 2013-12-31 | 2015-07-09 | Saint-Gobain Performance Plastics Corporation | Composites for protecting signal transmitters/receivers |
| WO2015119881A1 (en) | 2014-02-07 | 2015-08-13 | Dow Global Technologies Llc | Fast curing high glass transition temperature epoxy resin system |
| WO2015142771A1 (en) | 2014-03-18 | 2015-09-24 | Dow Global Technologies Llc | Epoxy resin system |
| US10066136B2 (en) | 2014-04-22 | 2018-09-04 | Dow Global Technologies Llc | Polyurethane-acrylate epoxy adhesive |
| KR102375219B1 (ko) | 2014-07-17 | 2022-03-17 | 다우 글로벌 테크놀로지스 엘엘씨 | 트리에틸아민테트라아민 및 주석 촉매를 이용한 에폭시 시스템 |
| EP3194466B1 (en) * | 2014-09-12 | 2019-11-06 | Drexel University | Toughening of anhydride cured thermosetting epoxy polymers using grafted triglycerides |
| US9822227B2 (en) | 2014-09-16 | 2017-11-21 | Isola Usa Corp. | High Tg epoxy formulation with good thermal properties |
| WO2016077095A1 (en) | 2014-11-11 | 2016-05-19 | Dow Global Technologies Llc | Fast curing high glass transition temperature epoxy resin system |
| EP3237485A1 (en) | 2014-12-24 | 2017-11-01 | Dow Global Technologies LLC | Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system |
| US10479858B2 (en) | 2015-06-25 | 2019-11-19 | Dow Global Technologies Llc | Epoxy resin system for making carbon fiber composites |
| WO2017007650A1 (en) | 2015-07-07 | 2017-01-12 | Dow Global Technologies Llc | Stable high glass transition temperature epoxy resin system for making composites |
| KR102716321B1 (ko) | 2016-05-24 | 2024-10-14 | 주식회사 아모그린텍 | 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛 |
| WO2018017280A1 (en) | 2016-07-17 | 2018-01-25 | Dow Global Technologies Llc | In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin |
| CN109790279B (zh) | 2016-08-19 | 2022-06-28 | 陶氏环球技术有限责任公司 | 含有内部脱模剂的环氧树脂组合物 |
| US11261289B2 (en) | 2016-10-17 | 2022-03-01 | Warren Environmental & Coating, Llc | Method of lining a pipeline with a delayed curing resin composition |
| EP3592796B1 (en) | 2017-03-09 | 2021-04-21 | Dow Global Technologies LLC | Stable epoxy/internal mold release agent blends for the manufacture of composite articles |
| EP3596182B1 (en) | 2017-03-17 | 2021-06-30 | Dow Global Technologies LLC | Epoxy-acrylic hybrid adhesive |
| JP2020524187A (ja) | 2017-06-20 | 2020-08-13 | ダウ グローバル テクノロジーズ エルエルシー | 繊維強化複合材を製造するためのエポキシ樹脂系 |
| WO2020005393A1 (en) | 2018-06-26 | 2020-01-02 | Dow Global Technologies Llc | Fibre-reinforced composite and process of making this composite |
| WO2020033037A1 (en) | 2018-08-08 | 2020-02-13 | Dow Global Technologies Llc | Epoxy resin composition |
| WO2020033036A1 (en) | 2018-08-08 | 2020-02-13 | Dow Global Technologies Llc | Epoxy resin composition |
| WO2021095534A1 (ja) * | 2019-11-14 | 2021-05-20 | Dic株式会社 | 硬化性組成物、硬化物、繊維強化複合材料、成形品及びその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5686185A (en) * | 1996-06-28 | 1997-11-11 | Morton International, Inc. | Disbondment resistant epoxy powder coating composition |
| US5962586A (en) * | 1994-09-27 | 1999-10-05 | Harper; John D. | Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct |
