CN102683590A - 芳基-乙烯取代的芳族化合物及其作为有机半导体的应用 - Google Patents
芳基-乙烯取代的芳族化合物及其作为有机半导体的应用 Download PDFInfo
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Abstract
本发明揭示芳基-亚乙基芳族化合物及其作为有机半导体的用途。该化合物可以用于电子器件,如有机薄膜晶体管(OTFT),显示器件,发光二极管,光伏电池,光检测器和存储单元。还揭示了制备这些芳基-乙烯芳族化合物的方法。
Description
本发明是2006年4月11日提交的申请号为PCT/US2006/013274、发明名称为“芳基-乙烯取代的芳族化合物及其作为有机半导体的应用”、国家申请号为200680011729.2的中国专利申请的分案申请。
技术领域
本发明涉及新的一类芳基-乙烯取代的芳族化合物。本发明还涉及这些化合物在电子器件中的应用以及这些器件的制造方法
相关技术的说明
有机材料被广泛应用于如有机薄膜晶体管(OTFT)、有机发光二极管(OLED)、光伏二极管和液晶显示器的电子器件。OTFT在用于适合如智能卡、电子标签、显示器和存储器的应用的低成本集成电路(IC)技术方面是特别有价值的。OTFT中,半导体层由包含共轭聚合物和低聚物的有机半导体材料构成。已经合成出许多具有电子器件应用所需的电子性质的有机材料。
经研究可用作半导体的有机化合物包括:共轭聚合物,如区域规整(regioregular)聚(3-烷基噻吩);聚芴-联噻吩的共聚物;聚芳胺和聚噻吩衍生物;稠合芳族化合物,如并五苯、并四苯和它们的衍生物;共轭低聚物,如低聚噻吩、芴-噻吩低聚物和苯基-噻吩低聚物。
不幸的是,大多数上述有机半导体化合物的性能存在电荷迁移率低(约~0.1cm2/Vs)或不稳定性的缺陷。例如,虽然并五苯具有高迁移率(约0.1-2cm2/Vs),但其带隙相对较低(2.2eV)且具有高HOMO(最高已占分子轨道)能级,容易被氧化。此外,并五苯化合物常显示高的氧和湿度敏感性,因此,只有在惰性气氛中才能达到高开关比。这些特性使器件的稳定性差,使得并五苯化合物不适合用于实际电子线路的应用。另一方面,诸如低聚芴、低聚芴-噻吩、亚苯基-噻吩和共轭聚芴-噻吩聚合物的化合物显示改进了稳定性,但是它们的迁移率低,因此限制了在高效电子器件的应用。因此,仍需要一类具有高迁移率和高开关比的有机化合物,这类化合物对热、光和空气稳定。
还需要能采用工业可行的制造方法容易地加入到如OLED的电子器件中的有机化合物。另一方面,对OLED,器件的寿命短仍是其在工业化应用方面的缺陷。有机三芳胺化合物如NPD及其衍生物被广泛用作空穴输运材料。据信,这些三芳胺化合物低电荷迁移率和这些空穴输运材料的低玻璃化转变温度可能限制了OLED的稳定性。因为这一原因,需要具有高空穴电荷迁移率和高热稳定性的新材料用于OLED。
发明概述〕
提供由下面化学式1表示的化合物:
化学式1
式中:
Ar是亚芳基;
Ar'和Ar"独立地选自芳基;
R1至R4独立地选自下组:氢、烷基、芳基、卤素、羟基、芳氧基、烷氧基、烯基、炔基、氨基、烷硫基、膦基、甲硅烷基、-COR、-COOR、-PO3R2、-OPO3R2和CN;
R选自下组:氢、烷基、芳基、烯基、炔基和氨基;和
m和n各自是0-5的整数,在这情况下,m+n≠O。
在一个实施方式中,Ar选自下组以及它们的组合:
式中:
Q选自下组:S、Se、Te、O和NR0,
q和r独立地是0-5的整数;s是1-5的整数;
R0独立地选自下组:氢、烷基和芳基;
R5至R10独立地选自下组:氢、烷基、芳基、卤素、羟基、芳氧基、烷氧基、烯基、炔基、氨基、烷硫基、膦基、甲硅烷基、-COR、-COOR、-PO3R2、-OPO3R2和CN;
R按照上面定义;和
其中,R5至R10中任何两个相邻的基团可结合起来形成环。
还提供了制备化学式1的化合物的合成方法。
还提供了由化学式1表示的空穴输运化合物和包含这些化合物的空穴输运层。
还提供了由化学式1表示的电子输运化合物和包含这些化合物的电子输运层。
还提供了包含这些化合物的缓冲层。
还提供了包括有机薄膜晶体管(OTFT)的电子器件,所述有机薄膜晶体管包含化学式1表示的化合物。还提供了制造这些电子器件的方法。
还提供了包含化学式1表示的化合物的显示器。
还提供了包含化学式1表示的化合物的有机发光二极管、光电导体、存储 单元、限流器、场效应二极管、Schottky二极管、光伏电池、光检测器、整流器、晶体管、热敏电阻器和p-n结(junction)。
附图简述
实施方式图示于附图,以更好理解本文中提出的各种概念。
图1A是底部接触型的有机薄膜晶体管(OTFT)的示意图。
图1B是顶部接触型的OTFT的示意图。
图1C是OTFT的另一个实施方式的示意图。
图1D是OTFT的另一个实施方式的示意图。
图2是显示器的示意图。
技术人员应理解为了简化和清楚起见附图中图示各物件,这些物件不必按比例绘制。例如,附图中某些物件的尺寸可以相对其它物件放大,有助于更好理解这些实施方式。
发明详述
提供新的一类取代的芳基乙烯芳族化合物及这些化合物的合成方法。揭示了这些以及其它取代的芳基乙烯芳族化合物在有机半导体器件中的应用。
上面已经描述了多个方面和多个实施方式,这些方面和实施方式仅用于举例,不构成限制。技术人员在阅读本说明书后,可以理解在不偏离本发明范围的情况下可以有其它的方面和实施方式。
由下面的详细描述和权利要求书,任何一个或多个的实施方式的其它特征和益处将是显而易见的。详细描述部分首先对术语进行定义和解释,随后描述芳基-乙烯芳族化合物,一般制备,半导体器件,以及最后实施例。
1.术语定义和解释
在详细描述以下实施方式之前,对一些术语进行定义或阐述。
在此所用术语“芳族”指具有离域π-电子的连续共轭的不饱和环状有机化合物或基团。芳族基团可以有一个或多个环,每个环具有2n+2个π-电子。该术语包括环上有一个或多个有π-电子的杂原子的基团。在一个实施方式中,所述杂原子选自下组:N、O和S。
在此所用术语“并苯”指含有两个或更多个以直链排列的单边稠合苯环的 母体烃组分。“并苯”包括萘(两个单边稠合苯环)和蒽(三个单边稠合苯环)。四个或更多个稠合苯环的体系由标注苯环数量的数字前缀和后面用“并苯(acene)”结尾来命名。
在此所用术语“烷基”,无论是作为另一个术语的部分或者独立使用,都指饱和烃基。烷基的例子包括:正丁基、正戊基、正庚基、异丁基、叔丁基、和异戊基。该术语包括杂烷基。一个实施方式中,烷基有1-20个碳原子。在一个实施方式中,烷基是氟代烷基。
术语“烷基醚”指有一个或多个碳原子被O取代并通过氧相连的烷基。
术语“醚烷基”指有一个或多个碳原子被O取代并通过碳相连的烷基。
术语“烯基”,无论是作为另一个术语的部分或者独立使用,都指具有一个或多个在基团的相邻碳原子之间的双键的烃基。烯基的例子包括:乙烯基、烯丙基、丁烯基、戊烯基和庚烯基。该术语包括杂烯基。在一个实施方式中,烯基具有1-20个碳原子。
术语“炔基”,无论是作为另一个术语的部分或者独立使用,都指具有一个或多个在基团的相邻碳原子之间的三键的烃基。炔基的例子包括:乙炔基、丙炔基、丁炔基、己炔基和庚炔基。该术语包括杂烷基。在一个实施方式中,炔基具有1-20个碳原子。
术语“芳基”,无论是作为另一个术语的部分或者独立使用,都指具有一个连接点的芳族基团。术语“亚芳基”指具有两个连接点的芳族基团。在一个实施方式中,芳族基团具有4-30碳原子。
术语“甲硅烷基”,无论是作为另一个术语的部分或者独立使用,都指基团–SiR3,其中R选自下组:氢、烷基、芳基、烯基、炔基和氨基。
术语“硫代烷基”,无论是作为另一个术语的部分或者独立使用,都指-SR,其中R选自下组:氢、烷基、芳基、烯基和炔基。
前缀“杂”表示一个或多个碳已被不同的原子取代。在一个实施方式中,杂原子选自下组:N、O和S。
前缀“氟”表示一个或多个氢已被氟取代。该术语包括部分氟化或完全氟化的物质。
