CN103002725A - Fpc用电磁波屏蔽材料 - Google Patents

Fpc用电磁波屏蔽材料 Download PDF

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Publication number
CN103002725A
CN103002725A CN2012103420250A CN201210342025A CN103002725A CN 103002725 A CN103002725 A CN 103002725A CN 2012103420250 A CN2012103420250 A CN 2012103420250A CN 201210342025 A CN201210342025 A CN 201210342025A CN 103002725 A CN103002725 A CN 103002725A
Authority
CN
China
Prior art keywords
fpc
electromagnetic shielding
film
shielding material
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012103420250A
Other languages
English (en)
Chinese (zh)
Inventor
后藤信弘
小国盛稔
田中久道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimori Kogyo Co Ltd
Original Assignee
Fujimori Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimori Kogyo Co Ltd filed Critical Fujimori Kogyo Co Ltd
Priority to CN201510278068.0A priority Critical patent/CN105050314B/zh
Publication of CN103002725A publication Critical patent/CN103002725A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
CN2012103420250A 2011-09-16 2012-09-14 Fpc用电磁波屏蔽材料 Pending CN103002725A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510278068.0A CN105050314B (zh) 2011-09-16 2012-09-14 Fpc用电磁波屏蔽材料

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-203034 2011-09-16
JP2011203034A JP5712095B2 (ja) 2011-09-16 2011-09-16 Ｆｐｃ用電磁波シールド材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201510278068.0A Division CN105050314B (zh) 2011-09-16 2012-09-14 Fpc用电磁波屏蔽材料

Publications (1)

Publication Number Publication Date
CN103002725A true CN103002725A (zh) 2013-03-27

Family

ID=47930680

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201510278068.0A Active CN105050314B (zh) 2011-09-16 2012-09-14 Fpc用电磁波屏蔽材料
CN2012103420250A Pending CN103002725A (zh) 2011-09-16 2012-09-14 Fpc用电磁波屏蔽材料

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201510278068.0A Active CN105050314B (zh) 2011-09-16 2012-09-14 Fpc用电磁波屏蔽材料

Country Status (4)

Country Link
JP (1) JP5712095B2 (ja)
KR (2) KR101405361B1 (ja)
CN (2) CN105050314B (ja)
TW (1) TWI547236B (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103717050A (zh) * 2013-12-03 2014-04-09 明冠新材料股份有限公司 一种薄型柔性热固化电磁屏蔽胶膜
CN104639693A (zh) * 2015-02-28 2015-05-20 上海鼎讯电子有限公司 柔性连接件及移动终端
CN105101766A (zh) * 2014-05-14 2015-11-25 Tdk株式会社 磁抑制片及其制造方法
CN105407624A (zh) * 2014-09-04 2016-03-16 信越聚合物株式会社 电磁波屏蔽膜以及带有其的挠性印刷配线板的制造方法
CN105407693A (zh) * 2014-09-04 2016-03-16 信越聚合物株式会社 电磁波屏蔽膜及带有其的挠性印刷配线板的制造方法
CN106003916A (zh) * 2016-05-04 2016-10-12 胡银坤 一种电磁屏蔽膜
CN110049665A (zh) * 2015-02-02 2019-07-23 东洋油墨Sc控股株式会社 电磁波屏蔽片、印刷配线板及电子机器
CN111968536A (zh) * 2020-09-09 2020-11-20 武汉华星光电半导体显示技术有限公司 屏蔽带及显示模组的制备方法
CN112772011A (zh) * 2018-10-03 2021-05-07 东洋油墨Sc控股株式会社 电磁波遮蔽片以及电子零件搭载基板

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109404A (ja) * 2013-10-24 2015-06-11 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
KR102202145B1 (ko) 2014-03-28 2021-01-13 삼성디스플레이 주식회사 완충패드를 갖는 표시장치
JP2015220260A (ja) * 2014-05-14 2015-12-07 Tdk株式会社 磁気抑制シート及びその製造方法
JP2015220259A (ja) * 2014-05-14 2015-12-07 Tdk株式会社 磁気抑制シート及びその製造方法
JP6435540B2 (ja) * 2014-09-19 2018-12-12 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれら製造方法
JP6467701B2 (ja) * 2014-10-28 2019-02-13 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
JP6028290B2 (ja) * 2014-12-11 2016-11-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP6694763B2 (ja) * 2016-06-08 2020-05-20 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
KR102014583B1 (ko) * 2016-12-20 2019-08-26 주식회사 두산 커버레이용 필름
CN107953648A (zh) * 2017-12-27 2018-04-24 太仓金煜电子材料有限公司 一种阻燃级哑黑复合薄膜及其生产方法
JP6706654B2 (ja) * 2018-10-01 2020-06-10 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
JP6706655B2 (ja) * 2018-10-01 2020-06-10 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
JP2020064927A (ja) * 2018-10-16 2020-04-23 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板
JP7281888B2 (ja) * 2018-10-16 2023-05-26 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板及びその製造方法
CN109808267B (zh) * 2019-01-31 2021-01-29 常德力元新材料有限责任公司 一种电磁屏蔽复合材料及其制备方法
JP6857288B1 (ja) * 2019-05-29 2021-04-14 タツタ電線株式会社 電磁波シールドフィルム及びシールドプリント配線板
CN111073530B (zh) * 2019-12-02 2021-03-30 苏州市新广益电子有限公司 一种用于fpc电镀的导电胶膜及其生产工艺
CN111669957B (zh) * 2020-06-15 2022-08-02 江苏百旭电子新材料科技有限公司 一种fpc热压屏蔽膜及其生产方法
JP7420062B2 (ja) * 2020-12-24 2024-01-23 Dic株式会社 導電性積層体及び導電性粘着テープ
CN115734601A (zh) * 2022-11-24 2023-03-03 昆山雅森电子材料科技有限公司 一种高段差电磁干扰屏蔽膜及其制备方法

