CN102513313A - 具有碳化硅包覆层的喷淋头的污染物处理方法 - Google Patents
具有碳化硅包覆层的喷淋头的污染物处理方法 Download PDFInfo
- Publication number
- CN102513313A CN102513313A CN2011104535825A CN201110453582A CN102513313A CN 102513313 A CN102513313 A CN 102513313A CN 2011104535825 A CN2011104535825 A CN 2011104535825A CN 201110453582 A CN201110453582 A CN 201110453582A CN 102513313 A CN102513313 A CN 102513313A
- Authority
- CN
- China
- Prior art keywords
- spray head
- deionized water
- processing method
- clean
- acid solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Detergent Compositions (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Description
Claims (15)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110453582.5A CN102513313B (zh) | 2011-12-29 | 2011-12-29 | 具有碳化硅包覆层的喷淋头的污染物处理方法 |
TW101129593A TWI569894B (zh) | 2011-12-29 | 2012-08-15 | Pollutant Treatment Method for Sprinkler with Silicon Carbide Coated |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110453582.5A CN102513313B (zh) | 2011-12-29 | 2011-12-29 | 具有碳化硅包覆层的喷淋头的污染物处理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102513313A true CN102513313A (zh) | 2012-06-27 |
CN102513313B CN102513313B (zh) | 2014-10-15 |
Family
ID=46284524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110453582.5A Active CN102513313B (zh) | 2011-12-29 | 2011-12-29 | 具有碳化硅包覆层的喷淋头的污染物处理方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN102513313B (zh) |
TW (1) | TWI569894B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115418623A (zh) * | 2022-04-08 | 2022-12-02 | 安徽富乐德科技发展股份有限公司 | 治具保护下真空提拉泵辅助清洗喷淋头孔洞的方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0928769A (ja) * | 1995-07-18 | 1997-02-04 | Mizu Kk | 電気分解を用いた殺菌洗浄方法及び殺菌洗浄装置 |
WO2001000338A1 (en) * | 1999-06-29 | 2001-01-04 | L-Tech Corporation | Chemical film cleaning and drying |
JP2002001243A (ja) * | 2000-06-23 | 2002-01-08 | Kurita Water Ind Ltd | 電子材料の洗浄方法 |
JP2005052810A (ja) * | 2003-07-31 | 2005-03-03 | Joho Kagaku Kenkyusho:Kk | 酸化及び還元コロイド法に基づく原子価変換方式による物質の洗浄技術 |
CN101194046A (zh) * | 2004-06-09 | 2008-06-04 | 兰姆研究公司 | 用于等离子体处理腔的元件的石英表面的湿清洁方法 |
CN101204701A (zh) * | 2006-12-21 | 2008-06-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种阳极氧化零件表面的清洗方法 |
CN101219429A (zh) * | 2007-01-10 | 2008-07-16 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种多晶刻蚀腔室中石英零件表面的清洗方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW506850B (en) * | 2000-11-21 | 2002-10-21 | Desiccant Technology Corp | Regeneration method of turning-wheel absorption concentration system |
JP3783637B2 (ja) * | 2002-03-08 | 2006-06-07 | セイコーエプソン株式会社 | 材料の除去方法、基材の再生方法、表示装置の製造方法、及び該製造方法によって製造された表示装置を備えた電子機器 |
TWI309430B (en) * | 2002-08-22 | 2009-05-01 | Macronix Int Co Ltd | A method for cleaning wafer |
CN101214485B (zh) * | 2007-01-04 | 2010-07-21 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种多晶硅刻蚀腔室中阳极氧化零件表面的清洗方法 |
-
2011
- 2011-12-29 CN CN201110453582.5A patent/CN102513313B/zh active Active
