CN102928621B - 一种高量程加速度传感器封装中的平面互连结构及方法 - Google Patents
一种高量程加速度传感器封装中的平面互连结构及方法 Download PDFInfo
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Citations (4)
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KR20030045950A (ko) * | 2001-12-03 | 2003-06-12 | 삼성전자주식회사 | 방열판을 구비한 멀티 칩 패키지 |
CN101339927A (zh) * | 2007-07-02 | 2009-01-07 | 英飞凌科技股份有限公司 | 半导体器件 |
CN101587847A (zh) * | 2009-06-15 | 2009-11-25 | 美新半导体(无锡)有限公司 | 利用pcb基板进行垂直互连的多芯片组件封装方法 |
CN102259827A (zh) * | 2011-06-25 | 2011-11-30 | 中北大学 | Mems高量程加速度传感器的封装方法 |
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US7195952B2 (en) * | 2005-03-22 | 2007-03-27 | Micrel, Inc. | Schottky diode device with aluminum pickup of backside cathode |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR20030045950A (ko) * | 2001-12-03 | 2003-06-12 | 삼성전자주식회사 | 방열판을 구비한 멀티 칩 패키지 |
CN101339927A (zh) * | 2007-07-02 | 2009-01-07 | 英飞凌科技股份有限公司 | 半导体器件 |
CN101587847A (zh) * | 2009-06-15 | 2009-11-25 | 美新半导体(无锡)有限公司 | 利用pcb基板进行垂直互连的多芯片组件封装方法 |
CN102259827A (zh) * | 2011-06-25 | 2011-11-30 | 中北大学 | Mems高量程加速度传感器的封装方法 |
Non-Patent Citations (2)
Title |
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MEMS高量程加速度传感器封装技术仿真研究;杨玉华等;《中北大学学报(自然科学版)》;20111231;第32卷(第3期);336-341 * |
杨玉华等.MEMS高量程加速度传感器封装技术仿真研究.《中北大学学报(自然科学版)》.2011,第32卷(第3期),336-341. |
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Inventor after: Shi Yunbo Inventor after: Pan Longli Inventor after: Qian Yuanying Inventor after: Liu Jun Inventor after: Tang Jun Inventor after: Ma Xihong Inventor after: Guo Tao Inventor after: Yang Wei Inventor after: Li Jie Inventor after: Zhang Xiaoming Inventor after: Zhou Zhijun Inventor before: Liu Jun Inventor before: Pan Longli Inventor before: Qian Yuanying Inventor before: Shi Yunbo Inventor before: Tang Jun Inventor before: Ma Xihong Inventor before: Guo Tao Inventor before: Yang Wei Inventor before: Li Jie Inventor before: Zhang Xiaoming Inventor before: Zhou Zhijun |
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