上述基团中的任何一个可以是直链或支链。直链烷基、烯基和炔基的例子包括:正丁基、正戊基、正庚基、正辛基、正丁烯基、正戊烯基、正庚烯基和正庚炔基。支链烷基、烯基和炔基的例子包括:异丁基、叔丁基、异戊基、新 戊基、异戊烯基和新戊烯基。
上述任一基团可以是取代的或未取代的。术语“取代的”指被相同或不同的取代基单取代或多取代的基团。合适的取代基包括:氰基、硝基、酯基、醚基、卤素、羟基、烷基、芳基和烷氧基。在一个实施方式中,取代基包括醚基和氟取代基。
在此所用术语“电荷输运”,指层、材料、部件或结构时意指能以较高效率和低电荷损失,促进电荷迁移通过该层、材料、部件或结构的厚度的层、材料、部件或结构。“电子输运”指负电荷输运,“空穴输运”指正电荷输运。
在此所用的术语“包含”、“含有”、“包括”、“具有”、“有”或它们的任意其它变体,是用来在包括非排他性的包含。例如,包含一系列元件的过程、方法、制品或装置并不一定只限于那些元件,而是还可以包括没有明确列出的或这些过程、方法、制品或装置所固有的其它元件。而且,除非明确说明意思相反,否则“或”表示包含的或和不排除的或。例如,以下任一条件满足条件A或B:A为真(或存在)且B为假(或不存在),A为假(或不存在)且B为真(或存在),以及A和B都为真(或存在)。
使用“一个”或“一种”对在此所述的元件和部件进行描述。这种做法只是为了方便起见,并给出本发明范围的普遍性含义。这种描述应当理解为包括一(个)种或至少一(个)种,单数也包括复数,除非很明显其另有表示。
与元素周期表列数对应的族数使用“New Notation”协定(参见CRC化学和物理手册第81版(2000-2001))。
除非另外定义,否则本文中所用的所有技术和科学术语均具有本发明所属领域普通技术人员通常所理解的同样含义。虽然在本发明实施方式的实施或测试中可以采用类似于或等同于本文所述的那些方法和材料,但下面描述合适的方法和材料。除非引用具体的章节,本文中述及的所有出版物、专利申请、专利和其它参考文献都全文参考结合于本文。在抵触的情况下,以本说明书,包括定义为准。此外,物质、方法和例子都只是说明性,不构成限制。
关于具体材料、处理方法(processing act)和线路的许多细节都是常规的,可以在教科书以及有机发光二极管显示器、光检测器、光伏器件和半导体元件领域内的其它来源获得,在本文中就不描述了。
2.芳基-乙烯芳族化合物
提供由化学式1表示的化合物:
化学式1
式中:
Ar是亚芳基;
Ar'和Ar"独立地选自芳基;
R1至R4独立地选自下组:氢、烷基、芳基、卤素、羟基、芳氧基、烷氧基、烯基、炔基、氨基、烷硫基、膦基、甲硅烷基、-COR、-COOR、-PO3R2、-OPO3R2和CN;
R选自下组:氢、烷基、芳基、烯基、炔基和氨基;和
m和n各自独立地是0-5的整数,在这情况下,m+n≠0。
在一个实施方式中,Ar、Ar'和Ar"中至少一个选自下组:有至少两个稠环的芳族基团和具有至少两个通过单键相连的环的芳族基团。在一个实施方式中,Ar选自下组:至少两个稠环的芳族基团和具有至少两个通过单键相连的环的芳族基团。在一个实施方式中,Ar是并苯基团。
在一个实施方式中,R1至R4是H。在一个实施方式中,m和n都不为零。在一个实施方式中,m=n=1。
在一个实施方式中,Ar选自下组以及它们的组合:
式中:
Q选自下组:S、Se、Te、O或NR0;
q和r各自独立地是0-5的整数;
s是1-5的整数;
R0选自下组:氢、烷基和芳基;
R5至R10独立地选自下组:氢、烷基、芳基、卤素、羟基、芳氧基、烷氧基、烯基、炔基、氨基、烷硫基、膦基、甲硅烷基、-COR、-COOR、-PO3R2、-OPO3R2和CN;和
R选自下组:氢、烷基、芳基、烯基、炔基和氨基;
其中,R5至R10中任何两个相邻基团可以结合起来形成环。
在一个实施方式中,Ar选自下组:
式中:
Q、q、r、s、R0、R5和R6按照上面定义。
在一个实施方式中,对上面任意Ar基团,r至少为1,s至少为2。在一个实施方式中,q为O、1、2或3;r为1、2或3;s为2或3。在一个实施方 式中,Ar选自并四苯和并五苯。
在一个实施方式中,Ar具有至少一个选自下组的基团:2,6-萘、取代的2,6-萘、2,6-蒽、取代的2,6-蒽、2,7-芴、取代的2,7-芴、3,6-咔唑、取代的3,6-咔唑,以及它们的组合,条件是没有二芳基氨基取代基。在一个实施方式中,取代基独立地选自下组:烷基、烷氧基、烷基醚、醚烷基、硫代烷基、甲硅烷基,以及它们的组合。本文中所用数字表示基团的连接点,并且是按照协定(参见CRC化学和物理手册第81版(2000-2001))。
在一个实施方式中,Ar'和Ar"独立地选自取代的芳基,条件是没有二芳基氨基取代基。在一个实施方式中,没有氨基取代基。在一个实施方式中,Ar'和Ar"独立地选自取代的芳基,所述取代基独立地选自下组:烷基、芳基、烷基芳基、烷氧基、烷基醚、醚烷基、氟、硫代烷基、甲硅烷基,以及它们的组合。
虽然不希望受到理论的束缚,可以认为,这些化合物的一定的几何特性与化合物在电子器件中的性能有关。在一个实施方式中,化学式1的化合物具有可以用于OTFT的平面对称的化学结构。这种构型可以形成有多个可能的共振结构的延伸的共轭体系,如以下两种共振结构:
2,6-二-(2-萘-2-基-乙烯基)-蒽:
还认为,芳基-乙烯并苯的共振结构受电场的作用时可以转变为醌型态,对于2,6-二-(2-萘-2-基-乙烯基)-萘的醌型态,在此示于如下:
预期这种结构能产生高迁移率。实际上,使用化学式1的化合物作为OTFT中的活性半导体可以获得大于1cm2/Vs的迁移率。因为这些半导体的带隙相对较大(约~2.3-3.5eV),这些化合物也是高稳定性的材料。这类高迁移率的半导体也可以用作OLED中的电荷输运材料或主体材料。
化学式1的化合物具有高迁移率和高开关比,适合用于制造半导体器件。 这些化合物的热稳定性高,不会受光或空气的影响,因此半导体器件不必在惰性气氛中制造。使用这些化合物还能够在低的基片温度下制造电子器件。此外,这些化合物具有良好的成膜能力。
在一个实施方式中,对用于OTFT的芳基-乙烯化合物,R1至R4独立地是H、F或CN。还优选用于OTFT的芳基乙烯并苯化合物对所有C=C双键都具有反式构型,以使该不饱和体系的共轭最大。
在一个实施方式中,目的用于OTFT的芳基乙烯并苯化合物也具有平面对称的分子结构。“平面”意味着在中间环与反-C=C双键连接的部分之间的扭转角(twist angle)为O°-10°,优选O°。“扭转的”分子结构的扭转角大于10°。并苯基团的扭转主要由并苯环上取代基的空间相互作用控制。具有相对较大的相邻基团R6-R10的化合物的扭转会比其中的R6-R10都是H、F或CN的化合物更大。在“对称的”分子中,芳基-乙烯取代基是相同的,即,Ar'=Ar",R1=R4,R2=R3。化合物A是适合用作OTFT中的半导体的材料。
化合物A
平面对称的
适合用于OTFT半导体
由化学式1表示的化合物的例子包括:
在一个实施方式中,具有化学式1的化合物可以聚合形成更长的低聚物或聚合物。在一个实施方式中,具有化学式1的化合物可以和一种或多种具有化学式1但是不同的化合物和/或一种或多种不具有化学式1的不同单体共聚。在一个实施方式中,具有化学式1的化合物可具有可交联的基团。这些化合物可以用来形成层,然后交联,以提高耐久性和耐溶剂性。
3.具有化学式1的化合物的一般制备
由化学式1表示的化合物可以通过取代的硼酸(或酯)与二卤代亚芳基化合物的共轭交叉偶联反应来制备。这类反应通常称作“Suzuki偶联”,示于下面的方案1。
方案1
也可以采用“Heck偶联反应”,该反应中,在Pd(II)催化剂和膦存在下,取代的芳基-乙烯与二卤代亚芳基化合物反应,如方案2所示。HaI-Ar-Hal按照上面方案1定义。
方案2
还可以采用这些合成方法的各种变体,如方案3和4所示。
方案3
方案4
在方案3和方案4中,Ar'如上定义。
Suzuki偶联反应为有机化学公知的反应,在文献(Miyaura,N.;Suzuki,A.,Chem.Rev.(1995),95(7),2457-83)中描述。
