CN102447168A - 粘接膜、以及电路部件的连接结构和连接方法 - Google Patents

粘接膜、以及电路部件的连接结构和连接方法 Download PDF

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Publication number
CN102447168A
CN102447168A CN2011102636200A CN201110263620A CN102447168A CN 102447168 A CN102447168 A CN 102447168A CN 2011102636200 A CN2011102636200 A CN 2011102636200A CN 201110263620 A CN201110263620 A CN 201110263620A CN 102447168 A CN102447168 A CN 102447168A
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Prior art keywords
adhesive linkage
bonding film
insulating properties
bisphenol
resin
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CN2011102636200A
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Chinese (zh)
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富坂克彦
竹田津润
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Showa Denko Materials Co ltd
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Hitachi Chemical Co Ltd
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Publication of CN102447168A publication Critical patent/CN102447168A/zh
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    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115044311A (zh) * 2022-08-17 2022-09-13 江苏凯伦建材股份有限公司 一种耐高温热熔胶膜及其制备方法和覆膜板

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
JP5146438B2 (ja) * 2008-10-22 2013-02-20 日立化成工業株式会社 回路接続用接着剤フィルム
CN103525351A (zh) * 2013-11-05 2014-01-22 武汉爱劳高科技有限责任公司 用于接地极焦炭粘接的室温固化型导电胶粘剂
JP5676046B1 (ja) * 2014-09-16 2015-02-25 オリジン電気株式会社 部材貼り合わせ装置及び方法
JP2023076211A (ja) * 2021-11-22 2023-06-01 福田金属箔粉工業株式会社 導電性接着剤

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
JP3656768B2 (ja) * 1995-02-07 2005-06-08 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP4339414B2 (ja) * 1995-05-16 2009-10-07 日立化成工業株式会社 回路用接続部材
JP3603426B2 (ja) * 1995-11-21 2004-12-22 日立化成工業株式会社 回路用接続部材
JP3651624B2 (ja) * 1995-11-21 2005-05-25 日立化成工業株式会社 回路用接続部材
JP3342703B2 (ja) * 1996-07-15 2002-11-11 日立化成工業株式会社 回路接続用フィルム状接着剤及び回路板
TW383435B (en) * 1996-11-01 2000-03-01 Hitachi Chemical Co Ltd Electronic device
TW560535U (en) * 1997-02-27 2003-11-01 Seiko Epson Corp Adhesive, liquid crystal device and electronic apparatus
JP3678547B2 (ja) * 1997-07-24 2005-08-03 ソニーケミカル株式会社 多層異方導電性接着剤およびその製造方法
JP2002201450A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
CN100513507C (zh) * 2001-11-16 2009-07-15 日立化成工业株式会社 电路连接用粘结剂
JP4411876B2 (ja) * 2003-06-23 2010-02-10 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム
EP2182585B1 (en) * 2003-06-25 2011-08-10 Hitachi Chemical Company, Ltd. Circuit member connecting structure
US20100025089A1 (en) * 2004-01-07 2010-02-04 Jun Taketatsu Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
JP2005194413A (ja) * 2004-01-08 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
KR100671138B1 (ko) * 2005-03-07 2007-01-17 제일모직주식회사 다층구조 이방 전도성 필름 및 이를 이용한 디스플레이 소자
JP2007217503A (ja) * 2006-02-15 2007-08-30 Asahi Kasei Electronics Co Ltd 異方導電性接着フィルム

Cited By (1)

* Cited by examiner, † Cited by third party
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CN115044311A (zh) * 2022-08-17 2022-09-13 江苏凯伦建材股份有限公司 一种耐高温热熔胶膜及其制备方法和覆膜板

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