CN101536260A - 粘接膜、以及电路部件的连接结构和连接方法 - Google Patents

粘接膜、以及电路部件的连接结构和连接方法 Download PDF

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CN101536260A
CN101536260A CNA2007800415987A CN200780041598A CN101536260A CN 101536260 A CN101536260 A CN 101536260A CN A2007800415987 A CNA2007800415987 A CN A2007800415987A CN 200780041598 A CN200780041598 A CN 200780041598A CN 101536260 A CN101536260 A CN 101536260A
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adhesive linkage
bonding film
splicing ear
insulating properties
circuit block
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CN101536260B (zh
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富坂克彦
竹田津润
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Lishennoco Co ltd
Resonac Corp
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Hitachi Chemical Co Ltd
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Abstract

本发明提供一种粘接膜，该粘接膜层叠有含有导电粒子的导电性粘接层和绝缘性粘接层，在层叠方向上以规定的条件进行加热加压后的、固化了的绝缘性粘接层的主面的面积C，除以固化了的导电性粘接层的主面的面积D的值即C/D为1.2～3.0。

Description

粘接膜、以及电路部件的连接结构和连接方法
技术领域
本发明涉及粘接膜、以及电路部件的连接结构和连接方法。
背景技术
一直以来，液晶显示用玻璃面板通过COG(Chip-On-Glass：玻璃上芯片技术)安装和COF(Chip-On-Flex：柔性基板上的芯片技术)安装等来安装液晶驱动用IC。COG安装是采用含有导电粒子的粘接膜，将液晶驱动用IC直接接合到玻璃面板上。COF安装是将液晶驱动用IC接合到具有金属布线的柔性胶带上，然后采用含有导电粒子的粘接膜将其接合到玻璃面板上。
与此相对，随着近年来液晶显示的高精密化，作为液晶驱动用IC的电极的金凸点日益窄节距化、窄面积化。因而，以往的粘接膜中，存在电路连接部件中的导电粒子流出到相邻电极(连接端子)间而发生短路等的问题。另外，为了避免短路而减少粘接胶带中的导电粒子的数量的情况下，存在以下问题：在凸点/面板之间捕捉的粘接膜中的导电粒子的数量减少，其结果，电路间的接触电阻上升而引起连接不良。
因此，作为解决这些问题的方法，开发了通过在粘接膜的至少一面形成绝缘性粘接层从而防止COG安装或COF安装中的接合质量下降的方法(例如，参见专利文献1)，和通过控制粘接膜的加热加压时的流动性来确保在凸点/面板之间捕捉的导电粒子的数量的方法(例如，参见专利文献2)。
专利文献1：日本特开平8-279371号公报
专利文献2：日本特开2002-201450号公报
发明内容
发明要解决的问题
