CN102629568B - 半导体装置 - Google Patents

半导体装置 Download PDF

Info

Publication number
CN102629568B
CN102629568B CN201210026493.7A CN201210026493A CN102629568B CN 102629568 B CN102629568 B CN 102629568B CN 201210026493 A CN201210026493 A CN 201210026493A CN 102629568 B CN102629568 B CN 102629568B
Authority
CN
China
Prior art keywords
metal film
mentioned
film
semiconductor device
modulus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210026493.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN102629568A (zh
Inventor
山本祐广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ablic Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Publication of CN102629568A publication Critical patent/CN102629568A/zh
Application granted granted Critical
Publication of CN102629568B publication Critical patent/CN102629568B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
CN201210026493.7A 2011-02-07 2012-02-07 半导体装置 Expired - Fee Related CN102629568B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-024241 2011-02-07
JP2011024241A JP5677115B2 (ja) 2011-02-07 2011-02-07 半導体装置

Publications (2)

Publication Number Publication Date
CN102629568A CN102629568A (zh) 2012-08-08
CN102629568B true CN102629568B (zh) 2016-05-04

Family

ID=46587796

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210026493.7A Expired - Fee Related CN102629568B (zh) 2011-02-07 2012-02-07 半导体装置

Country Status (5)

Country Link
US (1) US20120199977A1 (enExample)
JP (1) JP5677115B2 (enExample)
KR (1) KR101903188B1 (enExample)
CN (1) CN102629568B (enExample)
TW (1) TW201304011A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5772926B2 (ja) 2013-01-07 2015-09-02 株式会社デンソー 半導体装置
JP2016143804A (ja) * 2015-02-03 2016-08-08 トヨタ自動車株式会社 半導体装置
JP2017224753A (ja) * 2016-06-16 2017-12-21 セイコーエプソン株式会社 半導体装置及びその製造方法
JP6897141B2 (ja) 2017-02-15 2021-06-30 株式会社デンソー 半導体装置とその製造方法
JP2018186144A (ja) 2017-04-25 2018-11-22 株式会社村田製作所 半導体装置及びパワーアンプモジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1574338A (zh) * 2003-06-24 2005-02-02 株式会社瑞萨科技 半导体器件
CN1770437A (zh) * 2004-11-02 2006-05-10 台湾积体电路制造股份有限公司 接合垫结构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09330928A (ja) * 1996-06-13 1997-12-22 Toshiba Corp 配線層の形成方法
US6960836B2 (en) * 2003-09-30 2005-11-01 Agere Systems, Inc. Reinforced bond pad
US20050215048A1 (en) 2004-03-23 2005-09-29 Lei Li Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
US7656045B2 (en) * 2006-02-23 2010-02-02 Freescale Semiconductor, Inc. Cap layer for an aluminum copper bond pad
TWI316295B (en) * 2006-05-17 2009-10-21 Au Optronics Corp Thin film transistor
JP2009016619A (ja) * 2007-07-05 2009-01-22 Denso Corp 半導体装置及びその製造方法
US8178980B2 (en) * 2008-02-05 2012-05-15 Taiwan Semiconductor Manufacturing Company, Ltd. Bond pad structure
US8030780B2 (en) * 2008-10-16 2011-10-04 Micron Technology, Inc. Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
US8202741B2 (en) * 2009-03-04 2012-06-19 Koninklijke Philips Electronics N.V. Method of bonding a semiconductor device using a compliant bonding structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1574338A (zh) * 2003-06-24 2005-02-02 株式会社瑞萨科技 半导体器件
CN1770437A (zh) * 2004-11-02 2006-05-10 台湾积体电路制造股份有限公司 接合垫结构

Also Published As

Publication number Publication date
JP5677115B2 (ja) 2015-02-25
TW201304011A (zh) 2013-01-16
KR101903188B1 (ko) 2018-10-01
KR20120090827A (ko) 2012-08-17
CN102629568A (zh) 2012-08-08
US20120199977A1 (en) 2012-08-09
JP2012164825A (ja) 2012-08-30

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20160405

Address after: Chiba County, Japan

Applicant after: SEIKO INSTR INC

Address before: Chiba County, Japan

Applicant before: Seiko Instruments Inc.

C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Chiba County, Japan

Patentee after: EPPs Lingke Co. Ltd.

Address before: Chiba County, Japan

Patentee before: SEIKO INSTR INC

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160504

Termination date: 20210207