CN110364503B - 一种新型无引线贴片封装结构及其制造方法 - Google Patents
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Abstract
本发明提出了一种新型无引线贴片封装结构,采用表面开设通孔的引脚框架,通过向通孔中填充导电材料的方式,使芯片与引脚框架形成电气连接,从而摒弃了现有技术中需要案通过引线将芯片与引脚进行的方式,增加了新型无引线贴片封装结构的可靠性,使得其寄生参数较小,性能得到优化;并且与引线相比,引脚框架更容易导热,使得该封装结构工作时,芯片温度更低,有利于提高芯片的使用寿命。并且,该结构通过在芯片框架两侧分别装置芯片,可实现芯片的双层封装,使得新型无引线贴片封装结构集成度更高。本发明还提供了一种新型无引线贴片封装结构的制造方法。
Description
技术领域
本发明涉及半导体制造领域,尤其涉及一种新型无引线贴片封装结构及其制造方法。
背景技术
器件的技术迭代,总体发展趋势是朝着更高功率密度、更高可靠性、更优的参数方向发展。
目前分立器件主流的贴片封装形式有SMA、SMB、SMC、SOP等封装(图1为传统主流贴片结构图),这种封装形式有以下优点:
1、封装形式,适用于高速贴片,可大幅度降低抛料率;
2、适合回流焊与波峰焊;
3、端头强度高,可达到GB/T 2423.29-1999 2MM标准;
4、适用于电脑、仪器、汽车电子、电源、通信、开关电源等电子产品;
因为以上原因,其使用场景非常灵活,市场用量非常之大。
但,这种封装需要通过引线连接芯片与引脚,引线与芯片及框架界面热膨胀系数相差大、易疲劳并且散热性差,使得可靠性不高,而且带来的寄生参数也较大。
发明内容
针对上述现有技术中的不足,本发明的目的在于提供一种新型无引线贴片封装结构及其制造方法,用以解决通过引线连接芯片与引脚时存在的引线与芯片及框架界面热膨胀系数相差大、易疲劳并且散热性差,使得可靠性不高、寄生参数也较大的问题。
本发明提供了一种新型无引线贴片封装结构,包括:引脚框架,其具有用于填充导电材料的通孔;以及芯片,通过填充在所述通孔中的导电材料与所述引脚框架形成电气连接。
优选地,还包括:芯片框架,用于承载芯片;以及壳体,用于承载芯片、芯片框架以及引脚框架。
优选地,所述引脚框架构造为板状结构,所述引脚框架包括连接部和开孔部,所述开孔部开设有多个所述通孔。
优选地,所述引脚框架包括两个平行相对的开孔部,所述两个开孔部通过连接部相连。
优选地,所述导电材料为导电胶或者焊料。
优选地,所述芯片框架的同一侧设置有一个或多个芯片,所述一个或多个芯片通过填充在所述通孔中的导电材料与同一引脚框架形成电气连接。
优选地,所述芯片框架的单侧或两侧分别设置有芯片,装置有芯片的芯片框架位于所述引脚框架的两个开孔部之间,位于所述芯片框架同一侧的所述开孔部与所述芯片通过填充在所述通孔中的导电材料形成电气连接。
优选地,所述芯片具有多电极时,将所述芯片的不同电极分别与不同引脚框架形成电气连接。
本发明提供一种新型无引线贴片封装结构,采用表面开设通孔的引脚框架,通过向通孔中填充导电材料的方式,使芯片与引脚框架形成电气相连,从而摒弃了现有技术中需要案通过引线将芯片与引脚进行的方式,增加了新型无引线贴片封装结构的可靠性,使得其寄生参数较小,性能得到优化;并且与引线相比,引脚框架更容易导热,使得该封装结构工作时,芯片温度更低,有利于提高芯片的使用寿命。并且,该结构通过在芯片框架两侧分别装置芯片,可实现芯片的双层封装,使得新型无引线贴片封装结构集成度更高。
本发明还提供了一种新型无引线贴片封装结构的制造方法,用于制造上述的新型无引线贴片封装结构,该方法包括:
步骤a:将芯片固定在芯片框架上;
步骤b:将引脚框架的开孔部与芯片相应位置对齐,向需要连接的区域对应的通孔内填充导电材料,使引脚框架与芯片形成电气连接;
步骤c:对步骤b中已形成电气连接的芯片框架进行注塑,并使其固化成型;
步骤d:去除注塑后芯片框架周围多余的溢料;
步骤e:将一排或多排引脚框架进行分离,形成单独的封装结构。
优选地,在步骤d之后,还包括步骤f:在引脚框架的表面进行电镀以获得镀层,电镀后使引脚框架在高温下进行烘烤。
对引脚框架进行电镀处理,可以防止外界环境的影响(潮湿和热),并使元器件在PCB板上容易焊接及提高导电性;而将电镀后的产品在高温下烘烤一段时间,可消除电镀层潜在的晶须生长的问题。
