CN102714170B - 处理系统 - Google Patents

处理系统 Download PDF

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Publication number
CN102714170B
CN102714170B CN201180006294.3A CN201180006294A CN102714170B CN 102714170 B CN102714170 B CN 102714170B CN 201180006294 A CN201180006294 A CN 201180006294A CN 102714170 B CN102714170 B CN 102714170B
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CN
China
Prior art keywords
pick
handled object
carrying
treatment system
temporary transient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180006294.3A
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English (en)
Chinese (zh)
Other versions
CN102714170A (zh
Inventor
冈野真也
池田岳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN102714170A publication Critical patent/CN102714170A/zh
Application granted granted Critical
Publication of CN102714170B publication Critical patent/CN102714170B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201180006294.3A 2010-10-14 2011-10-03 处理系统 Active CN102714170B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010231682A JP5473857B2 (ja) 2010-10-14 2010-10-14 搬送装置および処理システム
JP2010-231682 2010-10-14
PCT/JP2011/072761 WO2012049998A1 (ja) 2010-10-14 2011-10-03 処理システム

Publications (2)

Publication Number Publication Date
CN102714170A CN102714170A (zh) 2012-10-03
CN102714170B true CN102714170B (zh) 2015-06-10

Family

ID=45938227

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180006294.3A Active CN102714170B (zh) 2010-10-14 2011-10-03 处理系统

Country Status (4)

Country Link
JP (1) JP5473857B2 (ja)
KR (1) KR101477874B1 (ja)
CN (1) CN102714170B (ja)
WO (1) WO2012049998A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11139190B2 (en) * 2019-04-23 2021-10-05 Applied Materials, Inc. Equipment front end modules including multiple aligners, assemblies, and methods
US11328947B1 (en) * 2021-01-26 2022-05-10 Kawasaki Jukogyo Kabushiki Kaisha Aligner apparatus and alignment method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1774607A (zh) * 2004-03-25 2006-05-17 东京毅力科创株式会社 立式热处理装置和被处理体移送方法
CN1805127A (zh) * 2004-12-24 2006-07-19 东京毅力科创株式会社 基板处理装置及其搬送定位方法
CN101103452A (zh) * 2005-11-28 2008-01-09 东京毅力科创株式会社 基板处理装置
CN101107701A (zh) * 2005-01-21 2008-01-16 东京毅力科创株式会社 基板搬送处理装置和基板搬送处理装置的故障对策方法以及基板搬送处理装置的故障对策程序
CN101355021A (zh) * 2007-07-26 2009-01-28 东京毅力科创株式会社 基板搬送模块以及基板处理系统
CN101661874A (zh) * 2008-08-29 2010-03-03 东京毅力科创株式会社 热处理装置和热处理方法
CN101855719A (zh) * 2008-02-27 2010-10-06 东京毅力科创株式会社 负载锁定装置和基板冷却方法
JP4607756B2 (ja) * 2005-12-22 2011-01-05 川崎重工業株式会社 ロボットハンドおよび基板搬送ロボット

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4258964B2 (ja) * 2000-09-26 2009-04-30 神鋼電機株式会社 ウェハ移載装置
US6752585B2 (en) * 2001-06-13 2004-06-22 Applied Materials Inc Method and apparatus for transferring a semiconductor substrate
JP4300067B2 (ja) * 2003-07-02 2009-07-22 株式会社日立ハイテクノロジーズ 基板搬送装置、基板搬送方法、及び半導体デバイスの製造方法
JP3999723B2 (ja) * 2003-10-08 2007-10-31 川崎重工業株式会社 基板保持装置
JP2005311306A (ja) * 2004-03-25 2005-11-04 Tokyo Electron Ltd 縦型熱処理装置及び被処理体移載方法
JP5336885B2 (ja) * 2009-03-03 2013-11-06 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1774607A (zh) * 2004-03-25 2006-05-17 东京毅力科创株式会社 立式热处理装置和被处理体移送方法
CN1805127A (zh) * 2004-12-24 2006-07-19 东京毅力科创株式会社 基板处理装置及其搬送定位方法
CN101107701A (zh) * 2005-01-21 2008-01-16 东京毅力科创株式会社 基板搬送处理装置和基板搬送处理装置的故障对策方法以及基板搬送处理装置的故障对策程序
CN101103452A (zh) * 2005-11-28 2008-01-09 东京毅力科创株式会社 基板处理装置
JP4607756B2 (ja) * 2005-12-22 2011-01-05 川崎重工業株式会社 ロボットハンドおよび基板搬送ロボット
CN101355021A (zh) * 2007-07-26 2009-01-28 东京毅力科创株式会社 基板搬送模块以及基板处理系统
CN101855719A (zh) * 2008-02-27 2010-10-06 东京毅力科创株式会社 负载锁定装置和基板冷却方法
CN101661874A (zh) * 2008-08-29 2010-03-03 东京毅力科创株式会社 热处理装置和热处理方法

Also Published As

Publication number Publication date
KR20120082470A (ko) 2012-07-23
CN102714170A (zh) 2012-10-03
KR101477874B1 (ko) 2014-12-30
WO2012049998A1 (ja) 2012-04-19
JP2012084802A (ja) 2012-04-26
JP5473857B2 (ja) 2014-04-16

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