硼酸或酯试剂可以按照文献报道的方法进行合成(参见方案5和Lightfoot,A.P.;Maw,G.;Thirsk,C;Twiddle,S.J.R.;Whiting,A.,TetrahedronLett.(2003),44(41),7645-7648)
方案5
试剂不限于上面的取代的硼酸或酯。可以使用用作有机硼酸偶联剂的任何Suzuki-偶联剂,如三氟(有机)硼酸钾。(Darses,S.;Genet,J.P.,Eur.J.of Org.Chem.(2003),(22),4313-4327)。反应条件、催化剂、溶剂、相转移剂和反应介质也可以改变。(Herrmann,W.A.;Reisinger,C.P.;Haerter,P.,C-C偶联反应(Heck,Stille,Suzuki,等)。水相有机金属催化”(第二版)(2004),511-523)。
Heck偶联反应也是有机化学中很好建立的反应,并在文献中描述(Huo,S.;Negishi,E.钯催化的烯基-芳基、芳基-烯基以及烯基-烯基偶联反应。Handbook of Organo palladium Chemistry for Organic Synthesis(用于有机合成的有机钯化学手册)(2002),1,335-408.Littke,A.F.;Fu,G.C.Angew.Chem.Int.Ed.(2002),41(22),4176-4211.Farina,V.,Adv.Synthesis &Catalysis(合成&催化进展)(2004),346(13-15),1553-1582.Braese,S.;DeMeijere,A.Double and multiple Heck reactions(双重和多重Heck反应)。Handbook of Organo palladium Chemistry for Organic Synthesis(用于有机合成的有机钯化学手册)(2002),1:1179-1208.Itami,K.;Ushiogi,Y.;Nokami,T.;Ohashi,Y.;Yoshida,J.,Org.Lett.(2004),6(21),3695-3698. Reetz,M.T.;de Vries,J.G.,Chem.Commun.(2004),(14)1559-1563)。
芳基-乙烯或取代的苯乙烯试剂可以按照文献报道的方法合成(参见方案6和Kerins,F.:,O'Shea,D.F.J.Org.Chem.(有机化学期刊)2002,67,4968-4971)。
方案6
4.半导体器件
S.M.Sze在Physics of Semiconductor Devices(半导体器件的物理学),第2版,John Wiley and Sons,New York(1981)中描述了半导体器件。这些器件包括:整流器、晶体管(晶体管有许多种类型,包括p-n-p、n-p-n和薄膜晶体管)、限流器、热敏电阻器、p-n结、场效应二极管、Schottky二极管等。半导体器件可以采用已知的方法制造(Peter Van Zant,MicrochipFabrication(微芯片制造),第四版,McGraw-Hill,New York(2000))。各个半导体器件中,半导体材料可以与一种或多种金属或绝缘体组合,形成该器件。所有半导体器件通常都存在一种或多种半导体材料。化学式1表示的化合物可以用作半导体器件中的半导体材料。
在一个实施方式中,半导体器件包括至少一层含用化学式1表示的化合物的电荷输运层。
(1)薄膜晶体管
特别有用的一类晶体管器件是薄膜晶体管(TFT),薄膜晶体管一般包括栅极、栅极上的栅电介质、与栅电介质相邻的源极和漏极、以及与栅电介质相邻且与源极和漏极相邻的半导体层(参见,例如,S.M.Sze,supra,第492页)。这些元件可以以各种构形组装。更具体地,有机薄膜晶体管(OTFT)具有有机半导体层。
通常,在制造、测试和/或使用期间由基片支承OTFT。任选地,基片可以向OTFT提供电功能。有用的基片材料包括有机材料和无机材料。例如,基片可以包括无机玻璃、陶瓷箔、聚合物材料(如,丙烯酸类;环氧树脂;聚酰胺; 聚碳酸酯;聚酰亚胺;聚酮;聚(氧-1,4-亚苯氧基-1,4-亚苯基羰基1,4-亚苯基),有时称作聚(醚醚酮)或PEEK;聚降冰片烯;聚苯醚;聚(萘二羧酸乙二酯)(PEN);聚(对苯二甲酸乙二酯)(PET);聚(苯硫醚)(PPS))。基片还可以包括填充的聚合物材料(例如,纤维增强塑料(FRP)),或涂布的金属箔。
栅极可以是任何有用的导电材料。例如,栅极可以包括掺杂的硅或金属(如,铝、铬、金、银、镍、钯、铂、钽或钛)。也可以使用导电聚合物,例如,聚苯胺或聚(3,4-亚乙二氧基噻吩)/聚(苯乙烯磺酸盐)(PEDOT:PSS)。另外,可以使用这些材料的合金、组合和多层材料。在某些OTFT中,单一的材料可以起栅极的作用和基片的作用。例如,掺杂的硅可以起栅极的作用并也用作对OTFT的支承。
栅电介质一般覆盖栅极。栅电介质将栅极与OTFT器件的其余部分电绝缘。能用于栅电介质的材料可以包含任何无机电绝缘材料(如,锶酸盐、钽酸盐、钛酸盐、锆酸盐、氧化铝、氧化硅、氧化钽、氧化钛、氮化硅、钛酸钡、钛酸钡锶、锆酸钛酸钡(barium zirconate titanate)、硒化锌或硫化锌)。此外,可以使用这些材料的合金、组合和多层材料用于栅电介质。
源极和漏极通过栅电介质与栅极隔开,而有机半导体层可在源极和漏极的上面或者下面。源极和漏极可以是任何充分导电的材料(如,金属,如铝、钡、钙、铬、金、银、镍、钯、铂、钛或它们的合金)。也可以使用导电聚合物,如聚苯胺、PEDOT:PSS,以及它们的组合和多层材料作为源极和漏极。这些中有一些材料适合与n-型半导体材料一起使用,而其它材料适合与p-型半导体材料一起使用,这是本领域皆知的。
薄膜电极(即,栅极、源极和漏极)可采用几种方式提供,包括物理气相沉积(如,热蒸发或溅射)和喷墨打印。使这些电极形成图案可以采用已知的方法进行,如阴影掩模(shadow masking)、附加光刻法(additivephotolithography)、减法光刻法(subtractive photolithography)、印刷、微接触印刷或图案涂布。
图1A和1B分别是底部接触型和顶部接触型的OTFT的示意图。OTFT通常包括基片,如n-型硅晶片102。对于TFT器件晶片起栅极的作用。通常在该栅极上热生长二氧化硅的电介质层104。
对底部接触型的OTFT(图1A),电极106和108分别形成源电流和漏电流的通道,这两个电极可以采用光刻方法形成在二氧化硅层上。然后,将半导体 层110沉积在电极106和108的表面以及层104上。
对顶部接触型OTFT(图1B),在制造电极106和108之前将层110沉积在层104上,是OTFT的示意图,示出这种器件在顶部接触型时的活性层的相对位置。
图1C是OTFT的示意图,显示这种器件为底部接触型,栅极在顶部时的活性层的相对位置。
图1D是OTFT的示意图,显示这种器件为底部接触型,栅极在顶部时的活性层的相对位置。
半导体层110可以包含一种或多种由化学式1表示的化合物。层110可以采用本领域已知的各种方法进行沉积,如热蒸发、化学气相沉积、热转移、喷墨印刷和丝网印刷。能用于沉积的分散薄膜涂层的技术包括:旋涂、刮涂和滴液流延(drop casting)。
对顶接触型OTFT(图1B),在制造电极106和108之前,将层110沉积在层104的上面。
在此所述的半导体化合物也可以用于其它OTFT器件构形。美国专利6,621,098描述了这种器件结构。
在一些情况下,基片100可以是塑料聚合物材料、无机绝缘体或金属基片。栅极102可以采用各种涂布方法涂布在基片上,如旋涂、棒涂和刮涂,或印刷方法,如热激光印刷、喷墨打印和丝网印刷。
在此提供的OTFT器件的表征可如下进行:
线性状态(Vg<=Vsd)迁移率按照下式计算:
μlin=(L/WCjVsd)(dld/dVg) 式1
