CN102695744A - 用于电层合体的存储稳定的环氧树脂组合物 - Google Patents

用于电层合体的存储稳定的环氧树脂组合物 Download PDF

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Publication number
CN102695744A
CN102695744A CN2010800604266A CN201080060426A CN102695744A CN 102695744 A CN102695744 A CN 102695744A CN 2010800604266 A CN2010800604266 A CN 2010800604266A CN 201080060426 A CN201080060426 A CN 201080060426A CN 102695744 A CN102695744 A CN 102695744A
Authority
CN
China
Prior art keywords
epoxy resin
composition
epoxy
storage stability
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800604266A
Other languages
English (en)
Chinese (zh)
Inventor
R.L.赫恩
W.E.默瑟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blue Cube Intellectual Property Co Ltd
Original Assignee
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies LLC filed Critical Dow Global Technologies LLC
Priority to CN201611176356.6A priority Critical patent/CN106751517A/zh
Publication of CN102695744A publication Critical patent/CN102695744A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
    • C08G65/223—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring containing halogens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2010800604266A 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物 Pending CN102695744A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611176356.6A CN106751517A (zh) 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25885809P 2009-11-06 2009-11-06
US61/258,858 2009-11-06
PCT/US2010/052023 WO2011056352A1 (en) 2009-11-06 2010-10-08 Storage stable epoxy resin compositions for electrical laminates

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201611176356.6A Division CN106751517A (zh) 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物

Publications (1)

Publication Number Publication Date
CN102695744A true CN102695744A (zh) 2012-09-26

Family

ID=43707754

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2010800604266A Pending CN102695744A (zh) 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物
CN201611176356.6A Pending CN106751517A (zh) 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201611176356.6A Pending CN106751517A (zh) 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物

Country Status (7)

Country Link
US (1) US8980376B2 (https=)
EP (1) EP2496632B1 (https=)
JP (1) JP5798566B2 (https=)
KR (1) KR20120115247A (https=)
CN (2) CN102695744A (https=)
TW (1) TWI496834B (https=)
WO (1) WO2011056352A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103045043A (zh) * 2012-12-11 2013-04-17 金继典 一种酒瓶透明光亮面油及其制备工艺

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX345825B (es) * 2010-05-13 2017-02-16 Agrigenetics Inc Uso de silaje de maiz de nervadura central marron en reses para reemplazar al maiz.
JP6447557B2 (ja) * 2016-03-24 2019-01-09 日亜化学工業株式会社 発光装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1315974A (zh) * 1998-08-14 2001-10-03 陶氏化学公司 热固性树脂组合物的粘度改性剂
WO2008051373A2 (en) * 2006-10-19 2008-05-02 Dow Global Technologies Inc. Curable epoxy resin composition having improved adhesion to metal substrates and process for making coated and fiber-reinforced composite article

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
JPS6038421A (ja) 1983-08-11 1985-02-28 Mitsubishi Petrochem Co Ltd エポキシ樹脂組成物
US4550128A (en) 1984-04-16 1985-10-29 International Business Machines Corporation Epoxy composition
EP0507271A3 (en) 1991-04-03 1993-04-21 The Dow Chemical Company Epoxy resin compositions for use in electrical laminates
US5670250A (en) 1995-02-24 1997-09-23 Polyclad Laminates, Inc. Circuit board prepreg with reduced dielectric constant
JPH10168287A (ja) 1996-12-06 1998-06-23 Dainippon Ink & Chem Inc エポキシ樹脂組成物
WO1998031750A1 (en) 1997-01-21 1998-07-23 The Dow Chemical Company Latent catalysts for epoxy curing systems
WO2000076764A1 (en) * 1999-06-10 2000-12-21 Isola Laminate Systems Corp. Epoxy resin, styrene-maleic anhydride copolymer and flexibilizer
US6245696B1 (en) * 1999-06-25 2001-06-12 Honeywell International Inc. Lasable bond-ply materials for high density printed wiring boards
US6361923B1 (en) * 1999-08-17 2002-03-26 International Business Machines Corporation Laser ablatable material and its use
CN1423678B (zh) * 1999-12-13 2010-11-10 陶氏环球技术公司 含磷元素阻燃剂环氧树脂组合物
EP1418206B1 (de) * 2002-10-19 2004-10-13 LEUNA-Harze GmbH Härtbare Epoxidharzzusammensetzung
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
TWI290945B (en) * 2005-11-09 2007-12-11 Taiwan Union Technology Corp Application of electrical material in high frequency and manufacturing method of the same
KR20080077639A (ko) 2005-12-22 2008-08-25 다우 글로벌 테크놀로지스 인크. 경화성 에폭시 수지 조성물 및 이로부터 제조한 적층물
US8313571B2 (en) * 2007-09-21 2012-11-20 Microchem Corp. Compositions and processes for manufacturing printed electronics
JP5235155B2 (ja) * 2009-04-08 2013-07-10 パナソニック株式会社 微細樹脂構造体及び光電回路基板の製造方法、微細樹脂構造体及び光電回路基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1315974A (zh) * 1998-08-14 2001-10-03 陶氏化学公司 热固性树脂组合物的粘度改性剂
WO2008051373A2 (en) * 2006-10-19 2008-05-02 Dow Global Technologies Inc. Curable epoxy resin composition having improved adhesion to metal substrates and process for making coated and fiber-reinforced composite article

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103045043A (zh) * 2012-12-11 2013-04-17 金继典 一种酒瓶透明光亮面油及其制备工艺

Also Published As

Publication number Publication date
US20120225212A1 (en) 2012-09-06
KR20120115247A (ko) 2012-10-17
WO2011056352A1 (en) 2011-05-12
JP2013510224A (ja) 2013-03-21
TW201116576A (en) 2011-05-16
JP5798566B2 (ja) 2015-10-21
US8980376B2 (en) 2015-03-17
EP2496632A1 (en) 2012-09-12
TWI496834B (zh) 2015-08-21
CN106751517A (zh) 2017-05-31
EP2496632B1 (en) 2015-04-29

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20160314

Address after: michigan

Applicant after: BLUE CUBE INTELLECTUAL PROPERTY CO., LTD.

Address before: michigan

Applicant before: Dow Global Technologies Inc.

RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20120926