然而，在粘接膜的一面形成绝缘性粘接层的方法中，凸点面积小，例如小于3000μm2时，为了得到稳定的接触电阻而增加导电粒子的数量的情况下，关于相邻的电路电极间仍有改良的余地。另外，控制粘接膜加热加压时的流动性的方法中，向液晶显示用玻璃面板安装液晶驱动用IC时，防止由加热加压后的粘接膜的固化物的储能模量变高而产生的面板翘曲这一点，仍留有改良余地。
因此，本发明鉴于上述情况而发明，其目的在于提供一种对于COG安装和COF安装可以得到低电阻的电连接、并且可以充分防止向液晶显示用玻璃面板安装液晶驱动用IC后的面板翘曲的粘接膜，以及采用该粘接膜的电路部件的连接方法和连接结构。
解决问题的手段
本发明提供一种粘接膜，其层叠有含有导电粒子的导电性粘接层与绝缘性粘接层，在层叠方向上以规定的条件进行加热加压后的、固化了的绝缘性粘接层的主面的面积C，除以固化了的导电性粘接层的主面的面积D的值即C/D为1.2～3.0。
根据本发明的粘接膜，对于COG安装和COF安装可以得到低电阻的电连接，并且可以充分防止向液晶显示用玻璃面板安装液晶驱动用IC后的面板翘曲以及相邻电极间的短路的发生。
根据本发明的粘接膜，能够实现上述目的理由不一定明确，然而，认为上述C/D的值为上述范围至少是起因。还有，C/D的值是表示绝缘性粘接层的流动性和导电性粘接层的流动性的差异的指标。
通过C/D的值在上述数值范围内，使得与该值为小于1.2的情况相比，相对于导电性粘接层的流动性的绝缘性粘接层的流动性变高。
就本发明的粘接膜而言，在加热加压时，与导电性粘接膜相比绝缘性粘接膜优先流动。因而认为，电路连接时，电路基板上的电路电极彼此间的空隙中绝缘性粘接层容易填充，能够容易防止导电性粘接剂层中导电粒子流入该空隙中，能够充分防止相邻电极间的短路的发生。
再者认为，如果防止导电性粘接剂层中的导电粒子流入上述空隙中，要连接的电路电极间所捕捉的导电粒子的数量增多，能够容易得到低电阻的电连接。
另外，通过C/D的值在上述数值范围内，使得与该值为大于3.0的情况相比，相对于导电性粘接层的流动性的绝缘性粘接层的流动性不过高。由此认为，电路电极彼此的优良导通特性和粘接性可以兼顾，可以保持粘接膜的较高可靠性。
还有，上述的规定条件为，在用2片玻璃板夹持本发明的粘接膜的状态下，以160℃、2MPa的条件加热加压10秒钟。
绝缘性粘接层优选为含有双酚F型苯氧树脂，导电性粘接层优选含有选自由双酚A型苯氧树脂和双酚A·F共聚型苯氧树脂组成的组中的至少1种树脂。由此，更高度地控制绝缘性粘接层的流动性和导电性粘接层的流动性。
本发明的粘接膜是用于将相对峙的连接端子之间电连接的上述的粘接膜，40℃、频率10Hz时的前述粘接膜的固化物的储能模量E’优选为0.5～2.5GPa。
由此，将连接端子连接后的粘接膜的固化物中的成分的凝聚力提高，并且内部应力减小。因此，取得安装品的显示质量、粘接力和导通特性提高的有利效果。储能模量为小于0.5GPa的情况下，与在上述范围的情况相比较，存在如下倾向，粘接膜的固化物的成分的凝聚力低，连接电路部件时的连接部分的电阻上升。另外，储能模量超过2.5GPa的情况下，与在上述范围的情况相比较，存在如下倾向，粘接膜的固化物的硬度上升，安装品的面板翘曲防止效果低下。
绝缘性粘接层和/或导电性粘接层优选含有膜形成材、环氧树脂和潜在性固化剂。由此，本发明的上述效果可以更确实地奏效。
本发明另外提供一种粘接膜，其层叠有含有导电粒子的导电性粘接层和绝缘性粘接层，绝缘性粘接层含有双酚F型苯氧树脂。根据这样的粘接膜，对于COG安装和COF安装可以得到低电阻的电连接，并且可以充分防止向液晶显示用玻璃面板安装液晶驱动用IC后的面板翘曲以及相邻电极间的短路的发生。
另外，本发明提供一种连接结构，其为将具有第1连接端子的第1电路部件和具有第2连接端子的第2电路部件，以第1连接端子和第2连接端子相对的方式配置，使粘接膜介于相向配置的第1连接端子与第2连接端子之间，并进行加热加压，使第1连接端子与第2连接端子电连接而构成的电路部件的连接结构，粘接膜具有含有导电粒子的导电性粘接层和绝缘性粘接层，进行加热加压后的、固化了的绝缘性粘接层的主面的面积C除以固化了的导电性粘接层的主面的面积D的值即C/D为1.2～3.0。根据这样的电路部件的连接结构，由于采用本发明的粘接膜，连接可靠性足够高。
在上述连接结构中，第1和第2电路部件中的至少一方可以是IC芯片。
上述连接结构中，第1和第2连接端子中的至少一方的表面，可以包含选自由金、银、锡、铂族的金属和锢-锡氧化物(ITO)组成的组中的至少1种。
在上述连接结构中，可以用选自由氮化硅、有机硅化合物和聚酰亚胺树脂组成的群的至少1种，对第1和第2电路部件中的至少一方的表面进行涂覆或附着处理。
另外，本发明提供一种连接方法，其为将具有第1连接端子的第1电路部件和具有第2连接端子的第2电路部件，以第1连接端子和第2连接端子相对的方式配置，使粘接膜介于相向配置的第1连接端子与第2连接端子之间，并进行加热加压，使第1连接端子与第2连接端子电连接的电路部件的连接方法，粘接膜具有含有导电粒子的导电性粘接层和绝缘性粘接层，进行加热加压后的、固化了的前述绝缘性粘接层的主面的面积C，除以固化了的钱导电性粘接层的主面的面积D的值C/D为1.2～3.0。根据这样的连接方法，由于采用本发明的粘接膜，可以得到可靠性很高的连接结构。
发明效果
本发明可以提供一种对于COG安装和COF安装可以得到低电阻的电连接、并且可以充分防止向液晶显示用玻璃面板安装液晶驱动用IC后的面板翘曲和相邻电极间的短路的发生的粘接膜、以及采用该粘接膜的电路部件的连接方法和连接结构。
附图说明
图1是表示本发明的电路部件的连接结构的一实施方式的概略截面图。
图2是表示用扫描仪将加热加压后的固化的粘接膜进行摄像的图像的图。
符号说明
10：第1电路部件；11：第1电路基板；12：第1电极；20：第2电路部件；21：第2电路基板；22：第2电极；30：电路连接部件；100：连接结构。
具体实施方式
以下，对本发明的合适的实施例进行说明，但本发明不限于以下实施方式。另外，图面中，相同要素附有相同符号，省略重复说明。还有，上下左右等位置关系，不特别说明的话均根据图中所示位置关系。进一步，图面的尺寸比例不限于图示的比例。
(粘接膜)
本发明提供一种粘接膜，其层叠有含有导电粒子的导电性粘接层和绝缘性粘接层，在层叠方向上以规定的条件进行加热加压后的、固化了的绝缘性粘接层的主面的面积C，除以固化了的导电性粘接层的主面的面积D的值C/D为1.2～3.0。
根据本发明的粘接膜，对于COG安装和COF安装可以得到低电阻的电连接，并且可以充分防止向液晶显示用玻璃面板安装液晶驱动用IC后的面板翘曲、和相邻电极间的短路的发生。进一步地可以防止如下不良情况：电路连接时，由于导电性粘接层不流动，不能排除留在电极间的树脂而产生的导通不良；或者，由于绝缘性粘接层过度流动，连接的电路间的树脂填充不足而导致的粘接强度低下等。从同样的观点出发，C/D的值更优选为1.5～2.5。
绝缘性粘接层和导电性粘接层在上述规定条件下加热加压之前的主面的面积实质上相同。设该主面的面积为A。还有，在上述规定条件下加热加压后的绝缘性粘接层和导电性粘接层的主面的面积如上所述分别为C、D。作为绝缘性粘接层和导电性粘接层的伴随着上述加热加压的流动性的指标，定义C/A、D/A。这些流动性的指标其数值越高，表示伴随着上述加热加压越容易流动。本发明的上述值C/D与绝缘性粘接层的流动性的指标C/A除以绝缘性粘接层的流动性的指标D/A的值是相同的。
作为导电粒子，可以举出例如金(Au)、银(Ag)、镍(Ni)、铜(Cu)、焊锡等金属粒子；碳粒子；在玻璃、陶瓷、塑料等非导电性物质的表面被覆Au、Ag、Cu等导电性物质的粒子；以及，在Ni等过渡金属的表面被覆Au等贵金属类的粒子。从得到足够的可用时间的角度考虑，优选导电粒子的表层为Au、Ag、铂等贵金属类，更优选为Au。另外，作为导电粒子，使用在非导电性物质被覆贵金属类的粒子或使用热熔融金属粒子的情况下，因加热加压而具有变形性，连接时与电极的接触面积增加且可靠性提高，因此优选。