其中,Id是漏电流,Vg是栅电压,Vsd是源-漏电压,L是通道长度,W是通道宽度,Cj是每单位面积栅电介质的电容。Cj的单位为F/cm2并按下式计算:
Cj=(ε0ε/t)(10-4) 式2
其中,ε0是绝对介电常数(permittivity constant),ε是介电常数(dielectric constant),t是电介质厚度。
饱和状态(Vg>=Vsd)迁移率按照下式计算:
μsat=(2L(d√Id/dVg)2)/(WCi) 式3
阈电压,Vt在饱和状态测定。Id的平方根对Vg绘图。由该曲线相对x-轴的最陡部分的线外推,获得Vt。
开关比是在施加最高漏电压VDS条件下最高VGS下电流IDS与在最低VGS下电流IDS的比值。
b.显示器件
图2是显示器件200的示意图。阳极202和阴极204电连接于电源206。电源206优选是电流源。缓冲层208与阳极202接触。缓冲层208在有机电子器件中可以具有一种或多种功能,包括但不限于:下层的平面化、电荷输运和/或电荷注入性质、清除如氧和金属离子的杂质,以及能促进或改进有机电子器件的性能的其它方面。空穴输运层210从一面与缓冲层208接触,另一面与有机半导体层212接触。空穴输运层210促进空穴从空穴注入层208传至有机半导体层212。
类似地,电子注入层214与阴极204接触。电子注入层214促进电子由阴极204注入到显示器件200。电子输运层216从一面与空穴注入层214接触,另一面与有机半导体层212接触。电子输运层216促进电子从电子注入层214传至有机半导体层212。在一个实施方式中,有机半导体层包含光活性材料。术语“光活性”指通过施加电压激活时发光(如发光二极管或化学电池)或者对辐射能响应并在施加偏压或没有施加偏压下产生信号(如光检测器)的材料。
在一些实施方式中,空穴注入层208和空穴输运层210之一被省去。在一些实施方式中,电子注入层214和电子输运层216之一被省去。
在阳极202和阴极204上施加电流时,电子和空穴被注入器件200。这些电子和空穴在有机半导体层212中结合,并因为存在于有机半导体层212中的化合物的电致发光性质而发射光的光子。层212也称作“发光层”。
在一个实施方式中,发光层212包含一种或多种化学式1的化合物。在一个实施方式中,具有化学式1的化合物存在于层212作为光活性材料的主体。在一个实施方式中,层212中具有化学式1的化合物不含氨基取代基。
在一个实施方式中,电子输运层214包含一种或多种化学式1的化合物。在一个实施方式中,电子输运层214包含一种或多种化学式1的化合物与其它已知的电荷输运材料(如Alq3衍生物)。术语“电子运输”不包括发光或感光的层、材料、部件或结构,即使这类层、材料、部件或结构也具有电子输运性能。
在一个实施方式中,空穴输运层210包含一种或多种化学式1的化合物。 在一个实施方式中,化学式1的化合物存在于层210中的主体空穴输运材料中。主体材料的例子包括但不限于:聚噻吩、聚吡咯、聚苯胺和聚乙烯基咔唑。在一个实施方式中,空穴输运层210包含一种或多种化学式1化合物与其它已知电荷输运材料(如NPD衍生物)。术语“空穴输运”不包括发光或感光的层、材料、部件或结构,即使这类层、材料、部件或结构也具有空穴输运性能。
在一个实施方式中,缓冲层208包含一种或多种化学式1的化合物。在一个实施方式中,缓冲层208中的具有化学式1的化合物不含氨基取代基。
在一个实施方式中,空穴输运层210包含一种或多种化学式1的化合物,该化合物不含氨基取代基。
在一个实施方式中,空穴输运层210包含一种或多种化学式1的化合物,
式中,Ar选自以下基团以及它们的组合;
式中:
Q选自下组:S、Se、Te、O和NR0;
q和r各自独立地是0-5的整数;
s是1-5的整数;
R0选自下组:氢、烷基和芳基;
R5至R10独立地选自下组:氢、烷基、芳基、卤素、羟基、芳氧基、烷氧基、烯基、炔基、氨基、烷硫基、膦基、甲硅烷基、-COR、-COOR、-PO3R2、-OPO3R2和CN;和
R选自下组:氢、烷基、芳基、烯基和炔基;
其中,R5至R10中任何两个相邻的基团可以结合起来形成环;
另外,没有二芳基氨基。
在一个实施方式中,取代的R和R1至R10上的取代基独立地选自下组:烷基、芳基、硫代烷基、甲硅烷基、烷基芳基、烷氧基、烷基醚、醚烷基、氟,以及它们的组合。
在一个实施方式中,m=n=1,R1至R10都选自下组:氢、氟、直链烷基、芳基以及被直链烷基取代的芳基。在一个实施方式中,烷基有1-10碳原子。在一个实施方式中,Ar是并苯基团。
在一个实施方式中,空穴输运层210包含一种或多种选自以下的化合物:化合物1、化合物3、化合物48、化合物49和化合物50。
在考虑到其它层的使用功能,器件中的其它层可以由已知能用于这些层的任何材料制成。
例如,阳极202可以由含有或包含金属、混合金属、合金、金属氧化物或混合的金属氧化物的材料制成。阳极可以包含导电聚合物、聚合物掺混物或聚合物混合物。合适的金属包括第11族金属、第4、5和6族金属以及第8-10族的过渡金属。如果要求阳极是透射光的,一般使用第12、13和14族金属的混合金属氧化物,如氧化铟锡。阳极还包含有机材料,尤其是导电聚合物如聚苯胺,包括在“由可溶性导电聚合物制成的挠性发光二极管”,Nature第357卷,第477479页(11 June 1992)中所述的材料的例子。阳极和阴极中至少一个应至少是部分透明的,以使产生的光被看到。
缓冲层可包含空穴输运材料,如Y.Wang在Kirk Othmer Encyclopedia ofChemical Technology,第四版,第18卷,第837-860页,1996,中概述的那些材料。可以使用输运空穴的“小分子”以及低聚物和聚合物。空穴输运分子包括但不限于:4,4',4″-三(N,N-二苯基-氨基)-三苯胺(TDATA);4,4',4″-三(N-3-甲基苯基-N-苯基-氨基)-三苯胺(MTDATA);N,N'-二苯基-N,N’-二(3-甲基苯基)-[1,1'-联苯]-4,4'-二胺(TPD);1,1-二[(二-4-甲苯基氨基)苯基]环己烷(TAPC);N,N'-二(4-甲基苯基)-N,N'-二(4-乙基苯基)-[1,1’-(3,3’-二甲基)联苯]-4,4'-二胺(ETPD);四-(3-甲基苯基)-N,N,N',N'-2,5-苯二胺(PDA);α-苯基-4-N,N-二苯基氨基苯乙烯(TPS);对-(二乙基氨基)苯甲醛二苯基腙(DEH);三苯胺(TPA);二[4-(N,N-二乙基氨基)-2-甲基苯基](4-甲基苯基)甲烷(MPMP);1-苯基-3-[对-(二乙基氨基)苯乙烯基]-5-[对-(二乙基氨基)苯基]吡唑啉(PPR或DEASP);1,2-反-二(9H-咔唑-9-基)环丁烷(DCZB);N,N,N',N'-四(4-甲基苯基)-(1,1’-联苯)-4,4’-二胺(TTB);N,N'-二萘-1-基)-N,N'-二-(苯基)联苯胺(α-NPB);4,4’-N,N’-二咔唑基-联苯(CBP);以及卟啉(porphyrinic)化合物例如铜酞菁。有用的空穴输运聚合物包括但不限于:聚乙烯基咔唑、(苯基甲基)聚硅烷、聚噻吩、聚吡咯和聚苯胺。空穴输运聚合物可以是导电聚合物与形成胶态聚合物酸的配合物,如在公开的美国专利申请US 2004/0254297和US 2004/029133所揭示的。导电聚合物作为一类是有用的。还可以通过在聚合物如聚苯乙烯和聚碳酸酯中掺杂如上所述的空穴输运部分来获得空穴输运聚合物。