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JPH07122883A (ja) * 1993-10-21 1995-05-12 Nitto Denko Corp 電磁波シ−ルド材
CN1912042A (zh) * 2005-08-11 2007-02-14 日东电工株式会社 热固化型粘合接着剂组合物、热固化型粘合接着带或片以及布线电路基板
WO2010109842A1 (ja) * 2009-03-25 2010-09-30 三井・デュポンポリケミカル株式会社 電子部品用金属層付きフィルム、その製造方法および用途

Family Cites Families (9)

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JP4156233B2 (ja) * 2001-12-19 2008-09-24 大日本印刷株式会社 電磁波シールド材、及び電磁波シールド付きフラットケーブル
JP4201548B2 (ja) * 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2004364267A (ja) * 2003-05-09 2004-12-24 Matsushita Electric Ind Co Ltd 撮像装置
JP2005056906A (ja) * 2003-08-05 2005-03-03 Reiko Co Ltd 電磁波遮蔽性転写フイルム
KR100761435B1 (ko) * 2006-12-19 2007-09-27 구자은 수분산 폴리우레탄을 이용한 진공증착용 전자파 차폐 층
JP4436441B2 (ja) * 2007-06-08 2010-03-24 大日本印刷株式会社 電磁波シールド材及びその製造方法
JP2009246121A (ja) * 2008-03-31 2009-10-22 Nippon Steel Chem Co Ltd 電磁波シールド材及びその製造方法
JP5139156B2 (ja) * 2008-05-30 2013-02-06 タツタ電線株式会社 電磁波シールド材及びプリント配線板
KR100996070B1 (ko) 2010-04-29 2010-11-22 우영관 블랙쉴드 및 이의 제조방법, 블랙쉴드를 이용한 ｐｃｂ 또는 ｆｐｃ의 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122883A (ja) * 1993-10-21 1995-05-12 Nitto Denko Corp 電磁波シ−ルド材
CN1912042A (zh) * 2005-08-11 2007-02-14 日东电工株式会社 热固化型粘合接着剂组合物、热固化型粘合接着带或片以及布线电路基板
WO2010109842A1 (ja) * 2009-03-25 2010-09-30 三井・デュポンポリケミカル株式会社 電子部品用金属層付きフィルム、その製造方法および用途

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103717050A (zh) * 2013-12-03 2014-04-09 明冠新材料股份有限公司 一种薄型柔性热固化电磁屏蔽胶膜
CN105101766A (zh) * 2014-05-14 2015-11-25 Tdk株式会社 磁抑制片及其制造方法
CN105407624B (zh) * 2014-09-04 2018-05-01 信越聚合物株式会社 电磁波屏蔽膜以及带有其的挠性印刷配线板的制造方法
CN105407624A (zh) * 2014-09-04 2016-03-16 信越聚合物株式会社 电磁波屏蔽膜以及带有其的挠性印刷配线板的制造方法
CN105407693A (zh) * 2014-09-04 2016-03-16 信越聚合物株式会社 电磁波屏蔽膜及带有其的挠性印刷配线板的制造方法
CN105407693B (zh) * 2014-09-04 2018-06-29 信越聚合物株式会社 电磁波屏蔽膜及带有其的挠性印刷配线板的制造方法
CN110049665A (zh) * 2015-02-02 2019-07-23 东洋油墨Sc控股株式会社 电磁波屏蔽片、印刷配线板及电子机器
CN110049665B (zh) * 2015-02-02 2020-11-10 东洋油墨Sc控股株式会社 电磁波屏蔽片、印刷配线板及电子机器
CN104639693A (zh) * 2015-02-28 2015-05-20 上海鼎讯电子有限公司 柔性连接件及移动终端
CN106003916A (zh) * 2016-05-04 2016-10-12 胡银坤 一种电磁屏蔽膜
CN112772011A (zh) * 2018-10-03 2021-05-07 东洋油墨Sc控股株式会社 电磁波遮蔽片以及电子零件搭载基板
CN112772011B (zh) * 2018-10-03 2022-03-08 东洋油墨Sc控股株式会社 电磁波遮蔽片以及电子零件搭载基板
CN111968536A (zh) * 2020-09-09 2020-11-20 武汉华星光电半导体显示技术有限公司 屏蔽带及显示模组的制备方法

Also Published As

Publication number Publication date
JP2013065675A (ja) 2013-04-11
TW201325428A (zh) 2013-06-16
KR101405361B1 (ko) 2014-06-10
CN105050314B (zh) 2017-04-12
JP5712095B2 (ja) 2015-05-07
CN105050314A (zh) 2015-11-11
TWI547236B (zh) 2016-08-21
KR20130099799A (ko) 2013-09-06
KR20140063546A (ko) 2014-05-27

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Application publication date: 20130327