JP4146406B2 - 発光素子および発光素子の製造方法 - Google Patents
発光素子および発光素子の製造方法 Download PDFInfo
- Publication number
- JP4146406B2 JP4146406B2 JP2004252541A JP2004252541A JP4146406B2 JP 4146406 B2 JP4146406 B2 JP 4146406B2 JP 2004252541 A JP2004252541 A JP 2004252541A JP 2004252541 A JP2004252541 A JP 2004252541A JP 4146406 B2 JP4146406 B2 JP 4146406B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- fluorescent material
- led chip
- light
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Description
基板の一面に配置されるLEDチップの周囲で、かつ、上記基板の一面に、透光性樹脂をトランスファーモールド成型法により上面がほぼ平面状になるように形成する第1の工程と、
蛍光材料を含有する樹脂を、予め蛍光材料が均一に分布したシート状に形成して、上記透光性樹脂の平面状の上面のみに接着する第2の工程と
を備えることとしている。
2,2’,12,12’,12’’,22 透光性樹脂
3,3’,13,13’,13’’,23 蛍光材料含有樹脂
4 光反射部
5 基板部
6 配線部
7 金属細線
8 リードフレーム
15 基板
23 蛍光材料含有成型体
Claims (1)
- LEDチップの発光波長を蛍光材料により変換する面実装型の発光素子の製造方法において、
基板の一面に配置されるLEDチップの周囲で、かつ、上記基板の一面に、透光性樹脂をトランスファーモールド成型法により上面がほぼ平面状になるように形成する第1の工程と、
蛍光材料を含有する樹脂を、予め蛍光材料が均一に分布したシート状に形成して、上記透光性樹脂の平面状の上面のみに接着する第2の工程と
を備えることを特徴とする発光素子の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004252541A JP4146406B2 (ja) | 2004-08-31 | 2004-08-31 | 発光素子および発光素子の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004252541A JP4146406B2 (ja) | 2004-08-31 | 2004-08-31 | 発光素子および発光素子の製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10329194A Division JP2000156528A (ja) | 1998-11-19 | 1998-11-19 | 発光素子 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006209961A Division JP4212612B2 (ja) | 2006-08-01 | 2006-08-01 | 発光装置 |
JP2008121464A Division JP2008187212A (ja) | 2008-05-07 | 2008-05-07 | 面実装型発光素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004343149A JP2004343149A (ja) | 2004-12-02 |
JP4146406B2 true JP4146406B2 (ja) | 2008-09-10 |
Family
ID=33536040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004252541A Expired - Fee Related JP4146406B2 (ja) | 2004-08-31 | 2004-08-31 | 発光素子および発光素子の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4146406B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012081411A1 (ja) | 2010-12-13 | 2012-06-21 | 東レ株式会社 | 蛍光体シート、これを用いたledおよび発光装置ならびにledの製造方法 |
WO2012169289A1 (ja) | 2011-06-07 | 2012-12-13 | 東レ株式会社 | 樹脂シート積層体、その製造方法およびそれを用いた蛍光体含有樹脂シート付きledチップの製造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4820133B2 (ja) * | 2005-07-25 | 2011-11-24 | パナソニック電工株式会社 | 発光装置 |
JP4820135B2 (ja) * | 2005-09-20 | 2011-11-24 | パナソニック電工株式会社 | 発光装置 |
JP4965858B2 (ja) * | 2005-12-26 | 2012-07-04 | 株式会社東芝 | レンズ付発光ダイオード装置 |
JP2008060129A (ja) * | 2006-08-29 | 2008-03-13 | Nec Lighting Ltd | フルカラー発光ダイオード |
JP2008277248A (ja) * | 2006-11-22 | 2008-11-13 | Alps Electric Co Ltd | 導光部材の製造方法、導光部材及び導光板 |
JP5340191B2 (ja) * | 2010-02-02 | 2013-11-13 | 日東電工株式会社 | 光半導体装置 |
MY158950A (en) | 2010-02-19 | 2016-11-30 | Toray Industries | Phosphor-containing cured silicone, process for production of same, phosphor-containing silicone composition, precursor of the composition, sheets, led package, light-emitting device, and process for production of led-mounted substrate |
JP5775375B2 (ja) | 2010-07-27 | 2015-09-09 | 日東電工株式会社 | 発光ダイオード装置の製造方法 |
JP6215525B2 (ja) | 2012-10-23 | 2017-10-18 | スタンレー電気株式会社 | 半導体発光装置 |
-
2004
- 2004-08-31 JP JP2004252541A patent/JP4146406B2/ja not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012081411A1 (ja) | 2010-12-13 | 2012-06-21 | 東レ株式会社 | 蛍光体シート、これを用いたledおよび発光装置ならびにledの製造方法 |
KR20130143059A (ko) | 2010-12-13 | 2013-12-30 | 도레이 카부시키가이샤 | 형광체 시트, 이것을 사용한 led 및 발광 장치, 그리고 led의 제조 방법 |
EP2943046A1 (en) | 2010-12-13 | 2015-11-11 | Toray Industries, Inc. | Phosphor sheet, led and light emitting device using same and method for producing led |
JP5953750B2 (ja) * | 2010-12-13 | 2016-07-20 | 東レ株式会社 | 蛍光体シート、これを用いたledおよび発光装置ならびにledの製造方法 |
WO2012169289A1 (ja) | 2011-06-07 | 2012-12-13 | 東レ株式会社 | 樹脂シート積層体、その製造方法およびそれを用いた蛍光体含有樹脂シート付きledチップの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2004343149A (ja) | 2004-12-02 |
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