优选地,当导电材料为导电胶时,还包括在步骤b和步骤c之间的以下步骤:
步骤g:将通孔内的导电胶固化定型。
优选地,还包括在步骤c和步骤d之间的以下步骤:
步骤h:对已注塑的芯片框架再进行高温固化。
上述技术特征可以各种适合的方式组合或由等效的技术特征来替代,只要能够达到本发明的目的。
附图说明
在下文中将基于仅为非限定性的实施例并参考附图来对本发明进行更详细的描述。其中:
图1为现有技术中提供的传统主流贴片的结构示意图;
图2为本发明实施例一提供的新型无引线贴片封装结构的结构示意图;
图3为本发明实施例一中引脚框架的正面结构示意图;
图4为本发明实施例二提供的新型无引线贴片封装结构的结构示意图;
图5为本发明实施例三中引脚框架排布的示意图;
图6为本发明实施例四提供的新型无引线贴片封装结构的结构示意图。
附图说明:
1.芯片框架;
2.引脚框架;
3.绝缘胶;
4.芯片;
5.引线;
6.壳体;
8.导电材料;
21.连接部;
22.开孔部;
23.通孔。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚,下面将对本发明的技术方案进行清楚、完整的描述,基于本发明中的具体实施方式,本领域普通技术人员在没有做出创造性劳动的前提下所得到的所有其它实施方式,都属于本发明所保护的范围。
实施例一:
如图2-3所示,本实施例中提供的新型无引线贴片封装结构,包括:芯片框架1、引脚框架2、芯片4以及壳体6;壳体6用于承载芯片4、芯片框架1以及引脚框架2;壳体6包裹芯片4,使芯片4与外界隔离,以防止空气中的杂质对芯片电路的腐蚀而造成电气性能下降。芯片框架1用于承载芯片4;引脚框架2构造为板状结构,引脚框架2包括连接部21和开孔部22。连接部21暴露在壳体6之外,连接部21是新型无引线贴片封装结构与外部形成电气连接的连接点。开孔部22的面板上开设有多个通孔23。芯片4通过焊接或者粘贴的方式固定设置在芯片框架1上,将引脚框架2的开孔部22与芯片4的相应位置对齐,通过填充在通孔23中的导电材料8,使芯片4上的焊盘与引脚框2架形成电气连接。
本实施例中的导电材料8可以是导电胶或者焊料。
本实施例中使用绝缘胶3将芯片4粘贴在芯片框架1上。
实施例二:
在实施例一的基础上,芯片4的数量为两个,如图4所示,两个芯片4设置在芯片框架1的同侧,引脚框架2的开孔部设置有两组通孔23,两个芯片的位置分别与两组通孔相对应,并通过填充在对应一组通孔23中的导电材料8形成电气连接。本实施例中的贴片封装结构可实现单层封装多个芯片4,使得新型无引线贴片封装结构的集成度更高。
实施例三:
在实施例二的基础上,当芯片4存在多电极时,可以通过增加引脚框架2,使芯片4的不同电极分别与不同引脚框架2形成电气连接,本实施例中引脚框架2的排布如图5所示。
本实施例中的贴片封装结构可在芯片具有多极时,实现同一层封装多个芯片4,使得新型无引线贴片封装结构的集成度更高。
实施例四:
如图6所示,本实施例中提供的新型无引线贴片封装结构,包括:芯片框架1、引脚框架2、多个芯片4以及壳体6;壳体6用于承载芯片4、芯片框架1以及引脚框架2。壳体6包裹芯片4,使芯片4与外界隔离,以防止空气中的杂质对芯片电路的腐蚀而造成电气性能下降。芯片框架1用于承载芯片4。引脚框架2构造为板状结构,引脚框架2包括两个平行相对的开孔部22,以及连接两个开孔部22的连接部21;连接部21暴露在壳体6之外,连接部21是新型无引线贴片封装结构与外部形成电气连接的连接点。两个开孔部22的面板上分别开设有多组通孔23。
将芯片4分别设置在芯片框架1的两侧,装置有芯片4的芯片框架1位于引脚框架2的两个平行相对的开孔部22之间,两个开孔部22通过填充在通孔23中的导电材料8分别与位于芯片框架1同一侧的芯片4形成电气连接。本实施例中的贴片封装结构实现了芯片4的双层封装,使得新型无引线贴片封装结构的集成度更高。
引脚框架2可一体成型制成,进一步提高新型无引线贴片封装结构的集成度。
本实施例中的多个芯片4也可以只设置在芯片框架1的一侧,形成芯片4的单层封装。
本实施例中的导电材料8可以是导电胶或者焊料。
本实施例中使用绝缘胶3将芯片4粘贴在芯片框架1上。
本发明采用表面开设通孔23的引脚框架2,通过向通孔23中填充导电材料8的方式,使芯片4与引脚框架2形成电气相连,从而摒弃了现有技术中需要案通过引线将芯片4与引脚进行的方式,增加了新型无引线贴片封装结构的可靠性,使得其的寄生参数较小,性能得到优化。并且,该结构通过在芯片框架1两侧分别设置芯片4,可实现芯片4的双层封装,使得新型无引线贴片封装结构集成度更高。并且与引线5相比,引脚框架2更容易导热,使得该封装结构工作时,芯片4温度更低,有利于提高芯片4的使用寿命。
