CN103035606A - 基于引线框架的快闪存储器卡 - Google Patents
基于引线框架的快闪存储器卡 Download PDFInfo
- Publication number
- CN103035606A CN103035606A CN2012102404636A CN201210240463A CN103035606A CN 103035606 A CN103035606 A CN 103035606A CN 2012102404636 A CN2012102404636 A CN 2012102404636A CN 201210240463 A CN201210240463 A CN 201210240463A CN 103035606 A CN103035606 A CN 103035606A
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- lead frame
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Images
Classifications
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/321,350 US7488620B2 (en) | 2005-12-29 | 2005-12-29 | Method of fabricating leadframe based flash memory cards including singulation by straight line cuts |
US11/321,350 | 2005-12-29 | ||
CNA200680049955XA CN101351883A (zh) | 2005-12-29 | 2006-12-27 | 基于引线框架的快闪存储器卡 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA200680049955XA Division CN101351883A (zh) | 2005-12-29 | 2006-12-27 | 基于引线框架的快闪存储器卡 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103035606A true CN103035606A (zh) | 2013-04-10 |
CN103035606B CN103035606B (zh) | 2016-01-06 |
Family
ID=38171274
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010100006442A Expired - Fee Related CN101847584B (zh) | 2005-12-29 | 2006-12-27 | 基于引线框架的快闪存储器卡的制造方法 |
CNA200680049955XA Pending CN101351883A (zh) | 2005-12-29 | 2006-12-27 | 基于引线框架的快闪存储器卡 |
CN201210240463.6A Expired - Fee Related CN103035606B (zh) | 2005-12-29 | 2006-12-27 | 基于引线框架的快闪存储器卡 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010100006442A Expired - Fee Related CN101847584B (zh) | 2005-12-29 | 2006-12-27 | 基于引线框架的快闪存储器卡的制造方法 |
CNA200680049955XA Pending CN101351883A (zh) | 2005-12-29 | 2006-12-27 | 基于引线框架的快闪存储器卡 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7488620B2 (zh) |
EP (1) | EP1969628A2 (zh) |
KR (1) | KR101015268B1 (zh) |
CN (3) | CN101847584B (zh) |
TW (1) | TWI335656B (zh) |
WO (1) | WO2007079125A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115410927A (zh) * | 2022-09-29 | 2022-11-29 | 北京超材信息科技有限公司 | 半导体器件的切割方法 |
Families Citing this family (39)
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US20080185694A1 (en) * | 1999-08-04 | 2008-08-07 | Super Talent Electronics, Inc. | Processes of Manufacturing Portable Electronic Storage Devices Utilizing Lead Frame Connectors |
US7488620B2 (en) * | 2005-12-29 | 2009-02-10 | Sandisk Corporation | Method of fabricating leadframe based flash memory cards including singulation by straight line cuts |
US20070152071A1 (en) * | 2006-01-05 | 2007-07-05 | En-Min Jow | Package method for flash memory card and structure thereof |
US20070164120A1 (en) * | 2006-01-19 | 2007-07-19 | En-Min Jow | Forming method of Micro SD card |
JP4945682B2 (ja) * | 2010-02-15 | 2012-06-06 | 株式会社東芝 | 半導体記憶装置およびその製造方法 |
JP5337110B2 (ja) * | 2010-06-29 | 2013-11-06 | 株式会社東芝 | 半導体記憶装置 |
US8446728B1 (en) * | 2011-01-03 | 2013-05-21 | Wade S. McDonald | Flash memory card carrier |
US8575739B2 (en) * | 2011-05-06 | 2013-11-05 | Sandisk Technologies Inc. | Col-based semiconductor package including electrical connections through a single layer leadframe |
DE102011106104B4 (de) * | 2011-06-09 | 2014-04-10 | Otto Bock Healthcare Products Gmbh | Verfahren zum Herstellen bestückter Leiterplatten |
TWI508268B (zh) * | 2011-07-13 | 2015-11-11 | Powertech Technology Inc | 無基板之快閃記憶卡之製造方法 |
JP2013025540A (ja) * | 2011-07-20 | 2013-02-04 | Toshiba Corp | 半導体記憶装置 |
US20130069223A1 (en) * | 2011-09-16 | 2013-03-21 | Hui-Chang Chen | Flash memory card without a substrate and its fabrication method |
US8368192B1 (en) * | 2011-09-16 | 2013-02-05 | Powertech Technology, Inc. | Multi-chip memory package with a small substrate |
JP5740372B2 (ja) * | 2012-09-12 | 2015-06-24 | 株式会社東芝 | 半導体メモリカード |
USD730910S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD730907S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD730908S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD730909S1 (en) * | 2014-06-27 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD727911S1 (en) * | 2014-06-27 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
USD727913S1 (en) * | 2014-06-27 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
USD729251S1 (en) * | 2014-06-27 | 2015-05-12 | Samsung Electronics Co., Ltd. | Memory card |
USD727912S1 (en) * | 2014-06-27 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
USD736212S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736215S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736214S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
KR102284653B1 (ko) * | 2014-07-02 | 2021-08-03 | 삼성전자 주식회사 | 전자 장치 |