| CN1788062A (zh) * | 2003-02-28 | 2006-06-14 | 国家淀粉及化学投资控股公司 | 用于电子设备的具有电稳定性和良好抗冲击性的导电性粘合剂组合物 |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2750395A (en) * | 1954-01-05 | 1956-06-12 | Union Carbide & Carbon Corp | Diepoxides |
| US2890194A (en) * | 1956-05-24 | 1959-06-09 | Union Carbide Corp | Compositions of epoxides and polycarboxylic acid compounds |
| US3018262A (en) * | 1957-05-01 | 1962-01-23 | Shell Oil Co | Curing polyepoxides with certain metal salts of inorganic acids |
| US3960979A (en) * | 1974-12-24 | 1976-06-01 | E. I. Du Pont De Nemours And Company | High solids can coating compositions based on epoxy resin crosslinking agent, flexibilizing polyol, co-reactive acid catalyst, and surface modifier |
| US4018848A (en) * | 1974-12-24 | 1977-04-19 | E. I. Du Pont De Nemours And Company | High solids can coating compositions based on epoxy resin, crosslinking agent, flexibilizing polyol, co-reactive acid catalyst, and surface modifier |
| US3969979A (en) * | 1975-07-29 | 1976-07-20 | Sun Ventures, Inc. | Liquid propellant for a gun |
| US4076764A (en) * | 1976-07-22 | 1978-02-28 | Shell Oil Company | Epoxy resin composition having improved physical properties |
| US4181784A (en) * | 1977-12-27 | 1980-01-01 | Ford Motor Company | High solids coating composition adapted for use as automotive topcoat--#1 |
| US4393181A (en) * | 1982-06-30 | 1983-07-12 | Shell Oil Company | Polyfunctional phenolic-melamine epoxy resin curing agents |
| US4595623A (en) * | 1984-05-07 | 1986-06-17 | Hughes Aircraft Company | Fiber-reinforced syntactic foam composites and method of forming same |
| US4656207A (en) * | 1985-02-19 | 1987-04-07 | Hercules Incorporated | Epoxy thermosets having improved toughness |
| EP0249262A3 (en) * | 1986-06-09 | 1990-07-04 | Shell Internationale Researchmaatschappij B.V. | Thermoplastic polymer composition having thermosetting processing characteristics |
| CN1046741A (zh) * | 1988-04-30 | 1990-11-07 | 三井东圧化学株式会社 | 以多硫化物为基础的树脂，含有该树脂的塑料透镜以及制造该种透镜的方法 |
| GB8912952D0 (en) * | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
| US5385990A (en) * | 1992-11-02 | 1995-01-31 | Lord Corporation | Structural adhesive composition having high temperature resistance |
| JPH07228580A (ja) * | 1993-12-21 | 1995-08-29 | Yuka Shell Epoxy Kk | 変性多価エポキシ化合物、同化合物の製造方法及びエポキシ樹脂組成物 |
| GB9411367D0 (en) * | 1994-06-07 | 1994-07-27 | Ici Composites Inc | Curable Composites |
| GB9421405D0 (en) * | 1994-10-21 | 1994-12-07 | Dow Chemical Co | Low voc laminating formulations |
| US6153719A (en) * | 1998-02-04 | 2000-11-28 | Lord Corporation | Thiol-cured epoxy composition |
| JP2000273280A (ja) * | 1999-03-26 | 2000-10-03 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| US6469074B1 (en) * | 1999-05-26 | 2002-10-22 | Matsushita Electric Works, Ltd. | Composition of cyanate ester, epoxy resin and acid anhydride |
| US6632893B2 (en) * | 1999-05-28 | 2003-10-14 | Henkel Loctite Corporation | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners |
| DE19956893A1 (de) * | 1999-11-26 | 2001-05-31 | Daimler Chrysler Ag | Kühlkreis für einen Verbrennungsmotor |