-
2012
- 2012-08-15 TW TW101129593A patent/TWI569894B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0928769A (ja) * | 1995-07-18 | 1997-02-04 | Mizu Kk | 電気分解を用いた殺菌洗浄方法及び殺菌洗浄装置 |
WO2001000338A1 (en) * | 1999-06-29 | 2001-01-04 | L-Tech Corporation | Chemical film cleaning and drying |
JP2002001243A (ja) * | 2000-06-23 | 2002-01-08 | Kurita Water Ind Ltd | 電子材料の洗浄方法 |
JP2005052810A (ja) * | 2003-07-31 | 2005-03-03 | Joho Kagaku Kenkyusho:Kk | 酸化及び還元コロイド法に基づく原子価変換方式による物質の洗浄技術 |
CN101194046A (zh) * | 2004-06-09 | 2008-06-04 | 兰姆研究公司 | 用于等离子体处理腔的元件的石英表面的湿清洁方法 |
CN101204701A (zh) * | 2006-12-21 | 2008-06-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种阳极氧化零件表面的清洗方法 |
CN101219429A (zh) * | 2007-01-10 | 2008-07-16 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种多晶刻蚀腔室中石英零件表面的清洗方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115418623A (zh) * | 2022-04-08 | 2022-12-02 | 安徽富乐德科技发展股份有限公司 | 治具保护下真空提拉泵辅助清洗喷淋头孔洞的方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201325745A (zh) | 2013-07-01 |
TWI569894B (zh) | 2017-02-11 |
CN102513313B (zh) | 2014-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100571900C (zh) | 一种阳极氧化零件表面的清洗方法 | |
CN101214485B (zh) | 一种多晶硅刻蚀腔室中阳极氧化零件表面的清洗方法 | |
TWI575594B (zh) | 清洗鋁電漿室部件之方法 | |
CN100571904C (zh) | 一种石英材料零件的清洗方法 | |
JP6584249B2 (ja) | プラズマ処理チャンバの構成部品を洗浄する湿式洗浄工程 | |
CN107658221A (zh) | 一种金刚线切割多晶硅片的制绒方法 | |
CN101154558A (zh) | 刻蚀设备组件的清洗方法 | |
CN111900070A (zh) | 半导体高阶制程蚀刻装置硅部件的再生清洗和返修方法 | |
CN102513314B (zh) | 具有氧化钇包覆层的工件的污染物的处理方法 | |
CN100468676C (zh) | 半导体器件焊盘形成方法 | |
CN110364424B (zh) | 半导体处理设备零部件的清洗方法 | |
CN1303518A (zh) | 腐蚀后碱处理方法 | |
CN102403192A (zh) | 衬底清洗方法 | |
CN1247486A (zh) | 钝化金属化层的方法 | |
CN102513313B (zh) | 具有碳化硅包覆层的喷淋头的污染物处理方法 | |
US5980643A (en) | Alkaline water-based solution for cleaning metallized microelectronic | |
CN113245279A (zh) | 陶瓷件清洗方法 | |
JP4544425B2 (ja) | 希土類金属部材の製造方法 | |
WO2012001874A1 (ja) | 太陽電池基板用半導体ウェーハの洗浄方法 | |
CN103042009B (zh) | 一种多晶硅料生产还原炉用电极保护罩的清洗方法 | |
KR101416103B1 (ko) | 불순물 제거용 세정액 및 이를 이용한 불순물 제거방법 | |
CN1577764A (zh) | 半导体晶片的湿化学表面处理方法 | |
KR101878123B1 (ko) | 웨이퍼 척 테이블용 세정액 및 이를 이용한 웨이퍼 척 테이블의 화학적 세정방법 | |
JP2008153271A (ja) | 使用済み治具の洗浄方法および洗浄組成物 | |
KR20090121527A (ko) | 실리콘 웨이퍼 재생방법 및 그 재생장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Pollutant treatment method for spray head with silicon carbide cover layer Effective date of registration: 20150202 Granted publication date: 20141015 Pledgee: China Development Bank Co Pledgor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Registration number: 2009310000663 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170809 Granted publication date: 20141015 Pledgee: China Development Bank Co Pledgor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Registration number: 2009310000663 |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd. Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc. |