USD727910S1 (en) * | 2014-07-02 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
US10157678B2 (en) | 2014-08-12 | 2018-12-18 | Samsung Electronics Co., Ltd. | Memory card |
KR102420587B1 (ko) | 2014-08-12 | 2022-07-14 | 삼성전자주식회사 | 메모리 카드 |
USD798868S1 (en) * | 2015-08-20 | 2017-10-03 | Isaac S. Daniel | Combined subscriber identification module and storage card |
USD773466S1 (en) * | 2015-08-20 | 2016-12-06 | Isaac S. Daniel | Combined secure digital memory and subscriber identity module |
USD783622S1 (en) * | 2015-08-25 | 2017-04-11 | Samsung Electronics Co., Ltd. | Memory card |
USD783621S1 (en) * | 2015-08-25 | 2017-04-11 | Samsung Electronics Co., Ltd. | Memory card |
USD772232S1 (en) * | 2015-11-12 | 2016-11-22 | Samsung Electronics Co., Ltd. | Memory card |
USD773467S1 (en) * | 2015-11-12 | 2016-12-06 | Samsung Electronics Co., Ltd. | Memory card |
US20180088628A1 (en) * | 2016-09-28 | 2018-03-29 | Intel Corporation | Leadframe for surface mounted contact fingers |
US10366946B2 (en) | 2017-10-30 | 2019-07-30 | Infineon Technologies Ag | Connection member with bulk body and electrically and thermally conductive coating |
WO2019138260A1 (en) * | 2018-01-12 | 2019-07-18 | Linxens Holding | Method for manufacturing a sim card and sim card |
USD934868S1 (en) * | 2018-02-28 | 2021-11-02 | Sony Corporation | Memory card |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1412843A (zh) * | 2001-10-15 | 2003-04-23 | 新光电气工业株式会社 | 引线框架、其制造方法及使用它的半导体器件的制造方法 |
US20040259291A1 (en) * | 2003-06-23 | 2004-12-23 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
US20050133890A1 (en) * | 2003-12-19 | 2005-06-23 | Virgil Liao | Substrate structure capable of reducing package singular stress |
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US5652185A (en) * | 1995-04-07 | 1997-07-29 | National Semiconductor Corporation | Maximized substrate design for grid array based assemblies |
KR100309161B1 (ko) * | 1999-10-11 | 2001-11-02 | 윤종용 | 메모리 카드 및 그 제조방법 |
IT1320025B1 (it) | 2000-04-10 | 2003-11-12 | Viasystems S R L | Supporto del tipo a circuito stampato per circuiti elettroniciintegrati, procedimento per la sua fabbricazione, e componente |
KR20020007877A (ko) | 2000-07-19 | 2002-01-29 | 마이클 디. 오브라이언 | 반도체 패키지 제조용 부재 |
US6624005B1 (en) * | 2000-09-06 | 2003-09-23 | Amkor Technology, Inc. | Semiconductor memory cards and method of making same |
US6444501B1 (en) * | 2001-06-12 | 2002-09-03 | Micron Technology, Inc. | Two stage transfer molding method to encapsulate MMC module |
US6858470B1 (en) * | 2003-10-08 | 2005-02-22 | St Assembly Test Services Ltd. | Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof |
US7485501B2 (en) * | 2005-11-02 | 2009-02-03 | Sandisk Corporation | Method of manufacturing flash memory cards |
US7488620B2 (en) | 2005-12-29 | 2009-02-10 | Sandisk Corporation | Method of fabricating leadframe based flash memory cards including singulation by straight line cuts |
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2005
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- 2006-12-27 WO PCT/US2006/049383 patent/WO2007079125A2/en active Application Filing
- 2006-12-27 EP EP06849020A patent/EP1969628A2/en not_active Withdrawn
- 2006-12-27 CN CNA200680049955XA patent/CN101351883A/zh active Pending
- 2006-12-27 CN CN201210240463.6A patent/CN103035606B/zh not_active Expired - Fee Related
- 2006-12-27 KR KR1020087018744A patent/KR101015268B1/ko active IP Right Grant
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CN1412843A (zh) * | 2001-10-15 | 2003-04-23 | 新光电气工业株式会社 | 引线框架、其制造方法及使用它的半导体器件的制造方法 |
US20040259291A1 (en) * | 2003-06-23 | 2004-12-23 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
US20050133890A1 (en) * | 2003-12-19 | 2005-06-23 | Virgil Liao | Substrate structure capable of reducing package singular stress |
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CN115410927A (zh) * | 2022-09-29 | 2022-11-29 | 北京超材信息科技有限公司 | 半导体器件的切割方法 |
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KR20080085902A (ko) | 2008-09-24 |
US7795715B2 (en) | 2010-09-14 |
CN101351883A (zh) | 2009-01-21 |
TW200735316A (en) | 2007-09-16 |
CN103035606B (zh) | 2016-01-06 |
EP1969628A2 (en) | 2008-09-17 |
US7488620B2 (en) | 2009-02-10 |
WO2007079125A2 (en) | 2007-07-12 |
TWI335656B (en) | 2011-01-01 |
US20070155046A1 (en) | 2007-07-05 |
US20090134502A1 (en) | 2009-05-28 |
WO2007079125A3 (en) | 2007-10-04 |
CN101847584A (zh) | 2010-09-29 |
CN101847584B (zh) | 2012-10-03 |
KR101015268B1 (ko) | 2011-02-18 |
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