CN103022023B - 超薄微型桥堆整流器 - Google Patents
超薄微型桥堆整流器 Download PDFInfo
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- CN103022023B CN103022023B CN201210575976.2A CN201210575976A CN103022023B CN 103022023 B CN103022023 B CN 103022023B CN 201210575976 A CN201210575976 A CN 201210575976A CN 103022023 B CN103022023 B CN 103022023B
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Abstract
本发明公开一种超薄微型桥堆整流器,四个PN结二极管芯片中的二个芯片的P极和二个芯片的N极置于连接框架上,用二个形状相同的桥接片分别桥接二个极性不同的二极管芯片和输入端的连接框架,塑封模压制成桥堆整流器。本发明的优点是超薄超小,性能稳定,便于自动化生产。
Description
技术领域
本发明涉及一种桥堆整流器,特别涉及一种表面贴装的超薄微型桥堆整流器。
背景技术
在设备中由交流变为直流的过程称为整流,其目的就是为了给设备提供工作的直流电源,要实现这个整流过程,必须要通过元器件组成的电路来实现,但这种利用分立器件在PCB上组成的整流电路,达到整流变换目的电路复杂,不利于微型化,生产效率低,浪费资源。而使用集成化的具有整流功能的器件直接实现整流变换,这种元件广泛使用“直插式”结构,元件在使用时是通过4根铜引线插在PCB板上,随着移动及手持微型设备的不断发展,PCB板上的元件密度会越来越大,从而使得对小功率的设备微型化元件要求也将逐步提高,不仅需要表面贴装元的封装体积越来越小,达到占据PCB版空间小,同时对占据的高度同样也是越来越小,以适应越来越薄的设备需求。
发明内容
本发明所要解决的技术问题是要提供一种超薄、超小,结构简单,成品率高的超薄微型桥堆整流器。
为了解决以上的技术问题,本发明提供了一种超薄微型桥堆整流器,四个PN结二极管芯片中的二个芯片的P极和二个芯片的N极置于连接框架上,用二个形状相同的桥接片分别桥接二个极性不同的二极管芯片和输入端的连接框架,塑封模压制成桥堆整流器。
所述二极管芯片两两平行排列构成一模块芯片阵列,结构对称,性能稳定平衡,且占用空间小。
所述连接框架伸出本体的部分为平脚引线。平脚引线的长度为0.1-0.5mm,平脚引线凸出本体的厚度为0-0.1mm。平脚引线是连接框架的一部分,在生产过程中不易变形。
所述连接框架为L型的框架,尺寸可控制,加工简单。
所述二片桥接片互相平行,且二片桥接片的形状相同,尺寸可控制,加工简单。
本发明是在连接框架上焊接二极管芯片,放置平整,便于自动化生产;没有采用导线架,产品厚度薄,仅为0.6-2.0mm。本发明的二极管芯片排列成模块化阵列,节省了空间,尺寸超小,产品长*宽尺寸为3.0-20.0mm*3.0-20.0mm,优选的尺寸为4.5mm*5.7mm,厚度1.2mm。
本发明的优越功效在于:
1)本发明尺寸超小,长*宽为3.0-20.0mm*3.0-20.0mm,优选的尺寸为4.5mm*5.7mm;
2)本发明超薄,仅为0.6-2.0mm,优选厚度为1.2mm;
3)本发明的平脚引线不易变形;
4)本发明的桥接片形状相同,生产中不易混淆,便于自动化生产,生产效率高。
附图说明
图1为本发明的结构示意图;
图2为图1的侧视图;
图3为本发明桥接片的结构示意图;
图4为图3的侧视图;
图中标号说明
1—二极管芯片;2—桥接片;
3—环氧树脂;4—焊锡;
5—输出端连接框架;6—输入端连接框架;
7—平脚引线。
具体实施方式
请参阅附图所示,对本发明作进一步的说明。
如图1和图2所示,本发明提供了一种超薄微型桥堆整流器,四个PN结二极管芯片中的二个芯片1的P极和二个芯片1的N极置于输出端连接框架5上,用二个形状相同的桥接片2分别桥接二个极性不同的二极管芯片1和输入端的连接框架6,塑封模压制成桥堆整流器。
所述二极管芯片1两两平行排列构成一模块芯片阵列,结构对称,性能稳定平衡,且占用空间小。
