CN102876274B - 太阳能电池硅片切割工艺用胶 - Google Patents
太阳能电池硅片切割工艺用胶 Download PDFInfo
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- CN102876274B CN102876274B CN201210402654.8A CN201210402654A CN102876274B CN 102876274 B CN102876274 B CN 102876274B CN 201210402654 A CN201210402654 A CN 201210402654A CN 102876274 B CN102876274 B CN 102876274B
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- solar cell
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- silicon chip
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 239000003292 glue Substances 0.000 title claims abstract description 19
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 19
- 239000010703 silicon Substances 0.000 title claims abstract description 19
- 238000005520 cutting process Methods 0.000 title claims abstract description 16
- 235000012431 wafers Nutrition 0.000 title abstract 4
- 239000004952 Polyamide Substances 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 11
- 229920002647 polyamide Polymers 0.000 claims abstract description 11
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 8
- 150000001412 amines Chemical class 0.000 claims abstract description 6
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 5
- -1 alicyclic amine Chemical class 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 16
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000013530 defoamer Substances 0.000 claims description 10
- 239000006185 dispersion Substances 0.000 claims description 10
- 239000012752 auxiliary agent Substances 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 5
- HWRRQRKPNKYPBW-UHFFFAOYSA-N 2,4-dimethylcyclohexan-1-amine Chemical compound CC1CCC(N)C(C)C1 HWRRQRKPNKYPBW-UHFFFAOYSA-N 0.000 claims description 5
- 239000011863 silicon-based powder Substances 0.000 claims description 5
- 229960001124 trientine Drugs 0.000 claims description 5
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 claims description 4
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 4
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 3
- WFCSWCVEJLETKA-UHFFFAOYSA-N 2-piperazin-1-ylethanol Chemical compound OCCN1CCNCC1 WFCSWCVEJLETKA-UHFFFAOYSA-N 0.000 claims description 3
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 3
- KSMVBYPXNKCPAJ-UHFFFAOYSA-N 4-Methylcyclohexylamine Chemical compound CC1CCC(N)CC1 KSMVBYPXNKCPAJ-UHFFFAOYSA-N 0.000 claims description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 3
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims description 2
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 claims description 2
- 230000002528 anti-freeze Effects 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000004721 Polyphenylene oxide Substances 0.000 abstract 1
- 239000003085 diluting agent Substances 0.000 abstract 1
- 229920000570 polyether Polymers 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- 210000004027 cell Anatomy 0.000 description 12
- 238000012856 packing Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 5
- 238000010907 mechanical stirring Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
Abstract
Description
固化时间/h | 剪切强度/MPa | 邵氏硬度 | 脱胶时间/s | |
实施例一 | 2 | 16.8 | 87 | 320 |
实施例二 | 2 | 15.9 | 85 | 290 |
实施例三 | 2 | 17.3 | 89 | 350 |
实施例四 | 2 | 16.3 | 86 | 308 |
Claims (6)
Priority Applications (1)
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CN201210402654.8A CN102876274B (zh) | 2012-10-22 | 2012-10-22 | 太阳能电池硅片切割工艺用胶 |
Applications Claiming Priority (1)
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CN201210402654.8A CN102876274B (zh) | 2012-10-22 | 2012-10-22 | 太阳能电池硅片切割工艺用胶 |
Publications (2)
Publication Number | Publication Date |
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CN102876274A CN102876274A (zh) | 2013-01-16 |
