CN102569063B - 半导体装置的制造方法 - Google Patents

半导体装置的制造方法 Download PDF

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Publication number
CN102569063B
CN102569063B CN201110416334.3A CN201110416334A CN102569063B CN 102569063 B CN102569063 B CN 102569063B CN 201110416334 A CN201110416334 A CN 201110416334A CN 102569063 B CN102569063 B CN 102569063B
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CN
China
Prior art keywords
film
face
insulating film
polysilicon film
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110416334.3A
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English (en)
Chinese (zh)
Other versions
CN102569063A (zh
Inventor
中泽亨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102569063A publication Critical patent/CN102569063A/zh
Application granted granted Critical
Publication of CN102569063B publication Critical patent/CN102569063B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/03—Gettering within semiconductor bodies within silicon bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H10W10/0143—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations comprising concurrently refilling multiple trenches having different shapes or dimensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations

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  • Element Separation (AREA)
CN201110416334.3A 2010-12-14 2011-12-14 半导体装置的制造方法 Expired - Fee Related CN102569063B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010278395A JP5882579B2 (ja) 2010-12-14 2010-12-14 半導体装置の製造方法
JP2010-278395 2010-12-14

Publications (2)

Publication Number Publication Date
CN102569063A CN102569063A (zh) 2012-07-11
CN102569063B true CN102569063B (zh) 2014-07-16

Family

ID=46199788

Family Applications (1)

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CN201110416334.3A Expired - Fee Related CN102569063B (zh) 2010-12-14 2011-12-14 半导体装置的制造方法

Country Status (3)

Country Link
US (1) US8426291B2 (https=)
JP (1) JP5882579B2 (https=)
CN (1) CN102569063B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014030450A1 (ja) * 2012-08-22 2014-02-27 富士電機株式会社 半導体装置の製造方法
JP2016009730A (ja) * 2014-06-23 2016-01-18 株式会社東芝 半導体装置の製造方法
JP6676365B2 (ja) * 2015-12-21 2020-04-08 キヤノン株式会社 撮像装置の製造方法
US9852912B1 (en) * 2016-09-20 2017-12-26 United Microelectronics Corp. Method of manufacturing semiconductor device for reducing grain size of polysilicon
DE102016121680B4 (de) 2016-11-11 2024-05-29 Infineon Technologies Ag Halbleiterwafer und Halbleitervorrichtungen mit einer Sperrschicht und Verfahren zur Herstellung
CN115083931A (zh) * 2022-05-26 2022-09-20 华虹半导体(无锡)有限公司 改善晶圆翘曲的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5063113A (en) * 1988-07-28 1991-11-05 Fujitsu Limited Substrate having semiconductor-on-insulator structure with gettering sites and production method thereof
JPH077008A (ja) * 1993-06-18 1995-01-10 Rohm Co Ltd 半導体装置製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6446937A (en) * 1987-08-15 1989-02-21 Nec Yamagata Ltd Manufacture of semiconductor device
JP2689004B2 (ja) 1989-12-15 1997-12-10 三菱電機株式会社 半導体装置
JPH0414836A (ja) * 1990-05-08 1992-01-20 Nec Corp Ｓｉ基板
JPH05235004A (ja) * 1992-02-24 1993-09-10 Sony Corp 半導体基板の製造方法
JPH09120965A (ja) * 1995-10-25 1997-05-06 Toshiba Corp 半導体装置の製造方法
JP3279234B2 (ja) 1997-10-27 2002-04-30 キヤノン株式会社 半導体装置の製造方法
US6333519B1 (en) 1998-08-12 2001-12-25 Canon Kabushiki Kaisha Semiconductor apparatus process for production thereof and liquid crystal apparatus
JP2010040638A (ja) 2008-08-01 2010-02-18 Sumco Corp Ｓｏｉ基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5063113A (en) * 1988-07-28 1991-11-05 Fujitsu Limited Substrate having semiconductor-on-insulator structure with gettering sites and production method thereof
JPH077008A (ja) * 1993-06-18 1995-01-10 Rohm Co Ltd 半導体装置製造方法

Also Published As

Publication number Publication date
US8426291B2 (en) 2013-04-23
CN102569063A (zh) 2012-07-11
JP5882579B2 (ja) 2016-03-09
JP2012129312A (ja) 2012-07-05
US20120149170A1 (en) 2012-06-14

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Granted publication date: 20140716

Termination date: 20201214

CF01 Termination of patent right due to non-payment of annual fee