CN102569253B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN102569253B
CN102569253B CN201110420964.8A CN201110420964A CN102569253B CN 102569253 B CN102569253 B CN 102569253B CN 201110420964 A CN201110420964 A CN 201110420964A CN 102569253 B CN102569253 B CN 102569253B
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CN
China
Prior art keywords
conductive component
pad
wiring
circuit part
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201110420964.8A
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English (en)
Chinese (zh)
Other versions
CN102569253A (zh
Inventor
小仓正徳
小林秀央
黑田享裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102569253A publication Critical patent/CN102569253A/zh
Application granted granted Critical
Publication of CN102569253B publication Critical patent/CN102569253B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/427—Power or ground buses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN201110420964.8A 2010-12-20 2011-12-15 半导体装置 Active CN102569253B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010283771A JP5656611B2 (ja) 2010-12-20 2010-12-20 半導体装置及び固体撮像装置
JP2010-283771 2010-12-20

Publications (2)

Publication Number Publication Date
CN102569253A CN102569253A (zh) 2012-07-11
CN102569253B true CN102569253B (zh) 2014-10-01

Family

ID=46233250

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110420964.8A Active CN102569253B (zh) 2010-12-20 2011-12-15 半导体装置

Country Status (3)

Country Link
US (1) US8581361B2 (https=)
JP (1) JP5656611B2 (https=)
CN (1) CN102569253B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5746494B2 (ja) * 2010-11-24 2015-07-08 ルネサスエレクトロニクス株式会社 半導体装置、液晶ディスプレイパネル及び携帯情報端末
JP2017084944A (ja) * 2015-10-27 2017-05-18 株式会社デンソー 半導体装置
JP6658047B2 (ja) 2016-02-12 2020-03-04 セイコーエプソン株式会社 画像読取装置及び半導体装置
JP2018152715A (ja) * 2017-03-13 2018-09-27 セイコーエプソン株式会社 画像読取装置及び半導体装置
US10811059B1 (en) * 2019-03-27 2020-10-20 Micron Technology, Inc. Routing for power signals including a redistribution layer
JP7362380B2 (ja) 2019-09-12 2023-10-17 キヤノン株式会社 配線基板及び半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501487A (zh) * 2002-11-15 2004-06-02 ������������ʽ���� 半导体装置及其制造方法
CN1725482A (zh) * 2004-07-23 2006-01-25 海力士半导体有限公司 用于半导体器件中的焊盘区的布线结构
CN101211911A (zh) * 2006-12-28 2008-07-02 松下电器产业株式会社 半导体集成电路装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3270874B2 (ja) * 1993-09-21 2002-04-02 ソニー株式会社 リニアセンサ
JP2005243907A (ja) * 2004-02-26 2005-09-08 Renesas Technology Corp 半導体装置
JP4714502B2 (ja) * 2005-04-26 2011-06-29 パナソニック株式会社 固体撮像装置
JP2007042718A (ja) * 2005-08-01 2007-02-15 Renesas Technology Corp 半導体装置
JP2007184311A (ja) * 2005-12-29 2007-07-19 Sony Corp 固体撮像装置およびその製造方法
JP4986114B2 (ja) * 2006-04-17 2012-07-25 ルネサスエレクトロニクス株式会社 半導体集積回路及び半導体集積回路の設計方法
JP2008078354A (ja) * 2006-09-21 2008-04-03 Renesas Technology Corp 半導体装置
JP5537016B2 (ja) * 2008-10-27 2014-07-02 株式会社東芝 半導体装置および半導体装置の製造方法
JP2010251595A (ja) * 2009-04-17 2010-11-04 Renesas Electronics Corp 半導体撮像装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501487A (zh) * 2002-11-15 2004-06-02 ������������ʽ���� 半导体装置及其制造方法
CN1725482A (zh) * 2004-07-23 2006-01-25 海力士半导体有限公司 用于半导体器件中的焊盘区的布线结构
CN101211911A (zh) * 2006-12-28 2008-07-02 松下电器产业株式会社 半导体集成电路装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2007-287908A 2007.11.01

Also Published As

Publication number Publication date
JP2012134257A (ja) 2012-07-12
JP5656611B2 (ja) 2015-01-21
US20120153367A1 (en) 2012-06-21
CN102569253A (zh) 2012-07-11
US8581361B2 (en) 2013-11-12

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