CN102636962B - 一种空间成像套刻检验方法及阵列基板 - Google Patents
一种空间成像套刻检验方法及阵列基板 Download PDFInfo
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- CN102636962B CN102636962B CN201210025005.0A CN201210025005A CN102636962B CN 102636962 B CN102636962 B CN 102636962B CN 201210025005 A CN201210025005 A CN 201210025005A CN 102636962 B CN102636962 B CN 102636962B
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/708—Mark formation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Liquid Crystal (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
Abstract
Description
Claims (4)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210025005.0A CN102636962B (zh) | 2011-12-12 | 2012-02-06 | 一种空间成像套刻检验方法及阵列基板 |
US13/704,678 US9127934B2 (en) | 2011-12-12 | 2012-11-08 | Space imaging overlay inspection method and array substrate |
PCT/CN2012/084342 WO2013086913A1 (zh) | 2011-12-12 | 2012-11-08 | 空间成像套刻检验方法及阵列基板 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110412502 | 2011-12-12 | ||
CN201110412502.1 | 2011-12-12 | ||
CN201210025005.0A CN102636962B (zh) | 2011-12-12 | 2012-02-06 | 一种空间成像套刻检验方法及阵列基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102636962A CN102636962A (zh) | 2012-08-15 |
CN102636962B true CN102636962B (zh) | 2014-03-12 |
Family
ID=46621393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201210025005.0A Active CN102636962B (zh) | 2011-12-12 | 2012-02-06 | 一种空间成像套刻检验方法及阵列基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9127934B2 (zh) |
CN (1) | CN102636962B (zh) |
WO (1) | WO2013086913A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102636962B (zh) * | 2011-12-12 | 2014-03-12 | 北京京东方光电科技有限公司 | 一种空间成像套刻检验方法及阵列基板 |
CN105511235B (zh) * | 2016-02-15 | 2017-08-08 | 京东方科技集团股份有限公司 | 套刻键标、形成套刻键标的方法和测量套刻精度的方法 |
CN107275344B (zh) * | 2017-06-28 | 2019-12-31 | 武汉华星光电技术有限公司 | 低温多晶硅阵列基板及其制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1234523A (zh) * | 1998-04-28 | 1999-11-10 | 松下电器产业株式会社 | 液晶面板及其制造方法 |
CN101075054A (zh) * | 2007-07-06 | 2007-11-21 | 昆山龙腾光电有限公司 | 液晶显示装置的阵列基板及其制造方法 |
CN101312156A (zh) * | 2007-05-24 | 2008-11-26 | 株式会社丰田自动织机 | 制造有机电致发光元件的方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4677043A (en) * | 1985-11-01 | 1987-06-30 | Macdermid, Incorporated | Stepper process for VLSI circuit manufacture utilizing radiation absorbing dyestuff for registration of alignment markers and reticle |
US5633103A (en) * | 1994-10-28 | 1997-05-27 | Lucent Technologies Inc. | Self-aligned alignment marks for phase-shifting masks |
JPH10163588A (ja) * | 1996-12-03 | 1998-06-19 | Sumitomo Kinzoku Erekutorodebaisu:Kk | 回路基板 |
US6468704B1 (en) * | 2001-04-16 | 2002-10-22 | Taiwan Semiconductor Manufacturing Company | Method for improved photomask alignment after epitaxial process through 90° orientation change |
KR100451506B1 (ko) * | 2001-12-24 | 2004-10-06 | 주식회사 하이닉스반도체 | 오버레이 마크의 구조 및 형성 방법 |
KR100558714B1 (ko) * | 2003-10-14 | 2006-03-10 | 엘지.필립스 엘시디 주식회사 | 액정표시패널 및 그 제조 방법 |
CN100517064C (zh) * | 2005-08-08 | 2009-07-22 | 西安交通大学 | 大面积微压印专用超平整度软模具的制作方法 |
US7450296B2 (en) | 2006-01-30 | 2008-11-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for patterning alignment marks on a transparent substrate |
JP2011248207A (ja) * | 2010-05-28 | 2011-12-08 | Hitachi High-Technologies Corp | プロキシミティ露光装置、プロキシミティ露光装置のアライメント方法、及びパネル基板の製造方法 |
US8513822B1 (en) * | 2010-06-30 | 2013-08-20 | Kla-Tencor Corporation | Thin overlay mark for imaging based metrology |
US9543406B2 (en) * | 2010-11-30 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for overlay marks |
CN102636962B (zh) * | 2011-12-12 | 2014-03-12 | 北京京东方光电科技有限公司 | 一种空间成像套刻检验方法及阵列基板 |
-
2012
- 2012-02-06 CN CN201210025005.0A patent/CN102636962B/zh active Active
- 2012-11-08 WO PCT/CN2012/084342 patent/WO2013086913A1/zh active Application Filing
- 2012-11-08 US US13/704,678 patent/US9127934B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1234523A (zh) * | 1998-04-28 | 1999-11-10 | 松下电器产业株式会社 | 液晶面板及其制造方法 |
CN101312156A (zh) * | 2007-05-24 | 2008-11-26 | 株式会社丰田自动织机 | 制造有机电致发光元件的方法 |
CN101075054A (zh) * | 2007-07-06 | 2007-11-21 | 昆山龙腾光电有限公司 | 液晶显示装置的阵列基板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20140055795A1 (en) | 2014-02-27 |
WO2013086913A1 (zh) | 2013-06-20 |
US9127934B2 (en) | 2015-09-08 |
CN102636962A (zh) | 2012-08-15 |
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Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20141205 Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20141205 |
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Free format text: CORRECT: ADDRESS; FROM: 100176 DAXING, BEIJING TO: 100015 CHAOYANG, BEIJING |
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Effective date of registration: 20141205 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 Beijing city in Western Daxing District economic and Technological Development Zone, Road No. 8 Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |