JP2012023189A - Ledパッケージ装置 - Google Patents
Ledパッケージ装置 Download PDFInfo
- Publication number
- JP2012023189A JP2012023189A JP2010159650A JP2010159650A JP2012023189A JP 2012023189 A JP2012023189 A JP 2012023189A JP 2010159650 A JP2010159650 A JP 2010159650A JP 2010159650 A JP2010159650 A JP 2010159650A JP 2012023189 A JP2012023189 A JP 2012023189A
- Authority
- JP
- Japan
- Prior art keywords
- resin mold
- light
- led
- leds
- package device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 101
- 239000011347 resin Substances 0.000 claims abstract description 101
- 239000003795 chemical substances by application Substances 0.000 description 23
- 238000009826 distribution Methods 0.000 description 19
- 230000000694 effects Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- CVEPFOUZABPRMK-UHFFFAOYSA-N 2-methylprop-2-enoic acid;styrene Chemical class CC(=C)C(O)=O.C=CC1=CC=CC=C1 CVEPFOUZABPRMK-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000019000 fluorine Nutrition 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002011 hydrophilic fumed silica Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002848 norbornenes Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- JUWGUJSXVOBPHP-UHFFFAOYSA-B titanium(4+);tetraphosphate Chemical compound [Ti+4].[Ti+4].[Ti+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O JUWGUJSXVOBPHP-UHFFFAOYSA-B 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】少なくとも3個以上の異なる波長のLED2R、2B、2Gと、各LED2R、2B、2Gが搭載されるリードフレーム1とを有するLEDパッケージ装置であって、上記リードフレーム1は上記各LED2R、2B、2Gが搭載されるカップ部5を備え、上記各LED2R、2B、2Gが搭載されたカップ部5内には、搭載された各LED2R、2B、2Gを覆うように光透過性の第1樹脂モールド11が設けられ、少なくとも上記カップ部5の開口を覆うように、光透過性の第2樹脂モールド12が形成され、上記第1樹脂モールド11と第2樹脂モールド12は、相互に屈折率が異なっている。このようにすることにより、カラーシフトを有効に防止し、カラーディスプレイ等に使用した際に良好な色再現性を発揮する。
【選択図】図1
Description
上記リードフレームは上記各LEDが搭載されるカップ部を備え、
上記各LEDが搭載されたカップ部内には、搭載された各LEDを覆うように光透過性の第1樹脂モールドが設けられ、
少なくとも上記カップ部の開口を覆うように、光透過性の第2樹脂モールドが形成され、
上記第1樹脂モールドと第2樹脂モールドは、相互に屈折率が異なっていることを要旨とする。
なお、ここでの屈折率は、真空を1.0としたときの絶対屈折率をいう。
ここで、良好な配光特性を得る理由としては、以下のことが推察される。まず、1種類の樹脂モールドでは赤色LED2Rの配光の特性を修正できなかったのに対し、2種類の樹脂モールドにより光の境界を設けることでレンズ効果が生じる。このレンズ効果により赤色LED2Rの配光特性が改善され、結果として全体としての配光特性が改善される。また、シリコーンがカップ部5よりもやや盛り上がることにより、凸レンズ効果が生まれ、その形状を変化させることにより、配光を制御することが出来る。
2R 赤色LED
2B 青色LED
2G 緑色LED
3 実装面
4 反射面
5 カップ部
6 脚部
7 端子部材
8 接続導線
10 樹脂モールド
11 第1樹脂モールド
12 第2樹脂モールド
Claims (5)
- 少なくとも3個以上の異なる波長のLEDと、各LEDが搭載されるリードフレームとを有するLEDパッケージ装置であって、
上記リードフレームは上記各LEDが搭載されるカップ部を備え、
上記各LEDが搭載されたカップ部内には、搭載された各LEDを覆うように光透過性の第1樹脂モールドが設けられ、
少なくとも上記カップ部の開口を覆うように、光透過性の第2樹脂モールドが形成され、
上記第1樹脂モールドと第2樹脂モールドは、相互に屈折率が異なっていることを特徴とするLEDパッケージ装置。 - 上記第1樹脂モールドは、その表面が、カップ部の開口縁と面一もしくはそれよりもやや盛り上がるように設けられている請求項1記載のLEDパッケージ装置。
- 上記リードフレームは脚部と端子部の少なくともいずれかを備え、上記第2樹脂モールドは、脚部および/または端子部の一部を露出するように形成されている請求項1または2記載のLEDパッケージ装置。
- 第2樹脂モールドの屈折率は、第1樹脂モールドの屈折率よりも大きい請求項1〜3のいずれか一項に記載のLEDパッケージ装置。
- 第1樹脂モールドには光拡散剤が含有されているが、第2樹脂モールドには光拡散剤が含有されていない請求項1〜4のいずれか一項に記載のLEDパッケージ装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010159650A JP5917796B2 (ja) | 2010-07-14 | 2010-07-14 | Ledパッケージ装置 |
PCT/JP2011/066294 WO2012008600A1 (ja) | 2010-07-14 | 2011-07-12 | Ledパッケージ装置 |
KR1020137000797A KR101572466B1 (ko) | 2010-07-14 | 2011-07-12 | Led 패키지 장치 |
CN201180034440.3A CN102986045B (zh) | 2010-07-14 | 2011-07-12 | Led封装装置 |
DE112011102336T DE112011102336T5 (de) | 2010-07-14 | 2011-07-12 | LED Paketanordnung |
TW100124971A TWI527270B (zh) | 2010-07-14 | 2011-07-14 | 發光二極體封裝裝置 |