任何有机电致发光(“EL”)材料可以用作发光层212中的光活性材料。这类材料包括但不限于:荧光染料、小分子有机荧光化合物、荧光和磷光金属配合物、共轭聚合物、及它们的混合物。荧光染料的例子包括但不限于:芘、苝、 红荧烯、它们的衍生物和它们的混合物。金属配合物的例子包括但不限于:金属鳌合的8-羟基喹啉(oxinoid)化合物,例如三(8-羟基喹啉根)合铝(Alq3);环金属化的铱和铂电致发光化合物,如铱与苯基吡啶、苯基喹啉或苯基嘧啶配体的配合物,如Petrov等在公开的PCT申请WO 02/02714中揭示的,以及在例如公开申请US 2001/0019782、EP 1191612、WO 02/15645和EP 1191614中描述的有机金属配合物;以及它们的混合物。包含载带电荷的主体材料和金属配合物的电致发光的发射层已由Thompson等在美国专利6,303,238中,以及由Burrows和Thompson在公开的PCT申请WO 00/70655和WO 01/41512中描述。共轭聚合物的例子包括但不限于:聚(亚苯基亚乙烯基)、聚芴、聚(螺联芴)、聚噻吩、聚(对-亚苯基),以及它们的共聚物和它们的混合物。
在该器件的一个实施方式中,光活性材料可以是有机金属配合物。在另一个实施方式中,光活性材料是铱或铂的环金属化的配合物。还可以使用其它可用的光活性材料。Petrov等已在公开的PCT申请WO 02/02714中揭示,铱与苯基吡啶、苯基喹啉或苯基嘧啶配体的配合物可作为电致发光化合物。其它有机金属配合物已在例如公开的申请US 2001/0019782、EP 1191612、WO 02/15645和EP 1191614中描述。具有掺杂铱的金属配合物的聚乙烯基咔唑(PVK)的活性层的电致发光器件已由Burrows和Thompson在公开的PCT申请WO 00/70655和WO 01/41512中描述。包含载带电荷的主体材料和磷光铂配合物的电致发光发射层已由Thompson等在美国专利6,303,238中,由Bradley等在Synth.Met.(2001),116(1-3),379-383以及由Campbell等在Phys.Rev.B1 Vol.65085210中描述。
用于层218的电子输运材料的例子包括但不限于:金属鳌合的8-羟基喹啉化合物,例如二(2-甲基-8-喹啉酚根)(对-苯基-酚根)合铝(III)(BAlQ)和三(8-羟基喹啉根)合铝(Alq3);吡咯化合物,例如2-(4-联苯基)-5-(4-叔丁基苯基)-1,3,4- 二唑(PBD)、3-(4-联苯基)-4-苯基-5-(4-叔丁基苯基)-1,2,4-三唑(TAZ)和1,3,5-三(苯基-2-苯并咪唑)苯(TPBI);喹喔啉衍生物,例如2,3-二(4-氟苯基)喹喔啉;菲咯啉衍生物,例如,9,10-二苯基菲咯啉(DPA)和2,9-二甲基-4,7-二苯基-1,10-菲咯啉(DDPA);以及它们的混合物。
阴极层204沉积为线条或膜。阴极可以是功函数小于阳极的任何金属或非金属。用于阴极的材料的例子可包括第1族的碱金属,特别是锂,第2族(碱土)金属、第12族金属,包括稀土元素,镧系元素以及锕系元素。可以使用如 铝、铟、钙、钡、钐和镁及其混合物的材料。还可将含锂的化合物和其它化合物(如LiF和Li2O)沉积在有机层和阴极层之间作为电子注入层214,以降低系统的操作电压。
应理解,尽管没有绘出,但器件200可以包括其它的层。可以使用本领域已知的其它的层。此外,上述任何一层可以包含2层或更多层的子层,或者可以形成层叠结构。或者,阳极层202、空穴输运层210、电子输运层218、电子注入层214、阴极层204和其它的层中的一些层或者所有这些层可以进行处理,特别是表面处理,以提高电荷载流子的输运效率或器件的其它物理性质。各组分层材料的选择较好在考虑高的器件效率与器件工作寿命、制造时间和复杂因素以及考虑本领域技术人员了解的其它因素之下权衡提供器件的多种目标来确定。应理解,确定最佳组分、组分结构以及组成特性对本领域普通技术人员而言是常规工作。
在一个实施方式中,各层具有下列厚度:阳极202:500-5000埃,在一个实施方式中为1000-2000埃;缓冲层208和空穴输运层210,各自厚50-2000埃,在一个实施方式中为200-1000埃;光活性层212:为10-2000埃,在一个实施方式中为100-1000埃;层216和214为50-2000埃,在一个实施方式中为100-1000埃;阴极204为200-10000埃,在一个实施方式中为300-5000埃。电子-空穴复合区在器件中的位置,以及器件的发射光谱都可受到各层的相对厚度的影响。因此,电子输运层的厚度应选择为使电子-空穴复合区在发光层内。要求的层厚度的比值将取决于所用材料的确切特性。不同的层可以采用已知的任何沉积方法形成,包括液相沉积、气相沉积和热转移。在一个实施方式中,器件采用液相沉积缓冲层、空穴输运层和光活性层并采用气相沉积电子输运层、电子注入层和阴极来制造。
尽管已经图示和说明了本发明的详细实施方式,但是,显然揭示的内容并不只限于这些实施方式。显而易见,本领域的技术人员在不偏离权利要求书的精神和范围的情况下,可以有许多修改、变化、变动、替代和等价体。
实施例
下列实施例将进一步说明本发明。应理解,这些实施例仅以说明的方式给出了本发明的优选实施方式。
总的说明
热-重分析(TGA)在TA仪器Q550 TGA systemTM上进行,加热速率为10℃/分钟,氮气流速为60cm3/min。
循环伏安法(CV)在EG&G Pare Model 273ATM恒电位/恒电流系统上,在Bu4NBF4(0.1M)的乙腈溶液中进行,该系统有一个三-电极电池,扫描速率为50mV/s。
采用真空升华,将半导体膜涂布在盘形Pt电极(0.050cm2)上。使用Pt丝作为反电极,Ag/AgNO3(0.01M)电极作为参比电极。进行每一系列的测定之前,电池用氩气脱氧。将有机半导体加入电解质溶液(0.2mg/mL)。Pt丝用作反电极,Ag丝电极用作参比电极。电极的电势用饱和甘汞电极(SCE)通过测定该系统中二茂铁/铁铈齐电偶(0.15V相对于SCE)进行校准。带隙源自起始电势之间的差异。
合成结果由质谱、nmr分析和/或x-射线晶体结构来确定。
在CAD-4衍射仪上获取X-射线数据,该衍射仪具有铜Kα辐射,使用NRCVAXTM程序组解析结构。
核磁共振(NMR)谱在BrukerTM 500MHz分光计上获取。除非另外指出,所有化学位移都相对于四甲基硅烷(TMS)(为0.0ppm)报道。2,6-二溴蒽按照Hodge,P.;Power,G.A.;Rabjohns,M.A.Chem.Commun.1997,73的方法合成。
除非指出,其它试剂是从Aldrich购得,并且未经纯化直接使用。
实施例1
合成2.6-二苯乙烯基-蒽(化合物1)
向2,6-二溴蒽(5.20g,15.48mmol)和2-苯乙烯基-[1,3,2]-二氧杂硼环己烷(dioxaborinane)(8.73g,46.43mmol,Sigma-Aldrich Chemical Co.,Milwaukee,WI)在甲苯(200ml)的混合物中加入2M碳酸钠(8.20g,77.36mmol)溶于水(38.7ml)的溶液,然后加入相转移剂 336(3.10g,7.74mmol, Sigma-Aldrich Chemical Co.)。混合物用氮气鼓泡15分钟,然后再加入四(三苯基膦)钯(0)(358.5mg,2%mol,Sigma-Aldrich Chemical Co.)。氮气气氛下加热混合物至90℃保持3天。反应混合物冷却至室温,然后倒入甲醇(600ml)中。滤出沉淀物,用水、稀酸(5%HCl)、水、甲醇洗涤,然后用丙酮洗涤三次,除去起始物质以及单取代的副产物。粗产物通过在三-区炉内升华(两次)进行纯化,获得2.71g(46%)黄色固体。
实施例2
合成2,6-二-[2-4-戊基-苯基]-乙烯基]-蒽(化合物2)
向2,6-二溴蒽(2.688g,8.0mmol)和反-2-(4-氟-苯基)乙烯基-硼酸(3.983g,24.0mmol,Sigma-Aldrich Chemical Co.)在甲苯(120ml)的混合物中加入2M Na2CO3碳酸钠(4.24g,40mmol)溶于水(20ml)的溶液,然后添加相转移剂 336(1.6g,4mmol,Sigma-Aldrich Chemical Co.)。混合物用氮气鼓泡15分钟,然后加入四(三苯基膦)钯(0)(185.3mg,2%mol,Sigma-Aldrich Chemical Co.)。氮气气氛下加热混合物至90℃保持3天。反应混合物冷却至室温,然后倒入甲醇(300ml)中。滤出黄色沉淀物,用水、稀酸(5%HCl)、水、甲醇洗涤,然后用丙酮洗涤三次,除去起始物质以及单取代的副产物。粗产物通过在三-区炉内升华进行纯化,获得亮黄色固体。
