CN102222660B - 双引线框架多芯片共同封装体及其制造方法 - Google Patents
双引线框架多芯片共同封装体及其制造方法 Download PDFInfo
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- CN102222660B CN102222660B CN201010167961.3A CN201010167961A CN102222660B CN 102222660 B CN102222660 B CN 102222660B CN 201010167961 A CN201010167961 A CN 201010167961A CN 102222660 B CN102222660 B CN 102222660B
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- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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Priority Applications (1)
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CN201010167961.3A CN102222660B (zh) | 2010-04-16 | 2010-04-16 | 双引线框架多芯片共同封装体及其制造方法 |
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CN201010167961.3A CN102222660B (zh) | 2010-04-16 | 2010-04-16 | 双引线框架多芯片共同封装体及其制造方法 |
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CN201410073160.9A Division CN103996628A (zh) | 2010-04-16 | 2010-04-16 | 双引线框架多芯片共同封装体的制造方法 |
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CN102222660A CN102222660A (zh) | 2011-10-19 |
CN102222660B true CN102222660B (zh) | 2014-07-02 |
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CN103280442A (zh) * | 2013-05-27 | 2013-09-04 | 苏州贝克微电子有限公司 | 使用同一引线框架的电容和电容耦合隔离电路 |
CN103474410B (zh) * | 2013-09-11 | 2017-10-27 | 杰群电子科技(东莞)有限公司 | 一种功率半导体封装件及其焊线方法 |
TWI579979B (zh) * | 2014-08-18 | 2017-04-21 | 萬國半導體股份有限公司 | 功率半導體裝置及其製造方法 |
CN110364503B (zh) * | 2019-07-25 | 2020-11-27 | 珠海格力电器股份有限公司 | 一种新型无引线贴片封装结构及其制造方法 |
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JP4102012B2 (ja) * | 2000-09-21 | 2008-06-18 | 株式会社東芝 | 半導体装置の製造方法および半導体装置 |
US8642394B2 (en) * | 2008-01-28 | 2014-02-04 | Infineon Technologies Ag | Method of manufacturing electronic device on leadframe |
US7776658B2 (en) * | 2008-08-07 | 2010-08-17 | Alpha And Omega Semiconductor, Inc. | Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates |
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Address after: No. 495 California Avenue, Sunnyvale mercury Patentee after: ALPHA & OMEGA SEMICONDUCTOR, Ltd. Address before: No. 495 California Avenue, Sunnyvale mercury Patentee before: Alpha and Omega Semiconductor Inc. |
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Effective date of registration: 20170616 Address after: Chongqing city Beibei district and high tech Industrial Park the road No. 5 of 407 Patentee after: Chongqing Wanguo Semiconductor Technology Co.,Ltd. Address before: Bermuda Hamilton Church 2 Cola Lunden House Street Patentee before: ALPHA & OMEGA SEMICONDUCTOR, Ltd. Effective date of registration: 20170616 Address after: Bermuda Hamilton Church 2 Cola Lunden House Street Patentee after: ALPHA & OMEGA SEMICONDUCTOR, Ltd. Address before: No. 495 California Avenue, Sunnyvale mercury Patentee before: ALPHA & OMEGA SEMICONDUCTOR, Ltd. |
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Denomination of invention: Double-lead-frame multi-chip common package body and manufacturing method thereof Effective date of registration: 20191210 Granted publication date: 20140702 Pledgee: Chongqing Branch of China Development Bank Pledgor: Chongqing Wanguo Semiconductor Technology Co.,Ltd. Registration number: Y2019500000007 |