CN102934180B - 电感结构 - Google Patents

电感结构 Download PDF

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Publication number
CN102934180B
CN102934180B CN201180028266.1A CN201180028266A CN102934180B CN 102934180 B CN102934180 B CN 102934180B CN 201180028266 A CN201180028266 A CN 201180028266A CN 102934180 B CN102934180 B CN 102934180B
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CN
China
Prior art keywords
coil
conductive layer
core structure
top surface
contact
Prior art date
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Active
Application number
CN201180028266.1A
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English (en)
Chinese (zh)
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CN102934180A (zh
Inventor
P·斯迈斯
A·帕普
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National Semiconductor Corp
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National Semiconductor Corp
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Publication date
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Publication of CN102934180A publication Critical patent/CN102934180A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN201180028266.1A 2010-06-16 2011-05-30 电感结构 Active CN102934180B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/816,788 US8410576B2 (en) 2010-06-16 2010-06-16 Inductive structure and method of forming the inductive structure with an attached core structure
US12/816,788 2010-06-16
PCT/US2011/038483 WO2011159458A2 (en) 2010-06-16 2011-05-30 Inductive structure

Publications (2)

Publication Number Publication Date
CN102934180A CN102934180A (zh) 2013-02-13
CN102934180B true CN102934180B (zh) 2016-01-20

Family

ID=45328493

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180028266.1A Active CN102934180B (zh) 2010-06-16 2011-05-30 电感结构

Country Status (6)

Country Link
US (1) US8410576B2 (https=)
EP (1) EP2583287B1 (https=)
JP (1) JP5783620B2 (https=)
CN (1) CN102934180B (https=)
TW (1) TWI549279B (https=)
WO (1) WO2011159458A2 (https=)

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CA2814350C (en) * 2010-10-23 2018-05-22 Pop Test LLC Devices and formulations for detecting, screening and monitoring levels of certain constituents in bodily fluids and method
US8686722B2 (en) * 2011-08-26 2014-04-01 National Semiconductor Corporation Semiconductor fluxgate magnetometer
FR2979790B1 (fr) * 2011-09-07 2013-10-11 Commissariat Energie Atomique Capteur de courant
US8525281B2 (en) * 2011-10-19 2013-09-03 Texas Instruments Incorporated Z-axis semiconductor fluxgate magnetometer
US8803648B2 (en) 2012-05-03 2014-08-12 Qualcomm Mems Technologies, Inc. Three-dimensional multilayer solenoid transformer
CN102915986B (zh) 2012-11-08 2015-04-01 南通富士通微电子股份有限公司 芯片封装结构
US9379077B2 (en) 2012-11-08 2016-06-28 Nantong Fujitsu Microelectronics Co., Ltd. Metal contact for semiconductor device
US9548282B2 (en) * 2012-11-08 2017-01-17 Nantong Fujitsu Microelectronics Co., Ltd. Metal contact for semiconductor device
KR101983137B1 (ko) * 2013-03-04 2019-05-28 삼성전기주식회사 파워 인덕터 및 그 제조방법
KR102260374B1 (ko) * 2015-03-16 2021-06-03 삼성전기주식회사 인덕터 및 인덕터의 제조 방법
JP6507027B2 (ja) * 2015-05-19 2019-04-24 新光電気工業株式会社 インダクタ及びその製造方法
KR102105388B1 (ko) * 2015-11-20 2020-04-28 삼성전기주식회사 코일 부품 및 그 제조 방법
KR102163056B1 (ko) * 2015-12-30 2020-10-08 삼성전기주식회사 코일 전자 부품 및 그 제조방법
JP6658681B2 (ja) * 2017-06-22 2020-03-04 株式会社村田製作所 積層インダクタの製造方法および積層インダクタ
US10930425B2 (en) * 2017-10-25 2021-02-23 Samsung Electro-Mechanics Co., Ltd. Inductor
CN107808756B (zh) * 2017-11-09 2020-03-20 西安华为技术有限公司 一种平板变压器及开关电源适配器
KR102064041B1 (ko) * 2017-12-11 2020-01-08 삼성전기주식회사 코일 부품
KR101973448B1 (ko) * 2017-12-11 2019-04-29 삼성전기주식회사 코일 부품
KR102047595B1 (ko) * 2017-12-11 2019-11-21 삼성전기주식회사 인덕터 및 그 제조방법
US11398334B2 (en) * 2018-07-30 2022-07-26 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier comprising embedded inductor with an inlay
US20210375540A1 (en) * 2020-05-28 2021-12-02 Texas Instruments Incorporated Integrated magnetic device with laminate embedded magnetic core

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5336921A (en) * 1992-01-27 1994-08-09 Motorola, Inc. Vertical trench inductor
US5852866A (en) * 1996-04-04 1998-12-29 Robert Bosch Gmbh Process for producing microcoils and microtransformers
US6054329A (en) * 1996-08-23 2000-04-25 International Business Machines Corporation Method of forming an integrated circuit spiral inductor with ferromagnetic liner
US7262680B2 (en) * 2004-02-27 2007-08-28 Illinois Institute Of Technology Compact inductor with stacked via magnetic cores for integrated circuits

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US5852866A (en) * 1996-04-04 1998-12-29 Robert Bosch Gmbh Process for producing microcoils and microtransformers
US6054329A (en) * 1996-08-23 2000-04-25 International Business Machines Corporation Method of forming an integrated circuit spiral inductor with ferromagnetic liner
US7262680B2 (en) * 2004-02-27 2007-08-28 Illinois Institute Of Technology Compact inductor with stacked via magnetic cores for integrated circuits

Also Published As

Publication number Publication date
TWI549279B (zh) 2016-09-11
JP5783620B2 (ja) 2015-09-24
CN102934180A (zh) 2013-02-13
TW201222804A (en) 2012-06-01
EP2583287A4 (en) 2017-11-15
EP2583287B1 (en) 2021-03-17
JP2013535107A (ja) 2013-09-09
WO2011159458A2 (en) 2011-12-22
US20110310579A1 (en) 2011-12-22
WO2011159458A3 (en) 2012-04-05
US8410576B2 (en) 2013-04-02
EP2583287A2 (en) 2013-04-24

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