实施例3
合成2,6-二-[2-4-戊基-苯基]-乙烯基]-蒽
向2,6-二溴蒽(5.20g,15.48mmol)和2-[2-(4-戊基苯基)乙烯基]-4,4,5,5-四甲基-1,3,2-二氧杂硼戊环(dioxaborolane)(14.67g,46.42mmol,Sigma-AIdrich Chemical Co.)在甲苯(120ml)的混合物中加入2M碳酸钠(8.20g,77.36mmol)溶于水(38.7ml)的溶液,然后添加相转移剂 336(3.10g,7.74mmol,Sigma-Aldrich Chemical Co.)。混合物用氮气鼓泡15分钟,然后加入四(三苯基膦)钯(0)(358.5mg,2%mol,Sigma-AldrichChemical Co.)。氮气气氛下加热混合物至90℃保持3天。反应混合物冷却至室温,然后倒入甲醇(600ml)中。滤出沉淀物,用水、稀酸(5%HCl)、水、甲醇洗涤,然后用丙酮洗涤三次,除去起始物质以及单取代的副产物。粗产物通过在三-区炉内升华(两次)进行纯化,获得2.00g(25%)淡黄色固体。
实施例4
合成2,6-二-(2-萘-2-基-乙烯基)-蒽(化合物4)
向2,6-二溴蒽(3.36g,10.0mmol)和2-乙烯基萘(4.63g,30.0mmol,Sigma-AIdrich Chemical Co.)在无水DMF(150ml)的混合物中加入三苯基膦(0.13g,0.50mmol,Sigma-AIdrich Chemical Co.)和三丁胺(11.9ml,50.0mmol,Sigma-AIdrich Chemical Co.)。混合物用氮气鼓泡15分钟,然后加入乙酸钯(112.0mg,0.5mmol,Sigma-AIdrich Chemical Co.)。氮气气氛下加热混合物至130℃保持18小时。反应混合物冷却至室温,然后倒入甲醇(500ml)中。滤出沉淀物,用甲醇、丙酮洗涤,然后用氯仿洗涤。粗产物通过在三-区炉内升华两次进行纯化,获得黄色固体。
实施例5
OTFT器件的表征
本实施例总结了对W/L比值为10的OTFT器件表征获得的结果,其中,所述W是通道宽度,L是通道长度。
该OTFT器件按照类似于结合图1B所述的方式制造。然后,使用有探针台 接口的Agilent 4155CTM半导体参数分析仪表征各OTFT器件的性能。
在实施例5e中,施涂聚苯胺(PANI)和分散的碳纳米管(PANI/NT)的导电聚合物层作为有图案的栅极,所述栅极可以采用CREO-Trendsetter TML打印机,使用聚苯胺-碳纳米管(PANI/NT)组合物作为供体以及 RS 8接受片进行热转印。然后,在有图案的栅极上叠加或热印刷胶乳RS35的电介质层。然后,使用CREO-Trendsetter TML打印机,使用聚苯胺-碳纳米管(PANI/NT)组合物作为供体和 RS 8接受片,印刷源极和漏极的图案。然后,组合物1的半导体在源极和漏极顶部通过阴影掩模热蒸发。
在环境条件下进行测定,无需采取特别措施来控制温度,或者避光或排除空气。
对表征OTFT器件所获的结果总结在下表中。这些结果表明包含化学式1的化合物的OTFT器件具有高迁移率和高开关比。
在另一种器件制造中,在重掺杂n-型Si晶片上制造有机薄膜场效应晶体管(OTFT)器件,该晶片的上表面具有200nm的热氧化物,用作电介质层,其单位面积的电容为1.73×10-8F/cm2,并且蚀刻的重掺杂的n-型Si作为背面接触(栅极)。接着晶片用丙酮、异丙醇和去离子水彻底清洗,用氮气吹干,并在氧等离子体中清洁6分钟。然后,将清洁后的晶片基片于60℃浸在0.1M辛基三氯硅烷(OcTS)的甲苯溶液中15分钟,用OcTS的自组合的单层(SAM)对晶片的SiO2表面进行处理。用甲苯漂洗并用氮气吹干后,基片于150℃退火5分钟,使SAM层交联(OcTS处理后的表面的接触角约为88-91°)。半导体层通过阴影掩模(各自面积约为1000×1000μm的40个阴影限定活性层)沉积在处理的电介质表面。有机半导体以1-2埃/秒速率,在约2.0×10-6乇压力下沉积到用石英检测器测定最后的厚度为400埃。膜厚度用触针表面光度仪(stylusprofilometer)校正。沉积时的基片温度可以通过加热或冷却固定基片的铜块来控制。沉积半导体后,通过使用W/L约为.10/1的阴影掩模沉积金电极。该掩模限定出八组源-漏电极对,各自的通道宽度W分别为400,600,800,1000μm,相应的八个不同通道的长度L分别为40,60,80和100μm。使用Agilent4155C半导体参数分析仪获得室温空气中的电特性。由标准TFT分析得到迁移率和阈电压。开关比由VGS=-40V时的电流IDS对VGS=+10V时的电流IDS来确定。表1中所有数据是通过任意测定8个独立的TFT并测定平均值获得的。标准偏差在5-10%范围。
表1:OTFT器件特性
μsat:饱和的迁移率;
μlin:线性迁移率;
开/关sat:施加最大栅电压(-60V)时,在饱和区的漏-源电流在开(当漏-源电压为-60V时)和关(当漏-源电压为0时)时的电流比。
开/关lin:施加最大栅电压(-5V)时,在线性区的漏-源电流在开(当漏-源电压为-60V时)和关(当漏-源电压为0时)时的电流比。
Vt sat:饱和区的阈电压;
Vt lin:线性区的阈电压;
SubThrSWsat:饱和区的亚阈值摆动(subthreshhold swing);
SubThrSWlin:线性区的亚阈值摆动;
NA=不能得到
实施例6
使用化合物1、化合物36制造的OTFT的稳定性试验
按照上面所述的方法测试器件,数据分析按Ficker等在J.Appl.Phys.94,2638(2003)中所述进行。使用化合物36(5n)的器件在恒定-40V的漏-源电压,+40V和-40V之间交替的漏-源电压下连续工作。发现,器件中的半导体材料稳定,且器件性能与开始测试的结果相同。器件在该试验中可以连续工作至少24小时。相反,使用并五苯作为半导体层制造的器件在类似条件下测试,连续工作仅2小时后就显示电荷迁移率(从0.4cm2/Vs下降至0.1cm2/Vs)和开关比(从最初6.5×104下降到约101)明显下降。
在另一个试验中,如上所述,在半导体层中使用化合物1来制造器件(5c),迁移率和开关比在10个月时间里定期进行测定。在该时间范围性能基本上稳定。迁移率变化为从0.85cm2/V-s至1.09cm2/V-s。开关比变化为从1.7×106至8.6×106。迁移率可以采用在U.S.6,452,207(第9栏,第55-63行)中所述的方法进行计算。在任何情况下,器件显示的开关比超过106,在储存期间迁移率对化合物1的器件一直有利,表明这些器件在空气中的稳定性高。
然而,在类似的对照条件下,并五苯器件置于空气中时电荷迁移率明显下降。储存2个月后,电荷迁移率从最初的0.4cm2/Vs下降到0.1cm2/Vs,再储存2个月后继续下降到0.03cm2/Vs。开关比在头2个月下降1个数量级,再2个约后又下降1个数量级,确定这一基准的半导体材料具有氧化不稳定性。
实施例7
合成2,7-二-[2-(4-环己基-苯基)-乙烯基]-蒽(化合物44)
向2,6-二溴蒽(3.36g,10.0mmol)和4-环己基苯乙烯(7.45g,40.00mmol)在DMF(200ml,无水)的混合物中加入乙酸钠(3.73g,45.00mmol)。混合物用氮气鼓泡15分钟,然后加入反-二-m-乙酸根合二[2-(二-o-甲苯基膦基)苄基]二钯(II)(19.1mg,0.2mol%)。氮气气氛下加热混合物至135℃(油浴)保持2天。反应混合物冷却至室温,然后倒入甲醇中。滤出沉淀物,用甲醇和丙酮洗涤。粗产物通过在三-区炉内升华进行纯化,获得0.3g(5.5%)黄色固体。
