CN102859729B - 光电子器件和用于制造光电子器件的方法 - Google Patents
光电子器件和用于制造光电子器件的方法 Download PDFInfo
- Publication number
- CN102859729B CN102859729B CN201180021811.4A CN201180021811A CN102859729B CN 102859729 B CN102859729 B CN 102859729B CN 201180021811 A CN201180021811 A CN 201180021811A CN 102859729 B CN102859729 B CN 102859729B
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- opto
- radiation
- electronic device
- semiconductor chip
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
Landscapes
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010028407.6A DE102010028407B4 (de) | 2010-04-30 | 2010-04-30 | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
| DE102010028407.6 | 2010-04-30 | ||
| PCT/EP2011/055621 WO2011134777A1 (de) | 2010-04-30 | 2011-04-11 | Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102859729A CN102859729A (zh) | 2013-01-02 |
| CN102859729B true CN102859729B (zh) | 2016-01-13 |
Family
ID=44221169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180021811.4A Active CN102859729B (zh) | 2010-04-30 | 2011-04-11 | 光电子器件和用于制造光电子器件的方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9293671B2 (enExample) |
| EP (1) | EP2532034B1 (enExample) |
| JP (1) | JP5705304B2 (enExample) |
| KR (1) | KR101862818B1 (enExample) |
| CN (1) | CN102859729B (enExample) |
| DE (1) | DE102010028407B4 (enExample) |
| TW (1) | TW201203625A (enExample) |
| WO (1) | WO2011134777A1 (enExample) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010024864B4 (de) | 2010-06-24 | 2021-01-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauteil |
| DE102012101160A1 (de) * | 2012-02-14 | 2013-08-14 | Osram Opto Semiconductors Gmbh | Lichtquellenmodul |
| DE102012025896B4 (de) | 2012-06-01 | 2024-10-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Modul |
| DE102012209325B4 (de) | 2012-06-01 | 2021-09-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Modul |
| JP6097040B2 (ja) * | 2012-09-20 | 2017-03-15 | スタンレー電気株式会社 | 半導体発光装置およびその製造方法 |
| KR102137682B1 (ko) * | 2012-11-07 | 2020-07-27 | 루미리즈 홀딩 비.브이. | 파장 변환 발광 다이오드 |
| EP2917937B1 (en) * | 2012-11-07 | 2016-11-16 | Koninklijke Philips N.V. | Method for manufacturing a light emitting device including a filter and a protective layer |
| DE102012113003A1 (de) * | 2012-12-21 | 2014-04-03 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
| DE102013204291A1 (de) * | 2013-03-12 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| DE102013102621A1 (de) * | 2013-03-14 | 2014-09-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
| DE102013103983B4 (de) | 2013-04-19 | 2021-09-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Vielzahl strahlungsemittierender Halbleiterchips |
| DE102013212928A1 (de) * | 2013-07-03 | 2015-01-08 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements |
| CN105493301A (zh) | 2013-07-08 | 2016-04-13 | 皇家飞利浦有限公司 | 波长转换的半导体发光器件 |
| DE102013214235A1 (de) * | 2013-07-19 | 2015-01-22 | Osram Gmbh | Leuchtvorrichtung mit Halbleiterlichtquellen und umlaufendem Damm |
| KR101567807B1 (ko) | 2014-05-07 | 2015-11-11 | (주)씨티엘 | 형광체 시트를 이용한 led 패키지 및 형광체 시트의 제조방법 |
| KR20150129356A (ko) * | 2014-05-12 | 2015-11-20 | 엘지이노텍 주식회사 | 발광 장치 |