为了得到良好的电阻，在非导电性物质的表面被覆贵金属类的粒子的被覆层的厚度，优选为100埃以上。另外，在Ni等过渡金属的表面被覆贵金属类的粒子的情形中，由于由贵金属类构成的被覆层的欠缺或导电粒子在混合分散时产生的被覆层的欠缺等而生成氧化还原作用，因该氧化还原作用可能产生游离自由基而引起保存性降低。因此，优选被覆层的厚度为300埃以上。被覆层的厚度为1μm以上时，上述的效果达到饱和，因此，期望被覆层的厚度小于1μm，但这并不限制被覆层的厚度。上述导电粒子可以单独使用1种或者组合2种以上来使用。
这样的导电粒子，相对于粘接膜中的树脂成分100体积份，优选含有0.1～30体积份，更优选含有0.1～10体积份。由此，可以更高度地防止因过剩的导电粒子所引起的邻接电路的短路。所谓的上述“树脂成分”，是指粘接膜中导电粒子以外的成分，具体是指后述的膜形成材料、环氧树脂、潜在性固化剂等。
绝缘性粘接层和导电性粘接层，优选含有膜形成材料、环氧树脂和潜在性固化剂。由此，可以更确实地起到本发明的上述效果。
所谓的膜形成材料是，将液状物固形化，将构成组合物制成膜状的情形中，该膜的处理性容易，并且赋予不容易开裂、破裂或发粘的机械特性等的材料，可在通常的状态下作为膜进行处理的材料。作为其具体例子，可以举出苯氧树脂、聚乙烯醇缩甲醛树脂、聚苯乙烯树脂、聚乙烯醇缩丁醛树脂、聚酯树脂、聚酰胺树脂、二甲苯树脂以及聚氨酯树脂。这些可以单独使用1种或者组合2种以上来使用。其中，苯氧树脂因其粘接性、相溶性、耐热性和机械强度优异而特别优选。
苯氧树脂可通过如下方法获得：例如，使二官能性酚类和表卤醇反应至高分子量，或者使二官能性环氧树脂和二官能性酚类进行加成聚合而得到。具体来讲，苯氧树脂可以按如下方法获得：使二官能性酚类1摩尔和表卤醇0.985～1.015，在碱金属氢氧化物的存在下在非反应性溶剂中，于40～120℃的温度下反应来获得。
作为这样的苯氧树脂，从提高机械特性和热特性的角度考虑，特别优选这样得到苯氧树脂：将二官能性环氧树脂和二官能性酚类的配合当量比以环氧基/酚羟基计设为1/0.9～1/1.1，在碱金属化合物、有机磷系化合物、环状胺系化合物等催化剂的存在下，在沸点为120℃以上的酰胺系、醚系、酮系、内酯系、醇系等有机溶剂中，在反应固体成分为50质量％以下的状态下加热至50～200℃进行加成聚合。
作为二官能性环氧树脂，可以举出例如双酚A型环氧树脂、双酚F型环氧树脂、双酚AD型环氧树脂、双酚S型环氧树脂。二官能酚类具有2个酚羟基，可以举出例如双酚A、双酚F、双酚AD、双酚S等双酚类。苯氧树脂可以通过自由基聚合性的官能团来改性。
上述的苯氧树脂，可以单独使用1种，也可以混合2种以上来使用。另外，可以使绝缘性粘接层和导电性粘接层含有互不相同种类的苯氧树脂。例如，优选使绝缘性粘接层含有双酚F型苯氧树脂，使导电性粘接层含有从由双酚F型苯氧树脂和双酚A·F共聚型苯氧树脂构成的组中选择的至少1种树脂。由此，绝缘性粘接层的耐热性和流动性提高，导电性粘接层的弹性模量和流动性降低。因而，可以抑制导电性粘接层相对于绝缘性粘接层的流动性。
作为环氧树脂，可以使用例如由表氯醇和双酚A、双酚F或双酚AD衍生的双酚型环氧树脂；由表氯醇和苯酚酚醛清漆或甲酚酚醛清漆衍生的环氧酚醛清漆树脂；具有含有萘环的骨架的萘系环氧树脂；缩水甘油胺、缩水甘油醚、联苯和脂环式等1分子内具有2个以上的缩水甘油基的各种环氧化合物。这些环氧树脂可以单独或者混合2种以上来使用。为了防止电子迁移，优选这些环氧树脂使用将杂质离子(Na+、Cl-等)或水解性氯等降低至300ppm以下的高纯度品。
作为在本发明中使用的潜在性固化剂，可以举出例如咪唑系固化剂、酰肼系固化剂、三氟化硼-胺络合物、锍盐、胺酰亚胺、聚胺的盐、双氰胺。这些潜在性固化剂可以单独使用1种，或者组合2种以上来使用，可以混合分解促进剂、抑制剂等来使用。另外，将这些固化剂用聚酯系高分子物质等来被覆而形成微胶囊化的物质，由于可使时间延长而优选。
