SG10201404152UA - Grooved cmp polishing pad - Google Patents
Grooved cmp polishing padInfo
- Publication number
- SG10201404152UA SG10201404152UA SG10201404152UA SG10201404152UA SG10201404152UA SG 10201404152U A SG10201404152U A SG 10201404152UA SG 10201404152U A SG10201404152U A SG 10201404152UA SG 10201404152U A SG10201404152U A SG 10201404152UA SG 10201404152U A SG10201404152U A SG 10201404152UA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing pad
- cmp polishing
- grooved
- grooved cmp
- pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27106809P | 2009-07-16 | 2009-07-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201404152UA true SG10201404152UA (en) | 2014-09-26 |
Family
ID=43450188
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2012002234A SG177625A1 (en) | 2009-07-16 | 2010-07-15 | Grooved cmp polishing pad |
SG10201404152UA SG10201404152UA (en) | 2009-07-16 | 2010-07-15 | Grooved cmp polishing pad |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2012002234A SG177625A1 (en) | 2009-07-16 | 2010-07-15 | Grooved cmp polishing pad |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110014858A1 (en) |
JP (1) | JP2012533888A (en) |
KR (1) | KR101478414B1 (en) |
CN (1) | CN102498549A (en) |
SG (2) | SG177625A1 (en) |
TW (1) | TWI519384B (en) |
WO (1) | WO2011008918A2 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009018434B4 (en) * | 2009-04-22 | 2023-11-30 | Ev Group Gmbh | Receiving device for holding semiconductor substrates |
DE102011082777A1 (en) * | 2011-09-15 | 2012-02-09 | Siltronic Ag | Method for double-sided polishing of semiconductor wafer e.g. silicon wafer, involves forming channel-shaped recesses in surface of polishing cloth of semiconductor wafer |
JP2014124718A (en) * | 2012-12-26 | 2014-07-07 | Toyo Tire & Rubber Co Ltd | Method of manufacturing laminated abrasive pad |
TWI599447B (en) * | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | Cmp polishing pad having edge exclusion region of offset concentric groove pattern |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
SG11201703114QA (en) | 2014-10-17 | 2017-06-29 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10875146B2 (en) * | 2016-03-24 | 2020-12-29 | Rohm And Haas Electronic Materials Cmp Holdings | Debris-removal groove for CMP polishing pad |
USD816774S1 (en) * | 2016-03-25 | 2018-05-01 | Craig Franklin Edevold | Spiral pattern for cribbage board |
WO2018136694A1 (en) * | 2017-01-20 | 2018-07-26 | Applied Materials, Inc. | A thin plastic polishing article for cmp applications |
USD855110S1 (en) * | 2017-01-31 | 2019-07-30 | Gary Peterson | Game board |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Abrasive delivery polishing pads and manufacturing methods thereof |
WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
CN112720282B (en) * | 2020-12-31 | 2022-04-08 | 湖北鼎汇微电子材料有限公司 | Polishing pad |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
CN113829176B (en) * | 2021-08-31 | 2023-04-14 | 北京航天控制仪器研究所 | Grinding flat plate for grinding and polishing beryllium mirror body and grinding and polishing method |
CN114274043B (en) * | 2021-12-29 | 2023-02-24 | 湖北鼎汇微电子材料有限公司 | Polishing pad |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
WO2001091971A1 (en) * | 2000-05-27 | 2001-12-06 | Rodel Holdings, Inc. | Polishing pads for chemical mechanical planarization |
US6736709B1 (en) * | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
CN100356515C (en) * | 2002-04-03 | 2007-12-19 | 东邦工程株式会社 | Polishing pad and semiconductor substrate manufacturing method using the polishing pad |
JP3849582B2 (en) * | 2002-06-03 | 2006-11-22 | Jsr株式会社 | Polishing pad and multilayer polishing pad |
US20040014413A1 (en) * | 2002-06-03 | 2004-01-22 | Jsr Corporation | Polishing pad and multi-layer polishing pad |
JP3849594B2 (en) * | 2002-06-28 | 2006-11-22 | Jsr株式会社 | Polishing pad |
JP2004071985A (en) * | 2002-08-08 | 2004-03-04 | Jsr Corp | Working method for grinding pad for semiconductor wafer and grinding pad for semiconductor wafer |
JP2004167605A (en) * | 2002-11-15 | 2004-06-17 | Rodel Nitta Co | Polishing pad and polishing device |
JP3872081B2 (en) * | 2004-12-29 | 2007-01-24 | 東邦エンジニアリング株式会社 | Polishing pad |
CN101024260A (en) * | 2006-02-24 | 2007-08-29 | 三芳化学工业股份有限公司 | Polishign cushion with surface grains and its making method and apparatus |
US8192257B2 (en) * | 2006-04-06 | 2012-06-05 | Micron Technology, Inc. | Method of manufacture of constant groove depth pads |
-
2010
- 2010-07-15 WO PCT/US2010/042073 patent/WO2011008918A2/en active Application Filing
- 2010-07-15 JP JP2012520766A patent/JP2012533888A/en active Pending
- 2010-07-15 SG SG2012002234A patent/SG177625A1/en unknown
- 2010-07-15 CN CN2010800414168A patent/CN102498549A/en active Pending
- 2010-07-15 KR KR1020127003925A patent/KR101478414B1/en not_active IP Right Cessation
- 2010-07-15 SG SG10201404152UA patent/SG10201404152UA/en unknown
- 2010-07-16 TW TW099123549A patent/TWI519384B/en not_active IP Right Cessation
- 2010-07-16 US US12/837,705 patent/US20110014858A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2011008918A3 (en) | 2011-04-28 |
CN102498549A (en) | 2012-06-13 |
JP2012533888A (en) | 2012-12-27 |
TW201121711A (en) | 2011-07-01 |
US20110014858A1 (en) | 2011-01-20 |
WO2011008918A2 (en) | 2011-01-20 |
KR101478414B1 (en) | 2014-12-31 |
SG177625A1 (en) | 2012-02-28 |
KR20120042985A (en) | 2012-05-03 |
TWI519384B (en) | 2016-02-01 |
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