HK13107338.1A HK1180453A1 (zh) | 2010-07-14 | 2013-06-24 | 封裝裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010159650A JP5917796B2 (ja) | 2010-07-14 | 2010-07-14 | Ledパッケージ装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015184994A Division JP6076429B2 (ja) | 2015-09-18 | 2015-09-18 | Ledパッケージ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012023189A true JP2012023189A (ja) | 2012-02-02 |
JP5917796B2 JP5917796B2 (ja) | 2016-05-18 |
Family
ID=45469593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010159650A Active JP5917796B2 (ja) | 2010-07-14 | 2010-07-14 | Ledパッケージ装置 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5917796B2 (ja) |
KR (1) | KR101572466B1 (ja) |
CN (1) | CN102986045B (ja) |
DE (1) | DE112011102336T5 (ja) |
HK (1) | HK1180453A1 (ja) |
TW (1) | TWI527270B (ja) |
WO (1) | WO2012008600A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014220312A (ja) * | 2013-05-07 | 2014-11-20 | 三菱電機株式会社 | Led表示素子および映像表示装置 |
WO2015016448A1 (ko) * | 2013-07-29 | 2015-02-05 | 주식회사 굿엘이디 | Led 패키지 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102853341A (zh) * | 2012-09-07 | 2013-01-02 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | Led彩色贴片模组、led彩色贴片装置及其加工工艺 |
TWI570965B (zh) * | 2015-02-26 | 2017-02-11 | 友達光電股份有限公司 | 發光裝置和顯示器 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0563068U (ja) * | 1992-01-31 | 1993-08-20 | シャープ株式会社 | 樹脂封止型発光体 |
JPH104216A (ja) * | 1996-06-18 | 1998-01-06 | Nichia Chem Ind Ltd | 光半導体装置及びそれを用いた発光装置 |
JPH11346006A (ja) * | 1998-05-29 | 1999-12-14 | Rohm Co Ltd | 半導体装置 |
JP2002198570A (ja) * | 2000-12-26 | 2002-07-12 | Toyoda Gosei Co Ltd | 固体光素子 |
JP2007227679A (ja) * | 2006-02-23 | 2007-09-06 | Matsushita Electric Works Ltd | 発光装置 |
US20080067534A1 (en) * | 2006-07-21 | 2008-03-20 | Epistar Corporation | Light emitting device |
JP2008147453A (ja) * | 2006-12-11 | 2008-06-26 | Hitachi Displays Ltd | 照明装置及びこの照明装置を用いた表示装置 |
JP2008187031A (ja) * | 2007-01-30 | 2008-08-14 | Okaya Electric Ind Co Ltd | 半導体チップ収納用の放熱パッケージ |
JP2008226909A (ja) * | 2007-03-08 | 2008-09-25 | Toyoda Gosei Co Ltd | 発光装置及び発光装置の製造方法 |
JP2008270822A (ja) * | 2007-04-24 | 2008-11-06 | Samsung Electro Mech Co Ltd | 発光ダイオードパッケージ |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002280617A (ja) * | 2001-03-19 | 2002-09-27 | Matsushita Electric Ind Co Ltd | 照明装置 |
JP4282344B2 (ja) * | 2003-02-28 | 2009-06-17 | シチズン電子株式会社 | 発光ダイオード |
TW200614548A (en) * | 2004-07-09 | 2006-05-01 | Matsushita Electric Ind Co Ltd | Light-emitting device |
JP2007116131A (ja) * | 2005-09-21 | 2007-05-10 | Sanyo Electric Co Ltd | Led発光装置 |
US7473939B2 (en) * | 2006-01-06 | 2009-01-06 | Formosa Epitaxy Incorporation | Light-emitting diode structure with transparent window covering layer of multiple films |
KR100867519B1 (ko) * | 2006-02-02 | 2008-11-07 | 삼성전기주식회사 | 발광 다이오드 모듈 |
US9061450B2 (en) * | 2007-02-12 | 2015-06-23 | Cree, Inc. | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
-
2010
- 2010-07-14 JP JP2010159650A patent/JP5917796B2/ja active Active
-
2011
- 2011-07-12 DE DE112011102336T patent/DE112011102336T5/de not_active Withdrawn
- 2011-07-12 WO PCT/JP2011/066294 patent/WO2012008600A1/ja active Application Filing
- 2011-07-12 KR KR1020137000797A patent/KR101572466B1/ko active IP Right Grant
- 2011-07-12 CN CN201180034440.3A patent/CN102986045B/zh active Active
- 2011-07-14 TW TW100124971A patent/TWI527270B/zh active
