CN102985612B - 表面粘合嵌线挠性材料和表面粘合嵌线技术系统 - Google Patents

表面粘合嵌线挠性材料和表面粘合嵌线技术系统 Download PDF

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Publication number
CN102985612B
CN102985612B CN201180024552.0A CN201180024552A CN102985612B CN 102985612 B CN102985612 B CN 102985612B CN 201180024552 A CN201180024552 A CN 201180024552A CN 102985612 B CN102985612 B CN 102985612B
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CN
China
Prior art keywords
surface adhesive
rule
adhesive rule
flexible material
technology systems
Prior art date
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Application number
CN201180024552.0A
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English (en)
Chinese (zh)
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CN102985612A (zh
Inventor
大卫·伊詹
迈克尔·齐默尔
阿维夫·拉茨曼
科斯坦廷·斯皮里亚金
利奥尔·达汉
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Highcon Systems Ltd
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Highcon Systems Ltd
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Application filed by Highcon Systems Ltd filed Critical Highcon Systems Ltd
Priority to CN201710129946.1A priority Critical patent/CN107089035B/zh
Priority to CN202010936975.0A priority patent/CN112026278B/zh
Publication of CN102985612A publication Critical patent/CN102985612A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/384—Cutting-out; Stamping-out using rotating drums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/05—Filamentary, e.g. strands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31F—MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31F1/00—Mechanical deformation without removing material, e.g. in combination with laminating
    • B31F1/07—Embossing, i.e. producing impressions formed by locally deep-drawing, e.g. using rolls provided with complementary profiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31F—MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31F1/00—Mechanical deformation without removing material, e.g. in combination with laminating
    • B31F1/08—Creasing
    • B31F1/10—Creasing by rotary tools
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • B26F2001/4463—Methods and devices for rule setting, fixation, preparing cutting dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31F—MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31F2201/00—Mechanical deformation of paper or cardboard without removing material
    • B31F2201/07—Embossing
    • B31F2201/0707—Embossing by tools working continuously
    • B31F2201/0715—The tools being rollers
    • B31F2201/0717—Methods and means for forming the embossments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Ethylene-propylene or ethylene-propylene-diene copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Making Paper Articles (AREA)
  • Machines For Manufacturing Corrugated Board In Mechanical Paper-Making Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Adhesive Tapes (AREA)
  • Coating Apparatus (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201180024552.0A 2010-05-17 2011-05-17 表面粘合嵌线挠性材料和表面粘合嵌线技术系统 Active CN102985612B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201710129946.1A CN107089035B (zh) 2010-05-17 2011-05-17 表面粘合嵌线挠性材料和表面粘合嵌线技术系统
CN202010936975.0A CN112026278B (zh) 2010-05-17 2011-05-17 表面粘合嵌线挠性材料和表面粘合嵌线技术系统

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34518010P 2010-05-17 2010-05-17
US61/345,180 2010-05-17
US13/108,389 US9102818B2 (en) 2010-05-17 2011-05-16 Method and system for surface adhesive rule technology
US13/108,389 2011-05-16
PCT/IL2011/000389 WO2011145092A2 (en) 2010-05-17 2011-05-17 Method and system for surface adhesive rule technology

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN202010936975.0A Division CN112026278B (zh) 2010-05-17 2011-05-17 表面粘合嵌线挠性材料和表面粘合嵌线技术系统
CN201710129946.1A Division CN107089035B (zh) 2010-05-17 2011-05-17 表面粘合嵌线挠性材料和表面粘合嵌线技术系统

Publications (2)

Publication Number Publication Date
CN102985612A CN102985612A (zh) 2013-03-20
CN102985612B true CN102985612B (zh) 2017-03-29

Family

ID=44992149

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201180024552.0A Active CN102985612B (zh) 2010-05-17 2011-05-17 表面粘合嵌线挠性材料和表面粘合嵌线技术系统
CN201710129946.1A Active CN107089035B (zh) 2010-05-17 2011-05-17 表面粘合嵌线挠性材料和表面粘合嵌线技术系统
CN202010936975.0A Ceased CN112026278B (zh) 2010-05-17 2011-05-17 表面粘合嵌线挠性材料和表面粘合嵌线技术系统

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201710129946.1A Active CN107089035B (zh) 2010-05-17 2011-05-17 表面粘合嵌线挠性材料和表面粘合嵌线技术系统
CN202010936975.0A Ceased CN112026278B (zh) 2010-05-17 2011-05-17 表面粘合嵌线挠性材料和表面粘合嵌线技术系统

Country Status (8)

Country Link
US (1) US9102818B2 (enExample)
EP (4) EP2581212A1 (enExample)
JP (2) JP5969467B2 (enExample)
CN (3) CN102985612B (enExample)
AU (1) AU2011254215B2 (enExample)
CA (1) CA2799314A1 (enExample)
PL (1) PL2572037T3 (enExample)
WO (1) WO2011145092A2 (enExample)

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US9492984B2 (en) 2012-05-02 2016-11-15 Highcon Systems Ltd. Systems and methods for treating and handling cardboard sheets
WO2013164812A1 (en) * 2012-05-02 2013-11-07 Highcon Systems Ltd Method and system for stripping and blanking a cardboard
EP2897761B1 (en) 2012-09-19 2019-01-02 Highcon Systems Ltd Method and system for cardboard pretreatment
US10315376B2 (en) 2012-11-08 2019-06-11 The C.W. Zumbiel Company System and associated method for digital scoring of carton blanks
DE202012104394U1 (de) * 2012-11-14 2014-02-17 Franz Vossen Vorrichtung zum Stanzen von blattartigen Kartonwerkstoffen
GB2530723A (en) 2014-04-07 2016-04-06 Highcon Systems Ltd Formulations for producing polymeric rule dies
TR201807612T4 (tr) * 2015-10-06 2018-06-21 Sandvik Intellectual Property Gömme bir izleme birimi bulunan döner kesme aparatı.
ITUA20162806A1 (it) * 2016-04-21 2017-10-21 Sei S P A Procedimento e dispositivo per la preparazione di piastre per cilindri per la cordonatura di articoli di cartotecnica.
GB201609363D0 (en) 2016-05-26 2016-07-13 Highcon Systems Ltd System for impressing a relief pattern on a substrate
GB201609458D0 (en) 2016-05-29 2016-07-13 Highcon Systems Ltd System for creating a relief pattern on a substrate
PL3541708T3 (pl) * 2016-11-15 2022-07-25 Mespack Cloud, Llc Maszyna do cięcia torebek z ukształtowaną krawędzią obwodową, sposób i torebka
GB201702027D0 (en) * 2017-02-08 2017-03-22 Highcon Systems Ltd Multi-orifice nozzle and uses thereof
KR101838253B1 (ko) 2017-04-25 2018-03-14 주식회사 비에스피 플렉서블 소자 조립체 및 이의 제조방법
EP3648964B1 (en) * 2017-07-06 2024-10-23 Bobst Mex Sa Creasing machine and method for creasing sheets
CN110869141B (zh) * 2017-07-06 2022-03-18 鲍勃斯脱梅克斯股份有限公司 一种对片材进行压痕的方法
US12090571B2 (en) * 2018-04-10 2024-09-17 Talens Systems, S.L.U. Apparatus and method for processing cardboard
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US20220281173A1 (en) * 2019-07-22 2022-09-08 Sei S.P.A. Process and device for preparing plates for cylinders to treat items of the paper processing industry
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AU2011254215A1 (en) 2012-12-06
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