| CN104022207B (zh) * | 2014-05-23 | 2018-05-18 | 广东晶科电子股份有限公司 | 一种白光led芯片及其制作方法 |
| CN106489204B (zh) * | 2014-07-18 | 2020-12-22 | 亮锐控股有限公司 | 光源 |
| KR102252994B1 (ko) * | 2014-12-18 | 2021-05-20 | 삼성전자주식회사 | 발광소자 패키지 및 발광소자 패키지용 파장 변환 필름 |
| JP2018527711A (ja) * | 2015-09-02 | 2018-09-20 | ルミレッズ ホールディング ベーフェー | Ledモジュール及び照明モジュール |
| US10763404B2 (en) * | 2015-10-05 | 2020-09-01 | Maven Optronics Co., Ltd. | Light emitting device with beveled reflector and manufacturing method of the same |
| TWI669836B (zh) * | 2015-10-05 | 2019-08-21 | 行家光電股份有限公司 | 發光裝置的製造方法 |
| TWI677114B (zh) * | 2015-10-05 | 2019-11-11 | 行家光電股份有限公司 | 具導角反射結構的發光裝置 |
| CN107039572B (zh) * | 2016-02-03 | 2019-05-10 | 行家光电股份有限公司 | 具非对称性光形的发光装置及其制造方法 |
| EP3200248B1 (en) | 2016-01-28 | 2020-09-30 | Maven Optronics Co., Ltd. | Light emitting device with asymmetrical radiation pattern and manufacturing method of the same |
| KR102486308B1 (ko) * | 2016-06-10 | 2023-01-10 | 삼성전자주식회사 | 디스플레이 모듈 및 이에 대한 코팅방법 |
| CN107845717A (zh) * | 2016-09-21 | 2018-03-27 | 深圳市兆驰节能照明股份有限公司 | Csp光源及其制造方法和制造模具 |
| US11043619B2 (en) | 2016-12-15 | 2021-06-22 | Lumileds Llc | LED module with high near field contrast ratio |
| WO2018108734A1 (en) * | 2016-12-15 | 2018-06-21 | Lumileds Holding B.V. | Led module with high near field contrast ratio |
| DE102017104851A1 (de) * | 2017-03-08 | 2018-09-13 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von zumindest einem optoelektronischen Bauelement und optoelektronisches Bauelement |
| US10224358B2 (en) * | 2017-05-09 | 2019-03-05 | Lumileds Llc | Light emitting device with reflective sidewall |
| US11502228B2 (en) * | 2017-08-04 | 2022-11-15 | Osram Opto Semiconductors Gmbh | Method of producing an optoelectronic semiconductor device |
| JP6432654B2 (ja) * | 2017-08-16 | 2018-12-05 | 日亜化学工業株式会社 | 半導体発光装置 |
| CN110797330B (zh) * | 2018-08-03 | 2024-12-06 | 海迪科(南通)光电科技有限公司 | 大角度出光光源、面光源模组及出光光源的制备方法 |
| DE102018130510A1 (de) * | 2018-11-30 | 2020-06-04 | Vishay Semiconductor Gmbh | Strahlungssensor und Herstellungsverfahren hierfür |
| CN112054110A (zh) * | 2019-06-05 | 2020-12-08 | 比亚迪股份有限公司 | 一种led封装结构及其车灯 |
| DE102019121881A1 (de) * | 2019-08-14 | 2021-02-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements |
| WO2023008864A1 (ko) * | 2021-07-30 | 2023-02-02 | 서울반도체주식회사 | 발광 모듈 및 그것을 갖는 헤드 램프 |
| DE102021131112A1 (de) * | 2021-11-26 | 2023-06-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierendes bauelement und verfahren zur herstellung eines strahlungsemittierenden bauelements |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004165308A (ja) * | 2002-11-11 | 2004-06-10 | Nichia Chem Ind Ltd | 発光装置 |
| CN101088172A (zh) * | 2004-11-03 | 2007-12-12 | 特里多尼克光电子有限公司 | 具有颜色转换材料的发光二极管排布 |
| WO2009069671A1 (ja) * | 2007-11-29 | 2009-06-04 | Nichia Corporation | 発光装置及びその製造方法 |
| WO2010035206A1 (en) * | 2008-09-25 | 2010-04-01 | Koninklijke Philips Electronics N.V. | Coated light emitting device and method for coating thereof |
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|---|---|---|---|---|
| JP2966289B2 (ja) | 1994-09-01 | 1999-10-25 | 三菱電線工業株式会社 | モールド成形品の製造方法およびこれに用いられる基板 |
