CN102498549A - 沟槽式化学机械抛光抛光垫 - Google Patents
沟槽式化学机械抛光抛光垫 Download PDFInfo
- Publication number
- CN102498549A CN102498549A CN2010800414168A CN201080041416A CN102498549A CN 102498549 A CN102498549 A CN 102498549A CN 2010800414168 A CN2010800414168 A CN 2010800414168A CN 201080041416 A CN201080041416 A CN 201080041416A CN 102498549 A CN102498549 A CN 102498549A
- Authority
- CN
- China
- Prior art keywords
- polishing pad
- pad
- groove
- polishing
- overlap joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27106809P | 2009-07-16 | 2009-07-16 | |
US61/271,068 | 2009-07-16 | ||
PCT/US2010/042073 WO2011008918A2 (fr) | 2009-07-16 | 2010-07-15 | Tampon rainuré de polissage chimico-mécanique |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102498549A true CN102498549A (zh) | 2012-06-13 |
Family
ID=43450188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010800414168A Pending CN102498549A (zh) | 2009-07-16 | 2010-07-15 | 沟槽式化学机械抛光抛光垫 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110014858A1 (fr) |
JP (1) | JP2012533888A (fr) |
KR (1) | KR101478414B1 (fr) |
CN (1) | CN102498549A (fr) |
SG (2) | SG177625A1 (fr) |
TW (1) | TWI519384B (fr) |
WO (1) | WO2011008918A2 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104736297A (zh) * | 2012-12-26 | 2015-06-24 | 东洋橡胶工业株式会社 | 层叠抛光垫的制造方法 |
CN105793962A (zh) * | 2013-10-18 | 2016-07-20 | 嘉柏微电子材料股份公司 | 具有偏置的同心凹槽图案的边缘排除区域的化学机械抛光抛光垫 |
CN112720282A (zh) * | 2020-12-31 | 2021-04-30 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫 |
CN113829176A (zh) * | 2021-08-31 | 2021-12-24 | 北京航天控制仪器研究所 | 一种用于铍材镜体研磨抛光的研磨平板及研磨抛光方法 |
CN114274043A (zh) * | 2021-12-29 | 2022-04-05 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009018434B4 (de) * | 2009-04-22 | 2023-11-30 | Ev Group Gmbh | Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten |
DE102011082777A1 (de) * | 2011-09-15 | 2012-02-09 | Siltronic Ag | Verfahren zum beidseitigen Polieren einer Halbleiterscheibe |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
CN113579992A (zh) | 2014-10-17 | 2021-11-02 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
WO2017074773A1 (fr) | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | Appareil et procédé de formation d'article de polissage ayant un potentiel zêta souhaité |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10875146B2 (en) * | 2016-03-24 | 2020-12-29 | Rohm And Haas Electronic Materials Cmp Holdings | Debris-removal groove for CMP polishing pad |
USD816774S1 (en) * | 2016-03-25 | 2018-05-01 | Craig Franklin Edevold | Spiral pattern for cribbage board |
SG11201906131WA (en) * | 2017-01-20 | 2019-08-27 | Applied Materials Inc | A thin plastic polishing article for cmp applications |
USD855110S1 (en) * | 2017-01-31 | 2019-07-30 | Gary Peterson | Game board |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (fr) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Tampons à polir à distribution abrasive et leurs procédés de fabrication |
KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040072516A1 (en) * | 1997-05-15 | 2004-04-15 | Osterheld Thomas H. | Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus |
US6736709B1 (en) * | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
