CN102916130A - 电路板、制造电路板的方法、显示器和电子单元 - Google Patents

电路板、制造电路板的方法、显示器和电子单元 Download PDF

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Publication number
CN102916130A
CN102916130A CN2012102629447A CN201210262944A CN102916130A CN 102916130 A CN102916130 A CN 102916130A CN 2012102629447 A CN2012102629447 A CN 2012102629447A CN 201210262944 A CN201210262944 A CN 201210262944A CN 102916130 A CN102916130 A CN 102916130A
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CN
China
Prior art keywords
wiring layer
layer
insulating barrier
circuit board
surface energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN2012102629447A
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English (en)
Chinese (zh)
Inventor
八木岩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
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Sony Corp
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Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN102916130A publication Critical patent/CN102916130A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/80—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00

Landscapes

  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN2012102629447A 2011-08-02 2012-07-26 电路板、制造电路板的方法、显示器和电子单元 Pending CN102916130A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011168967A JP2013033843A (ja) 2011-08-02 2011-08-02 回路基板、回路基板の製造方法、表示装置および電子機器
JP2011-168967 2011-08-02

Publications (1)

Publication Number Publication Date
CN102916130A true CN102916130A (zh) 2013-02-06

Family

ID=47614430

Family Applications (1)

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CN2012102629447A Pending CN102916130A (zh) 2011-08-02 2012-07-26 电路板、制造电路板的方法、显示器和电子单元

Country Status (3)

Country Link
US (1) US8629444B2 (enExample)
JP (1) JP2013033843A (enExample)
CN (1) CN102916130A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107578703A (zh) * 2016-07-04 2018-01-12 株式会社日本显示器 显示装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102305948B1 (ko) * 2013-12-18 2021-09-28 루미리즈 홀딩 비.브이. Led 형광체 패키지를 위한 반사성 땜납 마스크 층
US10211378B2 (en) * 2016-01-29 2019-02-19 Nichia Corporation Light emitting device and method for manufacturing same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007079359A (ja) * 2005-09-16 2007-03-29 Ricoh Co Ltd 画像表示装置。
CN101965097A (zh) * 2009-07-23 2011-02-02 揖斐电株式会社 印刷线路板及其制造方法
US20110183501A1 (en) * 2003-03-19 2011-07-28 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor and manufacturing method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008023630A1 (en) * 2006-08-24 2008-02-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
JP5352967B2 (ja) 2006-11-17 2013-11-27 株式会社リコー 多層配線構造の製造方法及び多層配線構造
JP5008448B2 (ja) * 2007-04-20 2012-08-22 キヤノン株式会社 インクジェット記録ヘッド用の基板の製造方法
JP2011014724A (ja) 2009-07-02 2011-01-20 Seiko Epson Corp 半導体装置、半導体装置の製造方法、電子機器および電子機器の製造方法
US8299467B2 (en) * 2009-12-28 2012-10-30 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor and fabrication method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110183501A1 (en) * 2003-03-19 2011-07-28 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor and manufacturing method thereof
JP2007079359A (ja) * 2005-09-16 2007-03-29 Ricoh Co Ltd 画像表示装置。
CN101965097A (zh) * 2009-07-23 2011-02-02 揖斐电株式会社 印刷线路板及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107578703A (zh) * 2016-07-04 2018-01-12 株式会社日本显示器 显示装置

Also Published As

Publication number Publication date
US8629444B2 (en) 2014-01-14
US20130032807A1 (en) 2013-02-07
JP2013033843A (ja) 2013-02-14

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Application publication date: 20130206