本发明的粘接膜，可以在绝缘性粘接层和/或导电性粘接层中，含有以丙烯酸、丙烯酸酯、甲基丙烯酸酯或丙烯腈中的至少一种作为单体成分的聚合物或共聚物。在将含有缩水甘油醚基的缩水甘油基丙烯酸酯或含有缩水甘油基甲基丙烯酸酯的共聚体系丙烯酸橡胶进行并用的情形中，由于应力缓和优异而优选。这样的丙烯酸橡胶的分子量(由尺寸排除色谱所得到的聚苯乙烯换算重均分子量)，从提高粘接膜的凝聚力的角度考虑，优选为20万以上。
粘接膜可以在绝缘性粘接层和/或导电性粘接层中进一步含有填充剂、软化剂、促进剂、抗老化剂、阻燃剂、色素、触变剂、偶联剂、三聚氰胺树脂和异氰酸酯类。
含有填充剂的情形中，由于连接可靠性等得到提高因而优选。填充剂只要其最大直径小于导电粒子的粒径就可使用。填充剂的含有比例，相对于粘接膜中的树脂成分100体积份，优选为5～60体积份的范围。该含有比例超过60体积份时，可靠性提高的效果容易饱和，小于5体积时，添加填充剂所得到的效果小。
作为偶联剂，从提高粘接性的角度考虑，优选为含有酮亚胺、乙烯基、丙烯基、氨基、环氧基以及异氰酸酯基的物质。其具体例子为，作为具有氨基的硅烷偶联剂，可以举出N-β(氨基乙基)γ-氨基丙基三甲氧基硅烷、N-β(氨基乙基)γ-氨基丙基甲基二甲氧基硅烷、γ-氨基丙基三乙氧基硅烷、N-苯基-γ-氨基丙基三甲氧基硅烷。另外，作为具有酮亚胺的硅烷偶联剂，可以举出使上述具有氨基的硅烷偶联剂，与丙酮、甲基乙基酮、甲基异丁基酮等酮化合物进行反应而得到的偶联剂。
上述粘接膜的固化物在40℃、频率10Hz时的储能模量E’优选为0.5～2.5GPa，更优选为1.0～2.0GPa。
据此，与储能模量在上述范围之外的情况相比较，将连接端子连接后的粘接膜的固化物中的成分的凝聚力提高，并且内部应力减小。因此，取得使用该粘接膜的安装品的显示质量、粘接力和导通特性提高等有利效果。储能模量为小于0.5GPa的情况下，与在上述范围的情况相比较，存在如下倾向，粘接膜的固化物中的成分的凝聚力较低，连接电路部件时的连接部分的电阻上升。另外，储能模量超过2.5GPa的情况下，与在上述范围的情况相比较，存在如下倾向，粘接膜的固化物的硬度上升，安装品的面板翘曲防止效果低下。
本发明的粘接膜，可以是由绝缘性粘接层和导电性粘接层而构成的2层而构成，也可以是由3层以上的层而构成。由3层以上的层而构成的情况下，优选为绝缘性粘接层和导电性粘接层交替层叠。例如，作为由3层构成的粘接膜可以举出，导电性粘接层、绝缘性粘接层和导电性粘接层按照该顺序层叠的膜，或者绝缘性粘接层、导电性粘接层和绝缘性粘接层按照该顺序层叠的膜。在这些情况下，导电性粘接层彼此之间或者绝缘性粘接层彼此之间，材料、构成和/或膜厚可以不同，也可以相同。
在由3层以上的层构成的粘接膜中，在层叠方向上以规定的条件加热加压后，相接触的导电性粘接层和绝缘性粘接层中至少1组的C/D的值是1.2～3.0。进一步，在由3层以上的层构成的粘接膜中，在层叠方向上以规定的条件加热加压之后，相接触的导电性粘接层和绝缘性粘接层各自的C/D的值优选均为1.2～3.0。
满足上述C/D的数值范围的本发明的粘接膜，可以通过组合例如下述(1)、(2)中的任意1层的绝缘性粘接层和下述(3)～(5)中的任意1层的导电性粘接层而得到。
(1)含有双酚F型苯氧树脂的绝缘性粘接层。
(2)含有重均分子量为1000～10000的双酚A型固形环氧树脂、重均分子量为1000～10000的A·F型固形环氧树脂和重均分子量为1000～10000的F型固形环氧树脂中的至少任意一个的绝缘性粘接层。
(3)含有双酚A型苯氧树脂或双酚A·F共聚型苯氧树脂的导电性粘接层。
(4)含有分子内具有芴环的苯氧树脂的导电性粘接层。
(5)对于树脂成分100体积部，含有5～30体积份粒径0.1～1.0μm的非导电性微粒子的导电性粘接层。