CN102876274B true CN102876274B (zh) | 2014-03-26 |
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CN201210402654.8A Active CN102876274B (zh) | 2012-10-22 | 2012-10-22 | 太阳能电池硅片切割工艺用胶 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103552162A (zh) * | 2013-09-30 | 2014-02-05 | 洛阳鸿泰半导体有限公司 | 一种消除硅片粘接面线痕的方法 |
CN103881638B (zh) * | 2014-03-12 | 2015-08-26 | 南京艾布纳密封技术有限公司 | 太阳能电池硅片切割工艺用胶 |
DE102014226826A1 (de) * | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
CN105255424B (zh) * | 2015-11-17 | 2018-04-17 | 湖北南北车新材料有限公司 | 一种拉伸强度和伸长率可调控的防水粘接胶及其制备方法 |
KR102395468B1 (ko) * | 2016-12-21 | 2022-05-09 | 에보니크 오퍼레이션즈 게엠베하 | N-히드록실 에틸 피페리딘 (nhep): 에폭시 시스템을 위한 신규 경화제 |
CN106995663A (zh) * | 2017-03-22 | 2017-08-01 | 合肥仁德电子科技有限公司 | 一种用于集成主板的工艺用胶 |
CN115746765B (zh) * | 2022-11-23 | 2024-10-11 | 常州时创能源股份有限公司 | 一种胶板一体化粘棒胶水及工艺 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007149377A2 (en) * | 2006-06-19 | 2007-12-27 | Ashland Licensing And Intellectual Property Llc | Epoxy adhesive composition and use thereof |
CN101724368A (zh) * | 2009-11-24 | 2010-06-09 | 烟台德邦科技有限公司 | 一种抗冲击环氧结构胶及其制备方法 |
CN101818037A (zh) * | 2009-02-27 | 2010-09-01 | 汉高(中国)投资有限公司 | 一种室温固化环氧结构胶粘剂组合物及其制备方法 |
JP2010536953A (ja) * | 2007-08-17 | 2010-12-02 | ダウ グローバル テクノロジーズ インコーポレイティド | 二液型耐衝撃性エポキシ接着剤 |
CN102093832A (zh) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | 一种高抗冲击环氧树脂填充胶及其制备方法 |
CN102304275A (zh) * | 2011-07-25 | 2012-01-04 | 株洲时代新材料科技股份有限公司 | 永磁电机用室温固化环氧树脂灌封胶及制备方法和工艺 |
-
2012
- 2012-10-22 CN CN201210402654.8A patent/CN102876274B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007149377A2 (en) * | 2006-06-19 | 2007-12-27 | Ashland Licensing And Intellectual Property Llc | Epoxy adhesive composition and use thereof |
JP2010536953A (ja) * | 2007-08-17 | 2010-12-02 | ダウ グローバル テクノロジーズ インコーポレイティド | 二液型耐衝撃性エポキシ接着剤 |
CN101818037A (zh) * | 2009-02-27 | 2010-09-01 | 汉高(中国)投资有限公司 | 一种室温固化环氧结构胶粘剂组合物及其制备方法 |
CN101724368A (zh) * | 2009-11-24 | 2010-06-09 | 烟台德邦科技有限公司 | 一种抗冲击环氧结构胶及其制备方法 |
CN102093832A (zh) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | 一种高抗冲击环氧树脂填充胶及其制备方法 |
CN102304275A (zh) * | 2011-07-25 | 2012-01-04 | 株洲时代新材料科技股份有限公司 | 永磁电机用室温固化环氧树脂灌封胶及制备方法和工艺 |
Non-Patent Citations (1)
Title |
---|
李子东等.《固化剂》,《分散剂》,《消泡剂》.《胶粘剂助剂》.化学工业出版社,2009,全文. * |
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Address after: 211200 No. 10 Qianjin Road, Lishui Economic Development Zone, Nanjing, Jiangsu Patentee after: NANJING ABNEN SEALING TECHNOLOGY STOCK CO.,LTD. Address before: 211200 No. 10 Qianjin Road, Lishui Economic Development Zone, Nanjing, Jiangsu Patentee before: NANJING ABNEN SEALING TECHNOLOGY Co.,Ltd. |
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Denomination of invention: Glue for cutting process of solar cell silicon wafers Effective date of registration: 20191015 Granted publication date: 20140326 Pledgee: Bank of China Limited by Share Ltd. Lishui branch Pledgor: NANJING ABNEN SEALING TECHNOLOGY STOCK CO.,LTD. Registration number: Y2019320000197 |
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Address after: No. 10 Qianjin Road, Lishui Economic Development Zone, Nanjing, Jiangsu Province, 211200 Patentee after: Nanjing Abner New Materials Co.,Ltd. Address before: No. 10 Qianjin Road, Lishui Economic Development Zone, Nanjing City, Jiangsu Province, 211200 Patentee before: NANJING ABNEN SEALING TECHNOLOGY STOCK CO.,LTD. |
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Date of cancellation: 20230928 Granted publication date: 20140326 Pledgee: Bank of China Limited by Share Ltd. Lishui branch Pledgor: NANJING ABNEN SEALING TECHNOLOGY STOCK CO.,LTD. Registration number: Y2019320000197 |