实施例8
合成2,7-二-[2-(4-甲氧基-苯基)-乙烯基]-蒽(化合物51)
向2,6-二溴蒽(2.45g,7.29mmol)和4-乙烯基苯甲醚(4.03g,29.14mmol)在DMF(90ml,无水)的混合物中加入乙酸钠(2.69g,32.79mmol)。混合物用氮气鼓泡15分钟,然后加入反-二-m-乙酸根合二[2-(二-o-甲苯基膦基)苄基]二钯(II)(13.9mg,0.2mol%)。氮气气氛下加热混合物至135℃(油浴)保持2天。反应混合物冷却至室温,然后倒入甲醇中。滤出沉淀物,用甲醇和丙酮洗涤。粗产物通过在三-区炉内升华进行纯化,获得0.66g(20%)黄色固体。
实施例9
a.合成4-(2-(2-乙氧基乙氧基)乙氧基苯乙烯
向4-乙酰氧基苯乙烯单体(22.54g,0.14mol)、2-(2-乙氧基乙氧基)-乙基溴(27.39g,0.14mol)在200ml丙酮的溶液中加入NaOH(16.68g,0.42mol)和水(10ml)。混合物回流2天。冷却后,反应混合物用乙醚萃取。有机层用MgSO4干燥,过滤和浓缩。柱纯化(己烷/乙醚∶8/1至2/1)后获得21.82g(66%)产物。
b.2,7-二-[2-(4-(2-(2-乙氧基乙氧基)乙氧基)-苯基)-乙烯基]-蒽(化合物52)
向2,6-二溴蒽(2.79g,8.30mmol)和4-(2-(2-乙氧基乙氧基)乙氧基苯乙烯(7.86g,33.26mmol)在DMF(100ml,无水)的混合物中加入乙酸钠(3.07g,37.42mmol)。混合物用氮气鼓泡15分钟,然后加入反-二-m-乙酸根合二[2-(二-o-甲苯基膦基)苄基]二钯(II)(15.9mg,0.2mol%)。氮气气氛下混合物于130℃(油浴)加热2天。反应混合物冷却至室温,然后倒入甲醇中。滤出沉淀物,用甲醇和丙酮洗涤。粗产物通过在三-区炉内升华进行纯化,获得黄色固体。
实施例10
合成化合物16
向2-乙烯基蒽(4.68g,22.91mmol)和1,4-二碘苯(2.55g,7.64mmol)在DMF(100ml,无水)的混合物中加入乙酸钠(2.82g,34.37mmol)。混合物用氮气鼓泡15分钟,然后加入反-二-m-乙酸根合二[2-(二-o-甲苯基膦基)苄基]二钯(II)(14.6mg,0.2mol%)。氮气气氛下混合物于135℃(油浴)加热2天。反应混合物冷却至室温,然后倒入甲醇中。滤出沉淀物,用水、甲醇和丙酮洗涤。粗产物通过在三-区炉内升华进行纯化,获得1.28g(35%)橙色固体。
实施例11
合成化合物53
向2-乙烯基蒽(4.68g,22.91mmol)和2,6-二溴萘(2.21g,7.64mmol)在DMF(100ml,无水)的混合物中加入乙酸钠(2.82g,34.37mmol)。混合物用氮气鼓泡15分钟,然后加入反-二-m-乙酸根合二[2-(二-o-甲苯基膦基)苄基]二钯(II)(14.6mg,0.2mol%)。氮气气氛下混合物于135℃(油浴)加热2天。反应混合物冷却至室温,然后倒入甲醇中。滤出沉淀物,用水、甲醇和丙酮洗涤。粗产物通过在三-区炉内升华进行纯化,获得0.086g(2%)橙色固体。
实施例12
合成化合物9
向2-乙烯基蒽(4.68g,21.93mmol)和2,6-二溴蒽(2.57g,7.64mmol)在DMF(100ml,无水)的混合物中加入乙酸钠(2.82g,34.37mmol)。混合物用氮气鼓泡15分钟,然后加入反-二-m-乙酸根合二[2-(二-o-甲苯基膦基)苄基]二钯(II)(14.6mg,0.2mol%)。氮气气氛下混合物于135℃(油浴)加热2天。反应混合物冷却至室温,然后倒入甲醇中。滤出沉淀物,用水、甲醇和丙酮洗涤。粗产物通过在三-区炉内升华进行纯化,获得橙色固体。
实施例13
合成2.6-二-[2-(4-戊基苯基)-乙酰基]-萘(混合物49)
向2,6-二溴萘(2.29g,8.00mmol)和2-[2-(4-戊基苯基)乙烯基]4,4,5,5-四甲基-1,3,2-二氧杂硼环戊烷(7.59g,24.00mmol)在甲苯(120ml)的混合物中加入2M碳酸钠(4.24g溶于20.0ml水,40.00mmol),然后加入相转移剂 336(1.60g,4.00mmol)。混合物用氮气鼓泡15分钟,然后加入四(三苯基膦)钯(0)(185.3mg,2mol%)。氮气气氛下混合物于90℃(油浴)加热3天。反应混合物冷却至室温,然后倒入甲醇(300ml)中。滤出黄色沉淀物,用稀酸(5%HCl)、水、甲醇和丙酮洗涤。粗产物通过在三-区炉内升华进行纯化,获得2.55g(67%)淡黄色固体。
实施例14
合成2,7-二-[2-(4-戊基-苯基)-乙烯基]-9H-芴(化合物50)
向2,7-二溴芴(2.67g,8.00mmol)和2-[2-(4-戊基苯基)乙烯基] 4,4,5,5-四甲基-1,3,2-二氧杂硼环戊烷(7.59g,24.00mmol)在甲苯(120ml)的混合物中加入2M碳酸钠(4.24g溶于20.0ml水,40.00mmol),然后加入相转移剂 336(1.60g,4.00mmol)。混合物用氮气鼓泡15分钟,然后加入四(三苯基膦)钯(0)(185.3mg,2mol%)。氮气气氛下混合物于90℃(油浴)加热3天。反应混合物冷却至室温,然后倒入甲醇(300ml)中。滤出黄色沉淀物,用稀酸(5%HCl)、水、甲醇和丙酮洗涤。粗产物通过在三-区炉内升华进行纯化,获得2.59g(63%)黄色固体。
实施例15
(a)4-溴-邻-二甲苯(75.00g,0.28mol)溶于900ml CCl4中。缓慢加入溴(82.00ml,1.60mol),同时用UV光辐照。加入后反应混合物再辐照1小时后。反应混合物用水洗涤两次,在旋转蒸发仪中浓缩。滤出沉淀物,并用己烷洗涤,在真空烘箱内干燥(80.59g,57%)。
(b)4-溴-1,2-二-二溴甲基-苯(20.00g,0.040mol)、1,4-萘醌(6.31g,0.040mol)和NaI(68.81g,0.46mol)在300ml DMAc中的混合物回流18小时。冷却后,将反应混合物倒入水中。滤出沉淀物,并用MeOH洗涤,然后通过升华进行纯化,获得黄色固体产物(3.67g,27%)。
(c)向300ml烧瓶中加入Al丝(8.67g,0.32mol)、HgCl2(0.17g,0.64mol)、环己醇(200ml)和催化量的CBr4(0.85g,0.0026mol)。混合物用氮气鼓泡15分钟。反应通过加热引发,冷却以减慢反应,然后回流4小时后完成反应。在该溶液中加入8-溴-萘-5,12-二酮(12.72g,0.032mol)。混合物回 流2天。冷却后,将很少量的反应混合物倒入MeOH/H2O/浓HCl溶液(1/1/1,800ml)。滤出沉淀物,用MeOH/H2O/浓HCl(1/1/1)洗涤,然后用甲醇洗涤。粗产物通过在三-区炉内升华进行纯化,获得纯产物(8.97g,77%),为橙色固体。
(d)合成2-(4-戊基苯基)-乙烯基]-并四苯(化合物36)
向2-溴并四苯(3.50g,11.39mmol)和2-[2-(4-戊基苯基)乙烯基]4,4,5,5-四甲基-1,3,2-二氧杂硼环戊烷(4.32g,13.67mmol)在甲苯(150ml)的混合物中加入2M碳酸钠(6.04g溶于28.5ml水,56.95mmol),然后加入相转移剂 336(2.28g,5.70mmol)。混合物用氮气鼓泡15分钟,然后加入四(三苯基膦)钯(0)(263.0mg,2mol%)。氮气气氛下混合物于90℃(油浴)加热3天。反应混合物冷却至室温,然后倒入甲醇中。滤出沉淀物,用稀酸(5%HCl)、水、甲醇和丙酮洗涤。粗产物通过在三-区炉内升华进行纯化,获得2.91g(64%)红色固体。
实施例16
合成2-(4-十二烷基苯基)-乙烯基]-并四苯(化合物54)