上述粘接膜可用于，例如COG安装或COF安装中，将IC芯片和柔性胶带或玻璃基板进行电连接。
(电路部件的连接结构)
本发明提供一种电路部件的连接结构，其为将具有第1连接端子的第1电路部件和具有第2连接端子的第2电路部件，以第1连接端子和第2连接端子相对的方式配置，使上述粘接膜介于相向配置的第1连接端子与第2连接端子之间，并加热加压，使第1连接端子与第2连接端子电连接而构成的电路部件的连接结构。
图1是表示本发明的电路部件的连接结构的一适宜的实施方式的概略截面图。图1中所示的连接结构100具备相互对向的第1电路部件10和第2电路部件20，在第1电路部件10和第2电路部件20之间设有对其进行连接的电路连接部件30。
作为第1和第2电路部件10、20的具体例，可以举出半导体芯片、电阻芯片或者电容器芯片等芯片零件或印刷基板等基板。作为连接结构100的连接方式有IC芯片与搭载芯片的基板的连接、电路相互的连接、COG安装或COF安装中的IC芯片与玻璃基板或柔性胶带的连接等。
尤其优选电路部件10、20中至少一方为IC芯片。
另外，电路部件10、20中至少一方的表面优选用选自氧化硅、有机硅化合物以及聚酰亚胺树脂组成的组中的至少1种，进行涂覆或附着处理。根据上述粘接膜，对于这样的电路部件的粘接强度特别良好。
第1电路部件10具有第1电路基板11和在第1电路基板11的主面11a上形成的第1电极(连接端子)12。第2电路部件20具有第2电路基板21和在第2电路基板21的主面21a上形成的第2电极(连接端子)22。在连接结构100中，第1电极12和第2电极22相向配置，并且电连接。还有，第1电路基板11的主面11a上，以及第2电路基板21的主面21a上，根据情况可以形成绝缘层(未图示)。
第1和第2电极11、12中至少一方的表面，优选包含选自由金、银、锡、铂族的金属以及铟-锡氧化物(ITO)组成的组中的至少1种。
电路连接部件30是上述粘接膜的固化物。通过粘接膜的固化物中的导电粒子(未图示)，第1电极12和第2电极22电连接。
本实施方式的连接结构100的制造方法，即电路部件10、20的连接方法例如如下所述。首先，上述粘接膜介于第1与第2电路部件10、20之间。这时，配置第1和第2电路部件10、20，以使第1电极12和第2电极22相互对向。还有，粘接膜可以以其绝缘性粘接层一侧与第1电极12相接触的方式介于其间，也可以以与第2电极22相接触的方式介于其间。其次，隔着第1和第2电路部件10、20加热粘接膜，同时在其层叠方向上加压，施行粘接膜的固化处理而形成连接结构100。固化处理可以通过一般方法进行，其方法根据粘接膜进行适当选择。
以上就本发明的适宜实施方式进行了说明，然而，本发明不限于上述实施方式。本发明在不超出其主旨的范围内可以进行各种变形。
实施例
以下，通过实施例详细说明本发明，然而，本发明并不限于此。另外，在如下实施例中，双酚F型苯氧树脂使用了东都化成株式会社制造的商品名“FX-316”的树脂，双酚A型苯氧树脂使用了インケムコ—ポレ—ション社制造的商品名“PKHC”的树脂，双酚A·F共聚型树脂使用了东都化成株式会社制造的商品名“ZX-1356-2”的树脂，芳香族锍盐使用了三新化学工业株式会社公司制造的商品名“サンエイドSI-60”。另外，作为液状环氧树脂，使用含有微胶囊型潜在性固化剂的液状环氧树脂(旭化成化学公司制造的商品名“ノバキユアHX-3941”，环氧当量185)。
(实施例1)
使双酚F型苯氧树脂100g溶解于质量比50:50的甲苯(沸点110.6℃，SP值8.90)和醋酸乙酯(沸点77.1℃，SP值9.10)的混合溶剂中，得到固体成分60质量％的溶液。在该溶液中配合液状环氧树脂，进一步添加作为潜在性固化剂的芳香族锍盐2.4g来得到混合液。上述液状环氧树脂的配合量是以双酚F型苯氧树脂:液状环氧树脂的固体质量比为60:40来配合的。使用涂布装置将得到的混合液涂布于厚度50μm的单面用有机硅进行了表面处理的PET膜，然后，通过70℃、5分钟的热风干燥来形成厚度10μm的绝缘性粘接层。
另外，使双酚A型苯氧树脂50g溶解于质量比50:50的甲苯和醋酸乙酯的混合溶剂中，得到固体成分40质量％的第1溶液。另一方面，使双酚A·F共聚型苯氧树脂50g溶解于质量比50:50的甲苯和醋酸乙酯的混合溶剂中，得到固体成分45质量％的第2溶液。
混合上述第1和第2溶液，在该混合液中进一步配合液状环氧树脂。它们的配合量以固体质量比计为，双酚A型苯氧树脂:双酚A·F共聚型苯氧树脂:液状环氧树脂为30:30:40。在得到的配合液中进一步配合分散导电粒子，其相对于树脂成分为10体积％，进一步添加作为潜在性固化剂的芳香族锍盐2.4g来得到混合液。使用涂布装置将得到的混合液涂布于厚度50μm的单面用有机硅进行了表面处理的PET膜，然后，通过70℃、5分钟的热风干燥来形成厚度10μm的导电性粘接层。使用层压机来贴合形成好的绝缘性粘接层和导电性粘接层，得到用PET膜夹持的粘接膜。
(实施例2)
绝缘性粘接层的形成以下述方式代替，除此之外，与实施例1同样地操作，得到带PET膜的粘接膜。使双酚F型苯氧树脂100g溶解于质量比50:50的甲苯和醋酸乙酯的混合溶剂中，得到固体成分60质量％的第1溶液。另一方面，使双酚A·F共聚型苯氧树脂50g溶解于质量比50:50的甲苯和醋酸乙酯的混合溶剂中，得到固体成分45质量％的第2溶液。混合上述第1和第2溶液，在该混合液中进一步配合液状环氧树脂。它们的配合量以固体质量比计为，双酚F型苯氧树脂:双酚A·F共聚型苯氧树脂∶液状环氧树脂为30:30:40。在得到混合液中进一步添加作为潜在性固化剂的芳香族锍盐2.4g来得到混合液。使用涂布装置将得到的混合液涂布于厚度50μm的单面用有机硅进行了表面处理的PET膜，然后，通过70℃、5分钟的热风干燥来形成厚度10μm的绝缘性粘接层。
(比较例1)
使双酚A型苯氧树脂50g溶解于质量比50:50的甲苯和醋酸乙酯的混合溶剂中，得到固体成分40质量％的第1溶液。另一方面，使双酚A·F共聚型苯氧树脂50g溶解于质量比50:50的甲苯和醋酸乙酯的混合溶剂中，得到固体成分45质量％的第2溶液。混合上述第1和第2溶液，在该混合液中进一步配合液状环氧树脂。它们的配合量以固体质量比计为，双酚A型苯氧树脂:双酚A·F共聚型苯氧树脂∶液状环氧树脂为30:30:40。在得到混合液中进一步添加作为潜在性固化剂的芳香族锍盐2.4g来得到混合液。使用涂布装置将得到的混合液涂布于厚度50μm的单面用有机硅进行了表面处理的PET膜，然后，通过70℃、5分钟的热风干燥来形成厚度10μm的绝缘性粘接层。
使双酚F型苯氧树脂100g溶解于质量比50:50的甲苯和醋酸乙酯的混合溶剂中，得到固体成分60质量％的第1溶液。另一方面，使双酚A·F共聚型苯氧树脂50g溶解于质量比50:50的甲苯和醋酸乙酯的混合溶剂中，得到固体成分45质量％的第2溶液。混合上述第1和第2溶液，在该混合液中进一步配合液状环氧树脂。它们的配合量以固体质量比计为，双酚F型苯氧树脂:双酚A·F共聚型苯氧树脂：液状环氧树脂为30:30:40。在得到的配合液中进一步配合分散导电粒子，其相对于树脂成分为10体积％，进一步添加作为潜在性固化剂的芳香族锍盐2.4g来得到分散液。使用涂布装置将得到的分散液涂布于厚度50μm的单面用有机硅进行了表面处理的PET膜，然后，通过70℃、5分钟的热风干燥来形成厚度10μm的导电性粘接层。使用层压机来贴合形成好的绝缘性粘接层和导电性粘接层，得到用PET膜夹持的粘接膜。
(比较例2)
绝缘性粘接层的形成以下述方式代替，除此之外，与实施例1同样地操作，得到带PET膜的粘接膜。使双酚F型苯氧树脂100g溶解于质量比50:50的甲苯和醋酸乙酯的混合溶剂中，得到固体成分60质量％的溶液。在该溶液中配合液状环氧树脂得到混合液。上述液状环氧树脂的配合量以固体质量比计为，双酚F型苯氧树脂:液状环氧树脂为60:40。不添加作为潜在性固化剂的芳香族锍盐，使用涂布装置将得到的混合液涂布于厚度50μm的单面用有机硅进行了表面处理的PET膜，然后，通过70℃、5分钟的热风干燥来形成厚度10μm的绝缘性粘接层。