| US20040082720A1 (en) * | 2000-07-18 | 2004-04-29 | Fmc Corporation | Adducts of amine-terminated polyolefins and epoxides |
| JP2002212390A (ja) * | 2001-01-19 | 2002-07-31 | Hitachi Chem Co Ltd | 絶縁樹脂組成物、銅箔付き絶縁材および銅張積層板 |
| US6572971B2 (en) * | 2001-02-26 | 2003-06-03 | Ashland Chemical | Structural modified epoxy adhesive compositions |
| US6632860B1 (en) * | 2001-08-24 | 2003-10-14 | Texas Research International, Inc. | Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener |
| US6808819B2 (en) * | 2002-02-14 | 2004-10-26 | Shin Etsu Chemical Co., Ltd. | Heat resistant resin composition and adhesive film |
| JP4047613B2 (ja) * | 2002-03-29 | 2008-02-13 | 住友ベークライト株式会社 | 液状封止樹脂及びそれを用いた半導体装置 |
| JP3862004B2 (ja) * | 2002-05-10 | 2006-12-27 | 信越化学工業株式会社 | 耐熱性樹脂組成物及びそれを用いた接着フィルム |
| GB0212062D0 (en) * | 2002-05-24 | 2002-07-03 | Vantico Ag | Jetable compositions |
| JP4120780B2 (ja) * | 2002-07-19 | 2008-07-16 | 信越化学工業株式会社 | フェノール性水酸基を有するポリイミド樹脂の製造方法 |
| US7163973B2 (en) * | 2002-08-08 | 2007-01-16 | Henkel Corporation | Composition of bulk filler and epoxy-clay nanocomposite |
| US20050215656A1 (en) * | 2002-11-28 | 2005-09-29 | Taiyo Ink Manufacturing Co., Ltd. | Photocurable and thermosetting resin composition and printed circuit boards made by using the same |
| US8048819B2 (en) * | 2005-06-23 | 2011-11-01 | Momentive Performance Materials Inc. | Cure catalyst, composition, electronic device and associated method |
| US20110319564A1 (en) * | 2010-06-24 | 2011-12-29 | Larry Steven Corley | Epoxy systems for composites |
| US20120328811A1 (en) * | 2011-06-24 | 2012-12-27 | Air Products And Chemicals, Inc. | Epoxy Resin Compositions |
-
2008
- 2008-04-22 KR KR1020097025616A patent/KR20100017712A/ko not_active Ceased
- 2008-04-22 EP EP08746559.7A patent/EP2147034B1/en not_active Not-in-force
- 2008-04-22 US US12/598,520 patent/US20100144965A1/en not_active Abandoned
- 2008-04-22 WO PCT/US2008/061163 patent/WO2008140906A1/en not_active Ceased
- 2008-04-22 CN CN2012103902287A patent/CN103059267A/zh active Pending
- 2008-04-22 CN CN200880015360A patent/CN101679603A/zh active Pending
- 2008-04-22 BR BRPI0810290-2A2A patent/BRPI0810290A2/pt not_active IP Right Cessation
- 2008-04-22 JP JP2010507516A patent/JP2010526907A/ja active Pending
- 2008-04-25 TW TW097115210A patent/TWI372766B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5962586A (en) * | 1994-09-27 | 1999-10-05 | Harper; John D. | Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct |
| US5686185A (en) * | 1996-06-28 | 1997-11-11 | Morton International, Inc. | Disbondment resistant epoxy powder coating composition |
| CN1788062A (zh) * | 2003-02-28 | 2006-06-14 | 国家淀粉及化学投资控股公司 | 用于电子设备的具有电稳定性和良好抗冲击性的导电性粘合剂组合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008140906A1 (en) | 2008-11-20 |
| EP2147034A1 (en) | 2010-01-27 |
| JP2010526907A (ja) | 2010-08-05 |
| BRPI0810290A2 (pt) | 2014-11-04 |
| EP2147034B1 (en) | 2014-12-17 |
| KR20100017712A (ko) | 2010-02-16 |
| CN101679603A (zh) | 2010-03-24 |
| US20100144965A1 (en) | 2010-06-10 |
| TWI372766B (en) | 2012-09-21 |
| TW200914482A (en) | 2009-04-01 |
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