-
2013
- 2013-06-24 HK HK13107338.1A patent/HK1180453A1/zh unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0563068U (ja) * | 1992-01-31 | 1993-08-20 | シャープ株式会社 | 樹脂封止型発光体 |
JPH104216A (ja) * | 1996-06-18 | 1998-01-06 | Nichia Chem Ind Ltd | 光半導体装置及びそれを用いた発光装置 |
JPH11346006A (ja) * | 1998-05-29 | 1999-12-14 | Rohm Co Ltd | 半導体装置 |
JP2002198570A (ja) * | 2000-12-26 | 2002-07-12 | Toyoda Gosei Co Ltd | 固体光素子 |
JP2007227679A (ja) * | 2006-02-23 | 2007-09-06 | Matsushita Electric Works Ltd | 発光装置 |
US20080067534A1 (en) * | 2006-07-21 | 2008-03-20 | Epistar Corporation | Light emitting device |
JP2008147453A (ja) * | 2006-12-11 | 2008-06-26 | Hitachi Displays Ltd | 照明装置及びこの照明装置を用いた表示装置 |
JP2008187031A (ja) * | 2007-01-30 | 2008-08-14 | Okaya Electric Ind Co Ltd | 半導体チップ収納用の放熱パッケージ |
JP2008226909A (ja) * | 2007-03-08 | 2008-09-25 | Toyoda Gosei Co Ltd | 発光装置及び発光装置の製造方法 |
JP2008270822A (ja) * | 2007-04-24 | 2008-11-06 | Samsung Electro Mech Co Ltd | 発光ダイオードパッケージ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014220312A (ja) * | 2013-05-07 | 2014-11-20 | 三菱電機株式会社 | Led表示素子および映像表示装置 |
WO2015016448A1 (ko) * | 2013-07-29 | 2015-02-05 | 주식회사 굿엘이디 | Led 패키지 |
Also Published As
Publication number | Publication date |
---|---|
TWI527270B (zh) | 2016-03-21 |
JP5917796B2 (ja) | 2016-05-18 |
DE112011102336T5 (de) | 2013-04-18 |
KR101572466B1 (ko) | 2015-11-27 |
WO2012008600A1 (ja) | 2012-01-19 |
TW201232839A (en) | 2012-08-01 |
CN102986045A (zh) | 2013-03-20 |
CN102986045B (zh) | 2016-05-18 |
KR20130072236A (ko) | 2013-07-01 |
HK1180453A1 (zh) | 2013-10-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6849126B2 (ja) | 発光装置 | |
KR100880638B1 (ko) | 발광 소자 패키지 | |
KR101659357B1 (ko) | 발광소자패키지 | |
KR102594815B1 (ko) | 조명 모듈 및 이를 구비한 조명 장치 | |
KR20060049072A (ko) | 발광 다이오드 램프 | |
US20110235363A1 (en) | Light emitting device and light unit having the same | |
JP2000150968A (ja) | 動作安定性が保証される発光ダイオ―ド装置 | |
JP5917796B2 (ja) | Ledパッケージ装置 | |
JP2006278309A (ja) | 照明装置 | |
KR101220038B1 (ko) | 발광 장치 | |
KR101832306B1 (ko) | 발광소자 패키지 | |
JP2006310568A (ja) | 発光装置 | |
US11024779B2 (en) | LED device | |
JP6076429B2 (ja) | Ledパッケージ装置 | |
KR20110125066A (ko) | 발광소자패키지 | |
JP2006086408A (ja) | Led装置 | |
KR102640552B1 (ko) | 조명 모듈 및 이를 구비한 조명 장치 | |
KR101904263B1 (ko) | 발광소자 패키지 | |
KR102075522B1 (ko) | 발광소자패키지 | |
CN219283163U (zh) | 一种Mini LED背光源及其背光模组 | |
KR102224077B1 (ko) | 발광소자 | |
KR102487682B1 (ko) | 조명 장치 | |
KR101778151B1 (ko) | 발광소자 패키지 | |
KR20120006370A (ko) | 발광 소자 패키지 | |
KR20210034398A (ko) | 조명 모듈, 조명 장치 및 램프 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20130405 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20130527 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130529 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140527 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140711 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150106 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150306 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150623 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150918 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150928 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20151113 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160407 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5917796 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |