CN102601521A - Method for internally processing transparent medium by femtosecond laser pulse sequence - Google Patents
Method for internally processing transparent medium by femtosecond laser pulse sequence Download PDFInfo
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- CN102601521A CN102601521A CN2012100847409A CN201210084740A CN102601521A CN 102601521 A CN102601521 A CN 102601521A CN 2012100847409 A CN2012100847409 A CN 2012100847409A CN 201210084740 A CN201210084740 A CN 201210084740A CN 102601521 A CN102601521 A CN 102601521A
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Abstract
The invention relates to a method for internally processing a transparent medium by a femtosecond laser pulse sequence, and belongs to the technical field of femtosecond laser application. The method comprises the steps of: firstly, generating a femtosecond pulse laser by a femtosecond laser system 1, and modulating the femtosecond laser to a femtosecond interval pulse sequence through a pulse shaper 5 by utilizing combined adjustment energy of a half-wave plate 2 and a polaroid 3; secondly, reflecting the pulse sequence laser obtained by the first step to an objective lens 9 to focus through a reflector 8, imaging by means of a CCD (charge coupled device) 7 and a lighting source 12, and moving a six-dimensional precise electric control platform 11 to make the laser focus locate inside a sample 10 horizontally placed; and finally, controlling the six-dimensional precise electric control platform 11 to move by a computer to process the sample 10 internally. In the invention, under same laser energy, compared with a conventional femtosecond laser processing method, the method can focus a deeper part inside the material for processing and modification by modulating the femtosecond laser to the femtosecond interval pulse sequence through the pulse shaper.
Description
Technical field
The present invention relates to a kind ofly, belong to the femtosecond laser applied technical field with the method for femto-second laser pulse sequence to the transparent medium machined.
Background technology
Laser can focus on the inside of transparent material, thereby makes and become possibility at the material internal processing micro structure.Femtosecond laser is directly write processing and is changed transparent dielectric material (like polymer such as glass, PMMA) inner refractive index, can be widely used in optical components such as preparation optical storage, body phase grating, fiber waveguide and 3D photo-coupler.Under certain energy, along with the increase of the depth of focus, because factor such as reflection, the energy of laser spot can reduce gradually, when the along laser energy less than the material internal modification or when processing threshold value, just can't process material internal.
Summary of the invention
To the objective of the invention is in order addressing the above problem, to provide a kind of with the method for femto-second laser pulse sequence to the transparent medium machined.
The objective of the invention is to realize through following technology:
Step 1: utilize fs-laser system to produce femtosecond pulse, utilize the combination adjustment energy of half-wave plate and polarizer, be modulated to femtosecond pulse train at interval to femtosecond laser through pulse shaper;
Step 2: in object lens, focus on through mirror reflects the resulting pulse train laser of step 1,, move the accurate automatically controlled platform of 6 dimensions, make laser spot be positioned at the sample interior of horizontal positioned by CCD and lighting source imaging;
Step 3: the accurate automatically controlled platform motion of 6 dimensions of computerizeing control, can process in sample interior.
Said sample is transparent dielectric material, and the internal focus degree of depth must be less than the focal length of focusing objective len.
Said sample levels is fixed on the transparent slide.
The device of realizing the inventive method comprises: fs-laser system, half-wave plate, polarizer, electric-controlled switch, pulse shaper, speculum, focusing objective len, sample, the accurate automatically controlled platform of 6 dimensions.
Its annexation is: the trend according to laser connects in order.Fs-laser system produces femtosecond laser, and the combination adjustment energy that utilizes half-wave plate and polarizer gets into pulse shaper and is modulated to pulse train afterwards through behind the electric-controlled switch, is gone in the focusing objective len to focus on by the mirror reflects of 45 ° of placements then.
Beneficial effect
1, be modulated to femtosecond pulse train at interval to femtosecond laser through pulse shaper among the present invention, under identical laser energy, this method is compared with traditional femtosecond laser processing method, can focus on material internal and more carry out processing modified in the depths.
Description of drawings
Fig. 1 is femto-second laser pulse sequence processing light path sketch map:
Fig. 2 is the light microscope comparison diagram of traditional diamond-making technique and the inventive method processing grating.
Wherein, 1-fs-laser system, 2-half-wave plate, 3-polarizer, 4-electric-controlled switch, 5-pulse shaper, 6-speculum, 7-CCD, 8-speculum, 9-focusing objective len, 10-sample, 11-6 tie up the light microscope figure of accurate automatically controlled platform, 12-lighting source, 13-slide, 14-femtosecond pulse sequence processing grating, the light microscope figure of 15-tradition femtosecond laser processing grating.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
What fs-laser system 1 adopted is the laser instrument that U.S.'s spectrum physics (Spectrum Physics) company produces, optical maser wavelength 800nm, and pulse width 50 femtoseconds, repetition rate 1K Hz, pulse ceiling capacity 3mJ, light distribution is a Gaussian, linear polarization.
The present invention proposes a kind ofly with the method for femto-second laser pulse sequence to the transparent medium machined, processing light path sketch map is as shown in Figure 1, and concrete procedure of processing is following:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse; 3 combinations are adjusted into 6 μ J to single pulse energy with polarizer to utilize half-wave plate 2; Open electric-controlled switch 4; Be modulated to pulse train to traditional femtosecond laser through pulse shaper 5, comprise two sub-pulse in this sequence, the pulse spacing is 700 femtoseconds;
Step 2: be horizontally fixed on slide 13 on the accurate automatically controlled platform 11 of 6 dimensions, be horizontally fixed on sample 10 on the slide 13 with double faced adhesive tape;
Step 3: reflex to focusing in 20 times of object lens 9 to the resulting pulse train laser of step 1 through speculum 8, by CCD 7 and lighting source 12 imagings; Moving the accurate automatically controlled platform 11 of 6 dimensions makes laser spot be positioned at the upper surface of sample 10; The accurate automatically controlled platform 11 of control 6 dimensions moves 90 μ m along the opposite direction of laser propagation, because the refraction action of light, this moment, laser spot was positioned at about 120 μ m places under sample 10 upper surfaces;
Step 4: the accurate automatically controlled platform 11 of computer control 6 dimensions has processed a grating with the constant speed of 60 μ m/s on this horizontal plane, its light microscope picture is shown among Fig. 2 14;
When closing pulse shaper, promptly be that its light microscope picture is shown among Fig. 2 15 with traditional femtosecond laser processing method processing grating under the immovable situation of other experimental procedures;
Comparison through microscopic examination and He-Ne laser diffraction pattern; Discovery is at this depth of focus place; Under this processing conditions, traditional femtosecond laser almost can't be to the vitreous silica inter-modification, and 700 femtoseconds femto-second laser pulse sequence at interval then can be to the vitreous silica inter-modification.
What fs-laser system 1 adopted is the laser instrument that U.S.'s spectrum physics (Spectrum Physics) company produces, optical maser wavelength 800nm, and pulse width 50 femtoseconds, repetition rate 1K Hz, pulse ceiling capacity 3mJ, light distribution is a Gaussian, linear polarization.
The present invention proposes a kind ofly with the method for femto-second laser pulse sequence to the transparent medium machined, processing light path sketch map is as shown in Figure 1, and concrete procedure of processing is following:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse; 3 combinations are adjusted into 4 μ J to single pulse energy with polarizer to utilize half-wave plate 2; Open electric-controlled switch 4; Be modulated to pulse train to traditional femtosecond laser through pulse shaper 5, comprise two sub-pulse in this sequence, the pulse spacing is 500 femtoseconds;
Step 2: be horizontally fixed on slide 13 on the accurate automatically controlled platform 11 of 6 dimensions, be horizontally fixed on sample 10 on the slide 13 with double faced adhesive tape;
Step 3: reflex to focusing in 20 times of object lens 9 to the resulting pulse train laser of step 1 through speculum 8, by CCD 7 and lighting source 12 imagings; Moving the accurate automatically controlled platform 11 of 6 dimensions makes laser spot be positioned at the upper surface of sample 10;
Step 4: the accurate automatically controlled platform 11 of control 6 dimensions moves 10 μ m along the opposite direction of laser propagation, with electric-controlled switch 4 control laser and sample 10 effect 0.5s, makes the along modification;
Step 5: the accurate automatically controlled platform 11 of control 6 dimensions moves horizontally 100 μ m, repeating step four;
Step 6: repeating step four and step 55 times;
Step 7: close pulse shaper, repeating step two is promptly used traditional femtosecond laser focusing place's modification to step 6;
Take off sample 10; Use observation by light microscope; The maximum of adding up pulse train and traditional femtosecond pulse respectively can the processing modified degree of depth, and experimental result shows, under this experiment condition; The pulse train maximum that is spaced apart 500 femtoseconds can the processing modified degree of depth be about 60 μ m, and the maximum of traditional femtosecond pulse can the processing modified degree of depth be about 20 μ m.
Claims (3)
1. one kind with the method for femto-second laser pulse sequence to the transparent medium machined, it is characterized in that: comprise the steps:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse, utilize the combination adjustment energy of half-wave plate 2 and polarizer 3, be modulated to femtosecond pulse train at interval to femtosecond laser through pulse shaper 5;
Step 2: reflex to focusing in the object lens 9 to the resulting pulse train laser of step 1 through speculum 8,, move the accurate automatically controlled platform 11 of 6 dimensions, make laser spot be positioned at sample 10 inside of horizontal positioned by CCD 7 and lighting source 12 imagings;
Step 3: accurate automatically controlled platform 11 motions of 6 dimensions of computerizeing control, can process in sample 10 inside.
2. as claimed in claim 1 a kind of with the method for femto-second laser pulse sequence to the transparent medium machined, it is characterized in that: said sample 10 materials of step 2 are transparent dielectric material, and the internal focus degree of depth must be less than the focal length of focusing objective len 9.
3. as claimed in claim 1 a kind of with the method for femto-second laser pulse sequence to the transparent medium machined; It is characterized in that: after can also transparent slide 13 being horizontally fixed on the below of the said sample 10 of step 2, be positioned over again on the accurate automatically controlled platform 11 of 6 dimensions.
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103639601A (en) * | 2013-12-19 | 2014-03-19 | 北京理工大学 | Three-dimensional periodic structure processing method based on electronic dynamic control |
| CN103706955A (en) * | 2013-12-19 | 2014-04-09 | 北京理工大学 | Method for preparing high depth-diameter-ratio three-dimensional micro-channel through electronic dynamic control |
| CN103928833A (en) * | 2014-04-11 | 2014-07-16 | 北京理工大学 | Pulse sequence modulator based on film coating |
| CN104591549A (en) * | 2014-12-29 | 2015-05-06 | 北京理工大学 | Method for processing micro array on glass surface via femtosecond laser pulse sequence |
| CN105562865A (en) * | 2014-11-05 | 2016-05-11 | 深圳市韵腾激光科技有限公司 | Method for segmental tin soldering by enabling green laser to continuously pass through outer attenuation device |
| CN106041313A (en) * | 2016-06-22 | 2016-10-26 | 中南大学 | Uniform modification processing method of transparent medium microstructures |
| CN106216831A (en) * | 2016-08-22 | 2016-12-14 | 大族激光科技产业集团股份有限公司 | Laser-processing system and laser focusing method |
| CN106466759A (en) * | 2015-08-11 | 2017-03-01 | 上海交通大学 | Method and device using the modified surface modification of laser overlaying welding device to hole inner wall surface |
| CN107243698A (en) * | 2017-08-14 | 2017-10-13 | 华北理工大学 | Method of the femtosecond laser in inside quartz glass ablation microchannel |
| CN108286936A (en) * | 2017-04-18 | 2018-07-17 | 北京理工大学 | Laser micro/nano processes differential confocal on-line monitoring integral method and device |
| CN109116470A (en) * | 2017-06-23 | 2019-01-01 | 福州高意光学有限公司 | A kind of waveguide structure fabrication method |
| CN110104687A (en) * | 2019-05-30 | 2019-08-09 | 国家纳米科学中心 | A kind of oxygen doping method of modifying of two-dimensional material |
| US11008250B2 (en) | 2014-06-25 | 2021-05-18 | Nkt Photonics A/S | Laser processing |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6127940A (en) * | 1998-02-02 | 2000-10-03 | Wein Products, Inc. | Infra-red secure remote controller |
| CN1294540A (en) * | 1999-02-25 | 2001-05-09 | 精工爱普生株式会社 | Method for machining work by laser beam |
| EP1014605B1 (en) * | 1998-12-24 | 2005-12-14 | Oerlikon Contraves Ag | Optical coding system for a series of impulses |
| CN101020277A (en) * | 2007-03-22 | 2007-08-22 | 苏州德龙激光有限公司 | Distributed laser processing system |
| CN101143405A (en) * | 2006-09-12 | 2008-03-19 | 株式会社迪思科 | Laser beam machining system |
| CN101363964A (en) * | 2008-09-18 | 2009-02-11 | 高秀敏 | Adjustable ring vector light beam producing system |
| CN101387759A (en) * | 2008-10-23 | 2009-03-18 | 高秀敏 | Light polarization regulating and shaping system |
| CN101403823A (en) * | 2008-10-28 | 2009-04-08 | 杭州电子科技大学 | Vector ring-shaped light beam reshaping apparatus |
| CN101504490A (en) * | 2009-03-20 | 2009-08-12 | 上海理工大学 | Ring-shaped vector light beam focusing system |
| WO2009103313A1 (en) * | 2008-02-19 | 2009-08-27 | Bergmann Messgeräte Entwicklung Kg | Generation of burst of laser pulses |
| CN102315583A (en) * | 2011-08-08 | 2012-01-11 | 上海致凯捷激光科技有限公司 | Electro-optical Q laser used for high speed glass processing |
| WO2012006736A2 (en) * | 2010-07-12 | 2012-01-19 | Filaser Inc. | Method of material processing by laser filamentation |
-
2012
- 2012-03-27 CN CN2012100847409A patent/CN102601521A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6127940A (en) * | 1998-02-02 | 2000-10-03 | Wein Products, Inc. | Infra-red secure remote controller |