| DE19755734A1 (de) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
| JP2001223285A (ja) | 2000-02-09 | 2001-08-17 | Rohm Co Ltd | チップ型半導体装置及びその製造方法 |
| JP2002050800A (ja) * | 2000-05-24 | 2002-02-15 | Nichia Chem Ind Ltd | 発光装置及びその形成方法 |
| DE10229067B4 (de) * | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| DE102004021233A1 (de) * | 2004-04-30 | 2005-12-01 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung |
| WO2006023149A2 (en) * | 2004-07-08 | 2006-03-02 | Color Kinetics Incorporated | Led package methods and systems |
| JP4756841B2 (ja) * | 2004-09-29 | 2011-08-24 | スタンレー電気株式会社 | 半導体発光装置の製造方法 |
| DE102005046420B4 (de) * | 2004-10-04 | 2019-07-11 | Stanley Electric Co. Ltd. | Verfahren zur Herstellung einer Licht emittierenden Halbleitervorrichtung |
| KR20070119750A (ko) * | 2005-04-26 | 2007-12-20 | 가부시끼가이샤 도시바 | 백색 led, 그것을 이용한 백라이트, 및 액정 표시 장치 |
| JP5073242B2 (ja) * | 2006-08-10 | 2012-11-14 | シャープ株式会社 | 光源装置の製造方法 |
| JP5186800B2 (ja) * | 2007-04-28 | 2013-04-24 | 日亜化学工業株式会社 | 窒化物半導体発光素子、これを備える発光装置及び窒化物半導体発光素子の製造方法 |
| JP2008306151A (ja) * | 2007-05-09 | 2008-12-18 | Hitachi Chem Co Ltd | 光半導体用エポキシ樹脂組成物、ならびにこれを用いた光半導体素子搭載用基板および光半導体装置 |
| US8049237B2 (en) | 2007-12-28 | 2011-11-01 | Nichia Corporation | Light emitting device |
| JP5169263B2 (ja) | 2008-02-01 | 2013-03-27 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
| JP5224173B2 (ja) * | 2008-03-07 | 2013-07-03 | スタンレー電気株式会社 | 半導体発光装置 |
| JP4808244B2 (ja) * | 2008-12-09 | 2011-11-02 | スタンレー電気株式会社 | 半導体発光装置およびその製造方法 |
-
2010
- 2010-04-30 DE DE102010028407.6A patent/DE102010028407B4/de active Active
-
2011
- 2011-04-11 US US13/695,606 patent/US9293671B2/en active Active
- 2011-04-11 JP JP2013506569A patent/JP5705304B2/ja active Active
- 2011-04-11 KR KR1020127031513A patent/KR101862818B1/ko active Active
- 2011-04-11 EP EP11714529.2A patent/EP2532034B1/de active Active
- 2011-04-11 WO PCT/EP2011/055621 patent/WO2011134777A1/de not_active Ceased
- 2011-04-11 CN CN201180021811.4A patent/CN102859729B/zh active Active
- 2011-04-26 TW TW100114426A patent/TW201203625A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004165308A (ja) * | 2002-11-11 | 2004-06-10 | Nichia Chem Ind Ltd | 発光装置 |
| CN101088172A (zh) * | 2004-11-03 | 2007-12-12 | 特里多尼克光电子有限公司 | 具有颜色转换材料的发光二极管排布 |
| WO2009069671A1 (ja) * | 2007-11-29 | 2009-06-04 | Nichia Corporation | 発光装置及びその製造方法 |
| WO2010035206A1 (en) * | 2008-09-25 | 2010-04-01 | Koninklijke Philips Electronics N.V. | Coated light emitting device and method for coating thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102859729A (zh) | 2013-01-02 |
| TW201203625A (en) | 2012-01-16 |
| DE102010028407A1 (de) | 2011-11-03 |
| KR20130058708A (ko) | 2013-06-04 |
| JP2013526047A (ja) | 2013-06-20 |
| US20130113010A1 (en) | 2013-05-09 |
| US9293671B2 (en) | 2016-03-22 |
| EP2532034B1 (de) | 2021-06-09 |
| WO2011134777A1 (de) | 2011-11-03 |
| DE102010028407B4 (de) | 2021-01-14 |
| EP2532034A1 (de) | 2012-12-12 |
| KR101862818B1 (ko) | 2018-05-30 |
| JP5705304B2 (ja) | 2015-04-22 |
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| C14 | Grant of patent or utility model | ||
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