CN102893216A - 精细图案的生产方法 - Google Patents
精细图案的生产方法 Download PDFInfo
- Publication number
- CN102893216A CN102893216A CN2011800240550A CN201180024055A CN102893216A CN 102893216 A CN102893216 A CN 102893216A CN 2011800240550 A CN2011800240550 A CN 2011800240550A CN 201180024055 A CN201180024055 A CN 201180024055A CN 102893216 A CN102893216 A CN 102893216A
- Authority
- CN
- China
- Prior art keywords
- resin
- resin layer
- resin bed
- pattern
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/56—Organic absorbers, e.g. of photo-resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-125031 | 2010-05-31 | ||
| JP2010125031A JP5495954B2 (ja) | 2010-05-31 | 2010-05-31 | 微細パターンの製造方法 |
| PCT/JP2011/062156 WO2011152292A1 (en) | 2010-05-31 | 2011-05-20 | Process for producing fine pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102893216A true CN102893216A (zh) | 2013-01-23 |
Family
ID=45066661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011800240550A Pending CN102893216A (zh) | 2010-05-31 | 2011-05-20 | 精细图案的生产方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20130029272A1 (enExample) |
| JP (1) | JP5495954B2 (enExample) |
| CN (1) | CN102893216A (enExample) |
| WO (1) | WO2011152292A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104441995A (zh) * | 2013-09-22 | 2015-03-25 | 珠海纳思达企业管理有限公司 | 液体喷墨头的制造方法、液体喷墨头和打印设备 |
| CN109422238A (zh) * | 2017-08-21 | 2019-03-05 | 船井电机株式会社 | 三维结构、制作三维结构的方法、及流体喷射装置 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101924710B1 (ko) | 2014-05-21 | 2018-12-03 | 오사카 유니버시티 | 레지스트패턴 형성방법, 레지스트잠상 형성장치 및 레지스트재료 |
| JP6632225B2 (ja) * | 2015-06-05 | 2020-01-22 | キヤノン株式会社 | 吐出口面の撥水処理方法 |
| JP6552070B2 (ja) * | 2015-11-25 | 2019-07-31 | 国立大学法人大阪大学 | レジストパターン形成方法およびレジスト材料 |
| JP6399252B2 (ja) * | 2016-03-28 | 2018-10-03 | 日立金属株式会社 | 回路基板および窒化ケイ素焼結基板の製造方法 |
| KR102788187B1 (ko) * | 2019-03-28 | 2025-04-01 | 제이에스알 가부시키가이샤 | 레지스트 하층막 형성용 조성물, 레지스트 하층막, 레지스트 하층막의 형성 방법, 패터닝된 기판의 제조 방법 및 화합물 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101464A (ja) * | 1988-10-11 | 1990-04-13 | Matsushita Electric Ind Co Ltd | パターン形成方法 |
| US4939070A (en) * | 1986-07-28 | 1990-07-03 | Brunsvold William R | Thermally stable photoresists with high sensitivity |
| EP1152296A1 (en) * | 1999-09-02 | 2001-11-07 | Toray Industries, Inc. | Photosensitive resin printing plate and method for producing photosensitive printing plate having projection |
| WO2007063690A1 (en) * | 2005-12-02 | 2007-06-07 | Canon Kabushiki Kaisha | Liquid discharge head producing method |
| US20080020288A1 (en) * | 2004-09-08 | 2008-01-24 | Tokyo Ohka Kogyo Co., Ltd. | Resist Composition and Process for Formation of Resist Patterns |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4845692B2 (ja) * | 2005-12-02 | 2011-12-28 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
-
2010
- 2010-05-31 JP JP2010125031A patent/JP5495954B2/ja not_active Expired - Fee Related
-
2011
- 2011-05-20 CN CN2011800240550A patent/CN102893216A/zh active Pending
- 2011-05-20 WO PCT/JP2011/062156 patent/WO2011152292A1/en not_active Ceased
- 2011-05-20 US US13/639,077 patent/US20130029272A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4939070A (en) * | 1986-07-28 | 1990-07-03 | Brunsvold William R | Thermally stable photoresists with high sensitivity |
| JPH02101464A (ja) * | 1988-10-11 | 1990-04-13 | Matsushita Electric Ind Co Ltd | パターン形成方法 |
| EP1152296A1 (en) * | 1999-09-02 | 2001-11-07 | Toray Industries, Inc. | Photosensitive resin printing plate and method for producing photosensitive printing plate having projection |
| US20080020288A1 (en) * | 2004-09-08 | 2008-01-24 | Tokyo Ohka Kogyo Co., Ltd. | Resist Composition and Process for Formation of Resist Patterns |
| WO2007063690A1 (en) * | 2005-12-02 | 2007-06-07 | Canon Kabushiki Kaisha | Liquid discharge head producing method |
| CN101316713A (zh) * | 2005-12-02 | 2008-12-03 | 佳能株式会社 | 液体排出头的制造方法 |
Non-Patent Citations (1)
| Title |
|---|
| KAZUAKI KUDO.ET.AL.: "3-Phenyl-3,3-ethylenedioxy-1-propyl Sulfonates as Acid", 《CHEM. MATER》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104441995A (zh) * | 2013-09-22 | 2015-03-25 | 珠海纳思达企业管理有限公司 | 液体喷墨头的制造方法、液体喷墨头和打印设备 |
| CN104441995B (zh) * | 2013-09-22 | 2016-08-10 | 珠海赛纳打印科技股份有限公司 | 液体喷墨头的制造方法、液体喷墨头和打印设备 |
| CN109422238A (zh) * | 2017-08-21 | 2019-03-05 | 船井电机株式会社 | 三维结构、制作三维结构的方法、及流体喷射装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011252967A (ja) | 2011-12-15 |
| US20130029272A1 (en) | 2013-01-31 |
| WO2011152292A1 (en) | 2011-12-08 |
| JP5495954B2 (ja) | 2014-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130123 |