CN1647255A (zh) * | 2002-04-03 | 2005-07-27 | 东邦工程株式会社 | 抛光垫及使用该垫制造半导体衬底的方法 |
CN101024260A (zh) * | 2006-02-24 | 2007-08-29 | 三芳化学工业股份有限公司 | 具有表面纹路的抛光垫和其制造方法与制造装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60109601T2 (de) * | 2000-05-27 | 2006-02-09 | Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington | Rillen-polierkissen zum chemisch-mechanischen planarisieren |
JP3849594B2 (ja) * | 2002-06-28 | 2006-11-22 | Jsr株式会社 | 研磨パッド |
JP3849582B2 (ja) * | 2002-06-03 | 2006-11-22 | Jsr株式会社 | 研磨パッド及び複層型研磨パッド |
US20040014413A1 (en) * | 2002-06-03 | 2004-01-22 | Jsr Corporation | Polishing pad and multi-layer polishing pad |
JP2004071985A (ja) * | 2002-08-08 | 2004-03-04 | Jsr Corp | 半導体ウェハ用研磨パッドの加工方法及び半導体ウェハ用研磨パッド |
JP2004167605A (ja) * | 2002-11-15 | 2004-06-17 | Rodel Nitta Co | 研磨パッドおよび研磨装置 |
JP3872081B2 (ja) * | 2004-12-29 | 2007-01-24 | 東邦エンジニアリング株式会社 | 研磨用パッド |
US8192257B2 (en) * | 2006-04-06 | 2012-06-05 | Micron Technology, Inc. | Method of manufacture of constant groove depth pads |
-
2010
- 2010-07-15 WO PCT/US2010/042073 patent/WO2011008918A2/fr active Application Filing
- 2010-07-15 CN CN2010800414168A patent/CN102498549A/zh active Pending
- 2010-07-15 SG SG2012002234A patent/SG177625A1/en unknown
- 2010-07-15 KR KR1020127003925A patent/KR101478414B1/ko not_active IP Right Cessation
- 2010-07-15 SG SG10201404152UA patent/SG10201404152UA/en unknown
- 2010-07-15 JP JP2012520766A patent/JP2012533888A/ja active Pending
- 2010-07-16 TW TW099123549A patent/TWI519384B/zh not_active IP Right Cessation
- 2010-07-16 US US12/837,705 patent/US20110014858A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040072516A1 (en) * | 1997-05-15 | 2004-04-15 | Osterheld Thomas H. | Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus |
US6736709B1 (en) * | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
CN1647255A (zh) * | 2002-04-03 | 2005-07-27 | 东邦工程株式会社 | 抛光垫及使用该垫制造半导体衬底的方法 |
CN101024260A (zh) * | 2006-02-24 | 2007-08-29 | 三芳化学工业股份有限公司 | 具有表面纹路的抛光垫和其制造方法与制造装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104736297A (zh) * | 2012-12-26 | 2015-06-24 | 东洋橡胶工业株式会社 | 层叠抛光垫的制造方法 |
CN105793962A (zh) * | 2013-10-18 | 2016-07-20 | 嘉柏微电子材料股份公司 | 具有偏置的同心凹槽图案的边缘排除区域的化学机械抛光抛光垫 |
CN105793962B (zh) * | 2013-10-18 | 2019-03-29 | 嘉柏微电子材料股份公司 | 具有偏置的同心凹槽图案的边缘排除区域的化学机械抛光抛光垫 |
CN112720282A (zh) * | 2020-12-31 | 2021-04-30 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫 |
CN113829176A (zh) * | 2021-08-31 | 2021-12-24 | 北京航天控制仪器研究所 | 一种用于铍材镜体研磨抛光的研磨平板及研磨抛光方法 |
CN114274043A (zh) * | 2021-12-29 | 2022-04-05 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫 |
CN114274043B (zh) * | 2021-12-29 | 2023-02-24 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫 |
Also Published As
Publication number | Publication date |
---|---|
US20110014858A1 (en) | 2011-01-20 |
TW201121711A (en) | 2011-07-01 |
KR20120042985A (ko) | 2012-05-03 |
KR101478414B1 (ko) | 2014-12-31 |
TWI519384B (zh) | 2016-02-01 |
WO2011008918A3 (fr) | 2011-04-28 |
SG177625A1 (en) | 2012-02-28 |
WO2011008918A2 (fr) | 2011-01-20 |
JP2012533888A (ja) | 2012-12-27 |
SG10201404152UA (en) | 2014-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120613 |