CN102469690A - 用于制造印刷电路板的装置和用其制造印刷电路板的方法 - Google Patents

用于制造印刷电路板的装置和用其制造印刷电路板的方法 Download PDF

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Publication number
CN102469690A
CN102469690A CN2010106244247A CN201010624424A CN102469690A CN 102469690 A CN102469690 A CN 102469690A CN 2010106244247 A CN2010106244247 A CN 2010106244247A CN 201010624424 A CN201010624424 A CN 201010624424A CN 102469690 A CN102469690 A CN 102469690A
Authority
CN
China
Prior art keywords
circuit board
printed circuit
heat transfer
transfer element
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010106244247A
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English (en)
Chinese (zh)
Inventor
金智恩
曹硕铉
洪种国
孙暻镇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN102469690A publication Critical patent/CN102469690A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
CN2010106244247A 2010-11-05 2010-12-30 用于制造印刷电路板的装置和用其制造印刷电路板的方法 Pending CN102469690A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100109752A KR101167442B1 (ko) 2010-11-05 2010-11-05 인쇄회로기판 제조장치 및 이를 이용한 인쇄회로기판의 제조방법
KR10-2010-0109752 2010-11-05

Publications (1)

Publication Number Publication Date
CN102469690A true CN102469690A (zh) 2012-05-23

Family

ID=46072651

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010106244247A Pending CN102469690A (zh) 2010-11-05 2010-12-30 用于制造印刷电路板的装置和用其制造印刷电路板的方法

Country Status (2)

Country Link
KR (1) KR101167442B1 (ko)
CN (1) CN102469690A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113507789B (zh) * 2021-08-18 2022-04-08 广东合通建业科技股份有限公司 一种软硬结合线路板制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116264A (ja) * 1995-10-16 1997-05-02 Ibiden Co Ltd プリント配線板における導体回路形成用金属材料の貼り付け方法
JPH11320593A (ja) * 1998-05-11 1999-11-24 Shin Kobe Electric Mach Co Ltd 積層板の製造法およびその製造に用いる成形用プレート
CN1392038A (zh) * 2001-06-19 2003-01-22 市川毛织株式会社 压模机用耐热缓冲部件
JP2005053076A (ja) * 2003-08-04 2005-03-03 Denso Corp 多層基板の製造方法及び熱プレス機
CN101071047A (zh) * 2006-04-20 2007-11-14 株式会社聚源 热交换器制造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007015388A (ja) 2001-06-19 2007-01-25 Ichikawa Co Ltd 成形プレス用耐熱クッション材

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116264A (ja) * 1995-10-16 1997-05-02 Ibiden Co Ltd プリント配線板における導体回路形成用金属材料の貼り付け方法
JPH11320593A (ja) * 1998-05-11 1999-11-24 Shin Kobe Electric Mach Co Ltd 積層板の製造法およびその製造に用いる成形用プレート
CN1392038A (zh) * 2001-06-19 2003-01-22 市川毛织株式会社 压模机用耐热缓冲部件
JP2005053076A (ja) * 2003-08-04 2005-03-03 Denso Corp 多層基板の製造方法及び熱プレス機
CN101071047A (zh) * 2006-04-20 2007-11-14 株式会社聚源 热交换器制造方法

Also Published As

Publication number Publication date
KR101167442B1 (ko) 2012-07-19
KR20120048228A (ko) 2012-05-15

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120523