本发明还提供了一种新型无引线贴片封装结构的制造方法,用于制造上述的新型无引线贴片封装结构,该方法包括:
步骤a:将芯片4固定在芯片框架1上;
步骤b:将引脚框架2的开孔部22与芯片4相应位置对齐,向需要连接的区域对应的通孔23内填充导电材料8,使引脚框架2与芯片4形成电气连接;
步骤c:对步骤b中已形成电气连接的芯片框架1进行注塑,并使其固化成型;
步骤d:去除注塑后芯片框架1周围多余的溢料;
步骤e:将一排或多排引脚框架2进行分离,形成单独的封装结构。
为了防止外界环境的影响(潮湿和热),可以对引脚框架2进行电镀处理。在步骤d之后,实施步骤f:在引脚框架2的表面进行电镀以获得镀层,电镀后使引脚框架2在高温下进行烘烤。
对引脚框架2进行电镀处理可以防止外界环境(潮湿和热)的影响,并使元器件在PCB板上容易焊接及提高导电性;而将电镀后的引脚框架2在高温下烘烤一段时间,可消除电镀层潜在的晶须生长的问题。
该制造方法中,导电材料8可以是导电胶或者焊料。当导电材料8为导电胶时,在步骤b和步骤c之间,还包括步骤g:将通孔23内的导电胶固化定型。
在步骤c和步骤d之间,还包括后固化的步骤h:对已注塑的芯片框架1再进行高温固化。
最后应说明的是:以上实施方式及实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施方式及实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述实施方式或实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明实施方式或实施例技术方案的精神和范围。
Claims (9)
1.一种新型无引线贴片封装结构,其特征在于,包括:
引脚框架,具有用于填充导电材料的多个通孔;
芯片,通过填充在所述通孔中的导电材料与所述引脚框架形成电气连接;以及
芯片框架,用于承载芯片;所述引脚框架构造为板状结构,所述引脚框架包括连接部和两个平行相对的开孔部,所述开孔部开设有多个所述通孔,两个所述开孔部通过所述连接部相连;
所述芯片框架位于所述引脚框架的两个开孔部之间,所述芯片框架的两侧分别设置有芯片,位于所述芯片框架同一侧的开孔部与芯片通过填充在所述通孔中的导电材料形成电气连接。
2.根据权利要求1所述的新型无引线贴片封装结构,其特征在于,还包括:
壳体,用于承载芯片、芯片框架以及引脚框架。
3.根据权利要求1或2所述的新型无引线贴片封装结构,其特征在于,所述导电材料为导电胶或者焊料。
4.根据权利要求1或2所述的新型无引线贴片封装结构,其特征在于,所述芯片框架的同一侧设置有一个或多个芯片,所述一个或多个芯片通过填充在所述通孔中的导电材料与同一引脚框架形成电气连接。
5.根据权利要求1或2所述的新型无引线贴片封装结构,其特征在于,所述芯片具有多电极时,将所述芯片的不同电极分别与不同引脚框架形成电气连接。
6.一种新型无引线贴片封装结构的制造方法,其特征在于,用于制造如权利要求1-5中任一项所述的新型无引线贴片封装结构,所述制造方法包括:
步骤a:将芯片固定在芯片框架上;
步骤b:将引脚框架的开孔部与芯片相应位置对齐,向需要连接的区域对应的通孔内填充导电材料,使引脚框架与芯片形成电气连接;
步骤c:对步骤b中已形成电气连接的芯片框架进行注塑,并使其固化成型;
步骤d:去除注塑后芯片框架周围多余的溢料;
步骤e:将一排或多排引脚框架进行分离,形成单独的封装结构。
7.根据权利要求6所述的新型无引线贴片封装结构的制造方法,其特征在于,在步骤d之后,还包括:
步骤f:在引脚框架的表面进行电镀以获得镀层,电镀后使引脚框架在高温下进行烘烤。
8.根据权利要求6或7所述的新型无引线贴片封装结构的制造方法,其特征在于,当导电材料为导电胶时,还包括在步骤b和步骤c之间的以下步骤:
步骤g:将通孔内的导电胶固化定型。
9.根据权利要求6或7所述的新型无引线贴片封装结构的制造方法,其特征在于,还包括在步骤c和步骤d之间的以下步骤:
步骤h:对已注塑的芯片框架再进行高温固化。
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