CN102986045B - Led封装装置 - Google Patents

Led封装装置 Download PDF

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Publication number
CN102986045B
CN102986045B CN201180034440.3A CN201180034440A CN102986045B CN 102986045 B CN102986045 B CN 102986045B CN 201180034440 A CN201180034440 A CN 201180034440A CN 102986045 B CN102986045 B CN 102986045B
Authority
CN
China
Prior art keywords
moulded parts
resin moulded
resin
led
packaging system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180034440.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN102986045A (zh
Inventor
阿部修
寺西将人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN102986045A publication Critical patent/CN102986045A/zh
Application granted granted Critical
Publication of CN102986045B publication Critical patent/CN102986045B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
CN201180034440.3A 2010-07-14 2011-07-12 Led封装装置 Active CN102986045B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-159650 2010-07-14
JP2010159650A JP5917796B2 (ja) 2010-07-14 2010-07-14 Ｌｅｄパッケージ装置
PCT/JP2011/066294 WO2012008600A1 (ja) 2010-07-14 2011-07-12 Ｌｅｄパッケージ装置

Publications (2)

Publication Number Publication Date
CN102986045A CN102986045A (zh) 2013-03-20
CN102986045B true CN102986045B (zh) 2016-05-18

Family

ID=45469593

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180034440.3A Active CN102986045B (zh) 2010-07-14 2011-07-12 Led封装装置

Country Status (7)

Country Link
JP (1) JP5917796B2 (ja)
KR (1) KR101572466B1 (ja)
CN (1) CN102986045B (ja)
DE (1) DE112011102336T5 (ja)
HK (1) HK1180453A1 (ja)
TW (1) TWI527270B (ja)
WO (1) WO2012008600A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102853341A (zh) * 2012-09-07 2013-01-02 佛山市香港科技大学Led-Fpd工程技术研究开发中心 Led彩色贴片模组、led彩色贴片装置及其加工工艺
JP6188408B2 (ja) * 2013-05-07 2017-08-30 三菱電機株式会社 Ｌｅｄ表示素子および映像表示装置
KR101483010B1 (ko) * 2013-07-29 2015-01-19 주식회사 굿엘이디 Ｌｅｄ 패키지
TWI570965B (zh) * 2015-02-26 2017-02-11 友達光電股份有限公司 發光裝置和顯示器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101202321A (zh) * 2006-12-11 2008-06-18 株式会社日立显示器 照明装置和使用该照明装置的显示装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563068U (ja) * 1992-01-31 1993-08-20 シャープ株式会社 樹脂封止型発光体
JP3235470B2 (ja) * 1996-06-18 2001-12-04 日亜化学工業株式会社 光半導体装置及びそれを用いた発光装置
JP3967459B2 (ja) * 1998-05-29 2007-08-29 ローム株式会社 半導体装置
JP2002198570A (ja) * 2000-12-26 2002-07-12 Toyoda Gosei Co Ltd 固体光素子
JP2002280617A (ja) * 2001-03-19 2002-09-27 Matsushita Electric Ind Co Ltd 照明装置
JP4282344B2 (ja) * 2003-02-28 2009-06-17 シチズン電子株式会社 発光ダイオード
TW200614548A (en) * 2004-07-09 2006-05-01 Matsushita Electric Ind Co Ltd Light-emitting device
JP2007116131A (ja) * 2005-09-21 2007-05-10 Sanyo Electric Co Ltd Ｌｅｄ発光装置
US7473939B2 (en) * 2006-01-06 2009-01-06 Formosa Epitaxy Incorporation Light-emitting diode structure with transparent window covering layer of multiple films
KR100867519B1 (ko) * 2006-02-02 2008-11-07 삼성전기주식회사 발광 다이오드 모듈
JP5357379B2 (ja) * 2006-02-23 2013-12-04 パナソニック株式会社 発光装置
TWI321857B (en) * 2006-07-21 2010-03-11 Epistar Corp A light emitting device
JP2008187031A (ja) * 2007-01-30 2008-08-14 Okaya Electric Ind Co Ltd 半導体チップ収納用の放熱パッケージ
US9061450B2 (en) * 2007-02-12 2015-06-23 Cree, Inc. Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
JP4924113B2 (ja) * 2007-03-08 2012-04-25 豊田合成株式会社 発光装置及び発光装置の製造方法
KR100855065B1 (ko) * 2007-04-24 2008-08-29 삼성전기주식회사 발광 다이오드 패키지

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101202321A (zh) * 2006-12-11 2008-06-18 株式会社日立显示器 照明装置和使用该照明装置的显示装置

Also Published As

Publication number Publication date
HK1180453A1 (zh) 2013-10-18
DE112011102336T5 (de) 2013-04-18
CN102986045A (zh) 2013-03-20
TWI527270B (zh) 2016-03-21
JP5917796B2 (ja) 2016-05-18
JP2012023189A (ja) 2012-02-02
KR101572466B1 (ko) 2015-11-27
WO2012008600A1 (ja) 2012-01-19
KR20130072236A (ko) 2013-07-01
TW201232839A (en) 2012-08-01

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Effective date: 20130509

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Effective date: 20130509

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Effective date of registration: 20130509

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Applicant after: Missubishi Electric Co., Ltd.

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