| EP1014605B1 (en) * | 1998-12-24 | 2005-12-14 | Oerlikon Contraves Ag | Optical coding system for a series of impulses |
| CN1294540A (en) * | 1999-02-25 | 2001-05-09 | 精工爱普生株式会社 | Method for machining work by laser beam |
| CN101143405A (en) * | 2006-09-12 | 2008-03-19 | 株式会社迪思科 | Laser beam machining system |
| CN101020277A (en) * | 2007-03-22 | 2007-08-22 | 苏州德龙激光有限公司 | Distributed laser processing system |
| WO2009103313A1 (en) * | 2008-02-19 | 2009-08-27 | Bergmann Messgeräte Entwicklung Kg | Generation of burst of laser pulses |
| CN101363964A (en) * | 2008-09-18 | 2009-02-11 | 高秀敏 | Adjustable ring vector light beam producing system |
| CN101387759A (en) * | 2008-10-23 | 2009-03-18 | 高秀敏 | Light polarization regulating and shaping system |
| CN101403823A (en) * | 2008-10-28 | 2009-04-08 | 杭州电子科技大学 | Vector ring-shaped light beam reshaping apparatus |
| CN101504490A (en) * | 2009-03-20 | 2009-08-12 | 上海理工大学 | Ring-shaped vector light beam focusing system |
| WO2012006736A2 (en) * | 2010-07-12 | 2012-01-19 | Filaser Inc. | Method of material processing by laser filamentation |
| CN102315583A (en) * | 2011-08-08 | 2012-01-11 | 上海致凯捷激光科技有限公司 | Electro-optical Q laser used for high speed glass processing |
Non-Patent Citations (1)
| Title |
|---|
| YAN LI.ET AL: "Three-dimensional hole drilling of silica glass from the rear surface with femtosecond laser pulses", 《OPTICS LETTERS》 * |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103706955A (en) * | 2013-12-19 | 2014-04-09 | 北京理工大学 | Method for preparing high depth-diameter-ratio three-dimensional micro-channel through electronic dynamic control |
| CN103639601B (en) * | 2013-12-19 | 2015-05-20 | 北京理工大学 | Three-dimensional periodic structure processing method based on electronic dynamic control |
| CN103639601A (en) * | 2013-12-19 | 2014-03-19 | 北京理工大学 | Three-dimensional periodic structure processing method based on electronic dynamic control |
| CN103928833A (en) * | 2014-04-11 | 2014-07-16 | 北京理工大学 | Pulse sequence modulator based on film coating |
| CN103928833B (en) * | 2014-04-11 | 2016-08-31 | 北京理工大学 | A kind of pulse train manipulator based on plated film |
| US11008250B2 (en) | 2014-06-25 | 2021-05-18 | Nkt Photonics A/S | Laser processing |
| CN105562865A (en) * | 2014-11-05 | 2016-05-11 | 深圳市韵腾激光科技有限公司 | Method for segmental tin soldering by enabling green laser to continuously pass through outer attenuation device |
| CN104591549A (en) * | 2014-12-29 | 2015-05-06 | 北京理工大学 | Method for processing micro array on glass surface via femtosecond laser pulse sequence |
| CN106466759A (en) * | 2015-08-11 | 2017-03-01 | 上海交通大学 | Method and device using the modified surface modification of laser overlaying welding device to hole inner wall surface |
| CN106041313A (en) * | 2016-06-22 | 2016-10-26 | 中南大学 | Uniform modification processing method of transparent medium microstructures |
| CN106216831A (en) * | 2016-08-22 | 2016-12-14 | 大族激光科技产业集团股份有限公司 | Laser-processing system and laser focusing method |
| CN106216831B (en) * | 2016-08-22 | 2018-04-27 | 大族激光科技产业集团股份有限公司 | Laser-processing system and laser focusing method |
| CN108286936A (en) * | 2017-04-18 | 2018-07-17 | 北京理工大学 | Laser micro/nano processes differential confocal on-line monitoring integral method and device |
| CN109116470A (en) * | 2017-06-23 | 2019-01-01 | 福州高意光学有限公司 | A kind of waveguide structure fabrication method |
| CN109116470B (en) * | 2017-06-23 | 2021-02-12 | 福州高意光学有限公司 | Method for manufacturing waveguide structure |
| CN107243698A (en) * | 2017-08-14 | 2017-10-13 | 华北理工大学 | Method of the femtosecond laser in inside quartz glass ablation microchannel |
| CN110104687A (en) * | 2019-05-30 | 2019-08-09 | 国家纳米科学中心 | A kind of oxygen doping method of modifying of two-dimensional material |
| CN110104687B (en) * | 2019-05-30 | 2021-11-16 | 国家纳米科学中心 | Oxygen doping modification method of two-dimensional material |
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Application publication date: 20120725 |