CN103026498A - 附有半导体组件的织网基材及其制造方法与其制造装置 - Google Patents
附有半导体组件的织网基材及其制造方法与其制造装置 Download PDFInfo
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1017—Shape being a sphere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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Claims (23)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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JPPCT/JP2010/064459 | 2010-08-26 | ||
PCT/JP2010/064459 WO2012026013A1 (ja) | 2010-08-26 | 2010-08-26 | 半導体素子付き織網基材の製造方法、その製造装置及び半導体素子付き織網基材 |
PCT/JP2010/067376 WO2012026046A1 (ja) | 2010-08-26 | 2010-10-04 | 半導体素子付き織網基材の製造方法、その製造装置及び半導体素子付き織網基材 |
JPPCT/JP2010/067376 | 2010-10-04 | ||
PCT/JP2011/052579 WO2012026142A1 (ja) | 2010-08-26 | 2011-02-08 | 半導体素子付き織網基材、その製造方法及びその製造装置 |
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CN103026498A true CN103026498A (zh) | 2013-04-03 |
CN103026498B CN103026498B (zh) | 2015-06-03 |
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US (1) | US8709841B2 (zh) |
EP (1) | EP2610919A4 (zh) |
KR (1) | KR101445351B1 (zh) |
CN (1) | CN103026498B (zh) |
AU (1) | AU2011294612B2 (zh) |
CA (1) | CA2808264C (zh) |
HK (1) | HK1179753A1 (zh) |
MX (1) | MX2013001711A (zh) |
TW (1) | TWI442580B (zh) |
WO (3) | WO2012026013A1 (zh) |
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CN107002318A (zh) * | 2014-09-30 | 2017-08-01 | 苹果公司 | 具有嵌入式电子部件的织物 |
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2010
- 2010-08-26 WO PCT/JP2010/064459 patent/WO2012026013A1/ja active Application Filing
- 2010-10-04 WO PCT/JP2010/067376 patent/WO2012026046A1/ja active Application Filing
-
2011
- 2011-02-08 CN CN201180035329.6A patent/CN103026498B/zh not_active Expired - Fee Related
- 2011-02-08 US US13/816,858 patent/US8709841B2/en not_active Expired - Fee Related
- 2011-02-08 KR KR1020137006664A patent/KR101445351B1/ko not_active IP Right Cessation
- 2011-02-08 CA CA2808264A patent/CA2808264C/en not_active Expired - Fee Related
- 2011-02-08 MX MX2013001711A patent/MX2013001711A/es not_active Application Discontinuation
- 2011-02-08 WO PCT/JP2011/052579 patent/WO2012026142A1/ja active Application Filing
- 2011-02-08 EP EP11819618.7A patent/EP2610919A4/en not_active Withdrawn
- 2011-02-08 AU AU2011294612A patent/AU2011294612B2/en not_active Ceased
- 2011-03-03 TW TW100107191A patent/TWI442580B/zh not_active IP Right Cessation
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2013
- 2013-06-06 HK HK13106735.2A patent/HK1179753A1/zh not_active IP Right Cessation
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CN106104813A (zh) * | 2014-03-19 | 2016-11-09 | 思飞乐电力股份有限公司 | 附有半导体功能元件的功能丝线 |
CN104153087A (zh) * | 2014-08-13 | 2014-11-19 | 朱永春 | 一种通丝与综丝杆的连接设备的拉紧装置 |
CN107002318A (zh) * | 2014-09-30 | 2017-08-01 | 苹果公司 | 具有嵌入式电子部件的织物 |
CN107002318B (zh) * | 2014-09-30 | 2020-06-23 | 苹果公司 | 具有嵌入式电子部件的织物 |
US10772209B2 (en) | 2014-09-30 | 2020-09-08 | Apple Inc. | Fabric with embedded electrical components |
CN111676561A (zh) * | 2014-09-30 | 2020-09-18 | 苹果公司 | 具有嵌入式电子部件的织物 |
US11617268B2 (en) | 2014-09-30 | 2023-03-28 | Apple Inc. | Fabric with embedded electrical components |
CN108691058A (zh) * | 2017-03-31 | 2018-10-23 | 波音公司 | 用于形成灰尘减轻织物的系统和方法 |
CN108691058B (zh) * | 2017-03-31 | 2021-12-31 | 波音公司 | 用于形成灰尘减轻织物的系统和方法 |
Also Published As
Publication number | Publication date |
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EP2610919A4 (en) | 2014-05-14 |
US20130145588A1 (en) | 2013-06-13 |
EP2610919A1 (en) | 2013-07-03 |
KR101445351B1 (ko) | 2014-09-30 |
TWI442580B (zh) | 2014-06-21 |
AU2011294612A1 (en) | 2013-02-21 |
MX2013001711A (es) | 2013-02-26 |
CN103026498B (zh) | 2015-06-03 |
KR20130054368A (ko) | 2013-05-24 |
TW201236165A (en) | 2012-09-01 |
WO2012026046A1 (ja) | 2012-03-01 |
US8709841B2 (en) | 2014-04-29 |
HK1179753A1 (zh) | 2013-10-04 |
CA2808264C (en) | 2016-06-28 |
WO2012026013A1 (ja) | 2012-03-01 |
AU2011294612B2 (en) | 2013-10-03 |
CA2808264A1 (en) | 2012-03-01 |
WO2012026142A1 (ja) | 2012-03-01 |
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