CN102684064B - 光模块的制造方法 - Google Patents

光模块的制造方法 Download PDF

Info

Publication number
CN102684064B
CN102684064B CN201210070077.7A CN201210070077A CN102684064B CN 102684064 B CN102684064 B CN 102684064B CN 201210070077 A CN201210070077 A CN 201210070077A CN 102684064 B CN102684064 B CN 102684064B
Authority
CN
China
Prior art keywords
mentioned
load
optical element
optical
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210070077.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN102684064A (zh
Inventor
依田薰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Publication of CN102684064A publication Critical patent/CN102684064A/zh
Application granted granted Critical
Publication of CN102684064B publication Critical patent/CN102684064B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07341—Controlling the bonding environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/301—Bonding techniques, e.g. hybrid bonding
    • H10W80/314—Bonding techniques, e.g. hybrid bonding characterized by direct bonding of pads or other interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]

Landscapes

  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
CN201210070077.7A 2011-03-18 2012-03-16 光模块的制造方法 Expired - Fee Related CN102684064B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-060916 2011-03-18
JP2011060916A JP5636319B2 (ja) 2011-03-18 2011-03-18 光モジュールの製造方法

Publications (2)

Publication Number Publication Date
CN102684064A CN102684064A (zh) 2012-09-19
CN102684064B true CN102684064B (zh) 2016-12-14

Family

ID=45936772

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210070077.7A Expired - Fee Related CN102684064B (zh) 2011-03-18 2012-03-16 光模块的制造方法

Country Status (4)

Country Link
US (1) US9214446B2 (https=)
EP (1) EP2500757B1 (https=)
JP (1) JP5636319B2 (https=)
CN (1) CN102684064B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5847473B2 (ja) * 2011-07-21 2016-01-20 シチズンホールディングス株式会社 光モジュール
JP5230829B1 (ja) * 2012-03-09 2013-07-10 株式会社フジクラ 水分の除去方法、光ファイバの半田付け方法、及び、半導体レーザモジュールの製造方法
JP5925062B2 (ja) * 2012-06-18 2016-05-25 シチズンホールディングス株式会社 光モジュール及び光モジュールの製造方法
DE102015002176A1 (de) * 2015-02-24 2016-08-25 Jenoptik Laser Gmbh Verfahren zum Herstellen eines Diodenlasers und Diodenlaser
US10126504B2 (en) * 2015-05-27 2018-11-13 The United States Of America, As Represented By The Secretary Of The Navy Antireflective surface structures for active and passive optical fiber
CN105711224B (zh) * 2016-03-25 2017-11-24 湖南新中合光电科技股份有限公司 一种光分路器晶圆贴片系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700987A (en) * 1994-06-16 1997-12-23 Lucent Technologies Inc. Alignment and bonding techniques

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5393697A (en) * 1994-05-06 1995-02-28 Industrial Technology Research Institute Composite bump structure and methods of fabrication
JPH10208269A (ja) 1997-01-28 1998-08-07 Toshiba Corp 光ピックアップヘッド及びその製造方法並びに製造装置
JP3655179B2 (ja) * 1999-10-20 2005-06-02 富士通株式会社 半導体チップ素子
JP2002111113A (ja) * 2000-09-28 2002-04-12 Hitachi Ltd 光モジュール
WO2005071735A1 (ja) * 2004-01-22 2005-08-04 Bondtech Inc. 接合方法及びこの方法により作成されるデバイス並びに接合装置
JP2007133011A (ja) * 2005-11-08 2007-05-31 Nec Corp 光結合構造およびその製造方法、光モジュール
JP4349475B2 (ja) * 2009-03-19 2009-10-21 三菱電機株式会社 光モジュールの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700987A (en) * 1994-06-16 1997-12-23 Lucent Technologies Inc. Alignment and bonding techniques

Also Published As

Publication number Publication date
CN102684064A (zh) 2012-09-19
EP2500757A1 (en) 2012-09-19
JP5636319B2 (ja) 2014-12-03
EP2500757B1 (en) 2018-06-27
US20120234458A1 (en) 2012-09-20
JP2012198295A (ja) 2012-10-18
US9214446B2 (en) 2015-12-15

Similar Documents

Publication Publication Date Title
JP5847473B2 (ja) 光モジュール
CN102684064B (zh) 光模块的制造方法
JP3800135B2 (ja) 光通信モジュール、光通信モジュールの製造方法および電子機器
US20190170953A1 (en) Axial alignment of a lensed fiber in a grooved assembly
CN101501543B (zh) 晶片等级的光学组件对准
CN106104344A (zh) 光纤的安装零件、光模块以及制造方法
US9046666B2 (en) Optical module and method for fabricating optical module
US20170003463A1 (en) Passive placement of a laser on a photonic chip
JP4643891B2 (ja) パラレル光学系接続装置用の位置決め方法
JP6275025B2 (ja) 光ファイバの実装部品、光モジュールおよび製造方法
US9335494B2 (en) Optoelectronics structures
JP5908698B2 (ja) レーザ光源およびレーザ光源の製造方法
JP4729893B2 (ja) 半導体光学装置の製造方法
KR100524672B1 (ko) 광수동 정렬용 각진 홈을 이용한 플립칩 본딩방법 및 광모듈
JPH10268166A (ja) 光モジュール
JP5982457B2 (ja) 光モジュールの製造方法
JP2014175486A (ja) 光学モジュール
JP6335765B2 (ja) 光モジュールおよびその製造方法
JP2014059392A (ja) 光モジュールの製造方法
JP2005017388A (ja) 光モジュール及びその製造方法
KR100396504B1 (ko) 보강된 구조를 갖는 광통신 모듈
JP5738394B2 (ja) 光デバイスの製造方法
JP2005150298A (ja) 微小タイル状素子、接続構造、接続方法、薄膜デバイス及び電子機器
JP5437359B2 (ja) サブマウント、光モジュール及び光モジュールの製造方法
JP2000310726A (ja) 光モジュール及びその製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: Citizen Watch Co., Ltd.

Address before: Tokyo, Japan

Patentee before: Citizen Watch Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161214

Termination date: 20190316