所述连接框架伸出本体的部分为平脚引线7。平脚引线7的长度为0.1-0.5mm,平脚引线7凸出本体的厚度为0-0.1mm。平脚引线7是连接框架的一部分,在生产过程中不易变形。
所述输入端/输出端连接框架5、6为L型的框架。
如图3和图4所示,所述二片桥接片2互相平行,且二片桥接片的形状相同,尺寸可控制,加工简单。
本发明是在连接框架上焊接二极管芯片,放置平整,便于自动化生产;没有采用导线架,产品厚度薄,仅为0.6-2.0mm。本发明的二极管芯片排列成模块化阵列,节省了空间,尺寸超小,产品长*宽尺寸为3.0-20.0mm*3.0-20.0mm。
Claims (2)
1.一种超薄微型桥堆整流器,四个PN结二极管芯片中的二个芯片的P极和二个芯片的N极置于连接框架上,二极管芯片两两平行排列构成一模块芯片阵列,其特征在于:用二个形状相同的桥接片分别桥接二个极性不同的二极管芯片和输入端的连接框架,连接框架为L型的框架,连接框架伸出本体的部分为平脚引线,塑封模压制成桥堆整流器。
2.根据权利要求1所述的超薄微型桥堆整流器,其特征在于:所述塑封模压制成桥堆整流器的厚度为0.6-2.0mm。
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PCT/CN2013/076977 WO2014067286A1 (zh) | 2012-11-02 | 2013-06-08 | 超薄微型桥堆整流器 |
TW102138984A TW201419741A (zh) | 2012-11-02 | 2013-10-29 | 超薄微型橋堆整流器 |
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CN108389854B (zh) * | 2018-05-03 | 2024-05-17 | 扬州虹扬科技发展有限公司 | 一种超薄微型桥堆整流器 |
CN109686726A (zh) * | 2019-02-14 | 2019-04-26 | 苏州旭芯翔智能设备有限公司 | 一种低热阻的大功率整流元器件及其制造方法 |
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CN201788968U (zh) * | 2010-09-08 | 2011-04-06 | 四川太晶微电子有限公司 | 单层引线框架整流器 |
CN102420219A (zh) * | 2011-01-06 | 2012-04-18 | 陈荣红 | 分立半导体贴片超薄整流器 |
JP5439417B2 (ja) * | 2011-03-10 | 2014-03-12 | 株式会社東芝 | 半導体整流装置 |
CN202261057U (zh) * | 2011-10-14 | 2012-05-30 | 上海美高森美半导体有限公司 | 单列直插式三相整流桥 |
CN103022023B (zh) * | 2012-11-02 | 2016-04-13 | 敦南微电子(无锡)有限公司 | 超薄微型桥堆整流器 |
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US4724474A (en) * | 1986-12-05 | 1988-02-09 | Zenith Electronics Corporation | Power bridge rectifier assembly |
CN201689885U (zh) * | 2010-01-20 | 2010-12-29 | 常州市武进昌达电子元件厂 | 超薄式片式整流桥 |
CN201937484U (zh) * | 2010-11-02 | 2011-08-17 | 上海上斯电子有限公司 | 超薄型表面贴装桥式整流器 |
CN202084544U (zh) * | 2011-06-15 | 2011-12-21 | 上海金克半导体设备有限公司 | 方块式桥堆 |
CN203026502U (zh) * | 2012-11-02 | 2013-06-26 | 敦南微电子(无锡)有限公司 | 超薄微型桥堆整流器 |
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