向2-溴并四苯(4.91g,15.97mmol)和4-十二烷基苯乙烯(5.22g,19.00mmol)在DMF(200ml,无水)的混合物中加入乙酸钠(1.97g,24.00mmol)。混合物用氮气鼓泡15分钟,然后加入反-二-m-乙酸根合二[2-(二-o-甲苯基膦基)苄基]二钯(II)(15.00mg,0.2mol%)。氮气气氛下混合物于135℃(油浴)加热2天。反应混合物冷却至室温。滤出沉淀物,用水、甲醇、氯仿和丙酮洗涤。粗产物通过在1-区炉内升华进行纯化,获得3.6O g(45%)红色固体。
实施例17
合成化合物42
向2-溴并四苯(3.60g,11.72mmol)和对-二乙烯基苯(0.51g,3.91mmol)在DMF(80ml,无水)的混合物中加入乙酸钠(1.44g,17.58mmol)。混合物用氮气鼓泡15分钟,然后加入反-二-m-乙酸根合二[2-(二-o-甲苯基膦基)苄基]二钯(II)(7.5mg,0.2mol%)。氮气气氛下混合物于135℃(油浴)加热2天。反应混合物冷却至室温,倒入甲醇中。滤出沉淀物,用水、甲醇和丙酮洗涤。粗产物通过在3-区炉内升华进行纯化,获得红色固体。
实施例18
本实施例说明在空穴输运层中使用芳基-亚乙烯基芳族化合物来制造OLED,及OLED的器件性质。
ITO用作玻璃基片上的阳极。有图案的ITO的玻璃基片用氧等离子体清洁5分钟。冷却后,立刻将缓冲材料的水分散体旋涂在ITO表面上。干燥后,将基片转移到真空沉积室,蒸发得200埃空穴输运材料。然后,通过共蒸发,沉积发蓝光的材料和主体材料。然后蒸发形成电子输运材料。该层油300埃ZrQ或者100埃Balq和100埃ZrQ制成。在该ZrQ层顶部蒸发形成6埃的氟化锂膜作为电子注入层。然后,在真空下改变掩模,通过热蒸发沉积1000埃Al层,形成阴极。将该真空室通到氩气,器件用玻璃盖、干燥剂和UV可固化的环氧树脂包封。所用的缩写如下:
缓冲层-1指聚(3,4-二氧噻吩)和聚合氟化磺酸的水分散体。该材料采用类似于与公开的美国专利申请2004/0254297的实施例3所述方法制备。
Balq指配合物二(2-甲基-8-羟基喹啉根)(4-苯基酚根)合铝。
ZrQ指配合物四(8-羟基喹啉根)合锆。
下面的NPB指N,N’-二(萘-1-基)-N,N’-二-(苯基)联苯胺。
用于器件的材料以及器件的特性示于下表2。
表2.OLED器件特性
值得注意的是并非在上面总的描述部分和实施例部分描述的所有工作均是需要的,一部分特定的工作是不需要的,并且除了所述工作以外还进行一种或多种其它工作。此外,列出工作的次序未必是进行这些工作的次序。
在上面的说明书中,参照具体实例对本发明原理进行了描述。但是,本领域的普通技术人员可以理解在不偏离所附权利要求规定的本发明范围的情况下可以进行各种改进和变化。因此,本说明书和附图应被认为是说明性而非限制性的,所有这些改进被包括在本发明范围内。
上面结合具体实例对本发明的益处、其它优点和解决问题的技术方案进行了说明。但是,所述益处、优点和解决问题的技术方案以及可以产生任何益处、优点和解决问题的技术方案或使其变得更明显的任何特征不应视为对任何或所有权利要求均是关键的、必需的或者是主要的特征。
应理解为了清楚起见描述于各个实例中的某些技术特征也可以合并于一个实例中的形式提供。相反,为了简洁起见描述于一个实例中的各个特征也可以单独或者以任何再组合形式提供。另外,数值范围內的数据包括在该范围內的每一个数值。
Claims (13)
2.如权利要求1所述的晶体管,其特征在于,所述绝缘层、栅极、半导体层、源极和漏极以任意顺序排列,条件是栅极和半导体层都与绝缘层接触;源极和漏极都与半导体层接触,所述源极和漏极相互隔开。
3.如权利要求1所述的晶体管,其特征在于,所述基片包括一种或多种无机玻璃、陶瓷箔、丙烯酸类、环氧树脂、聚酰胺、聚碳酸酯、聚酰亚胺、聚酮、聚(氧-1,4-亚苯氧基-1,4-亚苯基羰基-1,4-亚苯基)、聚降冰片烯、聚苯醚、聚(萘二羧酸乙二酯)、聚(对苯二甲酸乙二酯)、聚(苯硫醚)或者纤维增强的塑料。
4.如权利要求1所述的晶体管,其特征在于,所述栅极包含掺杂的硅;铝;金;铬;氧化铟锡;掺杂聚苯乙烯磺酸盐的聚(3,4-亚乙二氧基噻吩);分散在聚合物粘合剂中的炭黑或石墨;聚合物粘合剂中的胶态银分散体。
5.如权利要求1所述的晶体管,其特征在于,源极和漏极包含:铝、钡、钙、铬、金、银、镍、钯、铂、钛,以及它们的合金;碳纳米管;聚苯胺;聚(3,4-亚乙二氧基噻吩)/聚(苯乙烯磺酸盐);碳纳米管在导电聚合物中的分散体;金属在导电聚合物中的分散体;以及它们的多层材料。
6.如权利要求1所述的晶体管,其特征在于,绝缘层包含一种或多种氧化铝、氧化硅、氧化钽、氧化钛、氮化硅、钛酸钡、钛酸钡锶、锆酸钛酸钡、硒化锌、硫化锌,及它们的组合和多层材料;一种或多种聚酯、聚碳酸酯、聚(乙烯基苯酚)、聚酰亚胺、聚苯乙烯、聚(甲基丙烯酸酯)、聚(丙烯酸酯)、环氧树脂,以及它们的混合物和多层材料。
9.一种有机电子器件,该器件包括含至少一种权利要求8所述的化合物的电荷输运层。
10.如权利要求9所述的器件,其特征在于所述器件还包括阳极、阴极和位于它们之间的光活性层。
11.如权利要求9所述的器件,其特征在于,所述电荷输运层是空穴输运层,并位于光活性层和阳极之间。
12.如权利要求9所述的器件,其特征在于,所述电荷输运层是电子输运层,并位于光活性层和阴极之间。
13.一种有机电子器件,该器件包括阳极、阴极和位于它们之间的光活性层,所述光活性层包含至少一种权利要求8所述的化合物。
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CN201210160802XA Pending CN102683590A (zh) | 2005-04-15 | 2006-04-11 | 芳基-乙烯取代的芳族化合物及其作为有机半导体的应用 |
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EP (1) | EP1869720A4 (zh) |
JP (1) | JP5155852B2 (zh) |
KR (1) | KR101347419B1 (zh) |
CN (2) | CN101553929B (zh) |
TW (1) | TW200702422A (zh) |
WO (1) | WO2006113205A2 (zh) |
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- 2006-04-11 EP EP06749630A patent/EP1869720A4/en not_active Withdrawn
- 2006-04-11 WO PCT/US2006/013274 patent/WO2006113205A2/en active Application Filing
- 2006-04-11 CN CN201210160802XA patent/CN102683590A/zh active Pending
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WO2006113205A3 (en) | 2009-05-22 |
CN101553929A (zh) | 2009-10-07 |
CN101553929B (zh) | 2012-12-05 |
JP5155852B2 (ja) | 2013-03-06 |
WO2006113205A2 (en) | 2006-10-26 |
KR20080003883A (ko) | 2008-01-08 |
EP1869720A2 (en) | 2007-12-26 |
KR101347419B1 (ko) | 2014-02-06 |
EP1869720A4 (en) | 2011-09-21 |
TW200702422A (en) | 2007-01-16 |
JP2008538651A (ja) | 2008-10-30 |
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