(电路部件的连接结构的形成)
分别使用实施例1、2和比较例1、2的粘接膜，制作电路部件的连接结构。详细来讲，首先，剥离除去粘接膜的导电性粘接层侧的PET膜，露出导电性粘接层的表面。接着，在厚度0.5mm的玻璃上通过蒸镀来形成ITO膜，得到ITO基板(表面电阻<20Ω/□)。接着，使上述粘接膜的导电性粘接层的表面面向ITO膜的表面来接触ITO膜的表面，同时，以70℃、0.5MPa、3秒钟的条件在它们层叠方向上加热加压，将粘接膜暂时固定在ITO基板上。然后，从粘接膜剥离除去另一面的PET膜。接着，将IC芯片载置在上述粘接膜上，所述IC芯片设置有凸点面积30μm×50μm、节距40μm、高度15μm的2列(棋盘排列)的金凸点。用石英玻璃和加压头夹压载置有IC芯片的粘接膜，通过在160℃、100MPa、10秒钟的条件下进行加热加压，来连接ITO基板和IC芯片，制作出电路部件的连接结构。
(凸点-玻璃基板配线间捕捉粒子数的测定)
对于上述连接结构，用金属显微镜(倍率500倍)从ITO基板的玻璃侧观察200处30μm×50μm的区域，对ITO基板和金凸点夹持的导电粒子数进行计数。然后，通过相加平均来求出每一个区域的导电粒子的数量。将其结果示于表1中。
(连接电阻的测定)
对于使用实施例1、2和比较例1、2的粘接膜来得到的电路部件的连接结构，在初期以及保持于高温高湿槽(85℃85RH环境下)中500小时之后，用4端子测定法利用万用表测定该连接部的电阻值。其结果示于表1中。
(C/D的值的测定)
将实施例1、2和比较例1、2的粘接膜切成Φ5.5mm的圆板状。接着，用厚度0.7mm、15mm×15mm的2片玻璃板夹持切出的粘接膜，在160℃、2MPa、10秒钟的条件下进行加热加压。根据加热加压前的粘接膜的主面的面积A和加热加压后的固化了的绝缘性粘接层的主面的面积C来求出C/A的值。进一步，根据加热加压前的粘接膜的主面的面积A和加热加压后的固化了的导电性粘接层的主面的面积D来求出D/A的值，通过用C/A的值除以D/A的值来算出C/D的值。其结果示于表1中。
上述主面的面积C和D，使用扫描仪等对玻璃板的加热加压后的固化了的粘接膜的宽度进行摄像，采用图像处理装置来求出。面积C是由粘接膜的最外周围起来的部分的面积，面积D是由最外周的内侧的周缘所围起来的部分的面积。最外周和最外周的内侧的周缘之间的部分用肉眼看时为白色透明，用扫描仪摄像时呈现淡蓝色，另外，最外周的内侧的周缘的内侧的部分用肉眼看倾向于黑色，用扫描仪摄像时呈现白色，因此能够区别它们。用扫描仪对加热加压后的固化了的粘接膜进行摄像的图像，示于图2中。图2所示的固化了的粘接膜的最外周的直径约为9mm。
表1
Figure A200780041598D00171
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表1，接上页
Figure A200780041598D00181

Claims (11)

1.一种粘接膜，其中，层叠有含有导电粒子的导电性粘接层和绝缘性粘接层，
在层叠方向上以规定的条件进行加热加压后的、固化了的绝缘性粘接层的主面的面积C，除以固化了的导电性粘接层的主面的面积D的值即C/D为1.2～3.0。
2.根据权利要求1所述的粘接膜，其中，所述绝缘性粘接层含有双酚F型苯氧树脂。
3.根据权利要求1或2所述的粘接膜，其中，所述导电性粘接层含有选自由双酚A型苯氧树脂和双酚A·F共聚型苯氧树脂组成的组中的至少1种树脂。
4.根据权利要求1～3中的任意一项所述的粘接膜，其为用于将相对峙的连接端子之间进行电连接的粘接膜，
其中，40℃、频率10Hz时的所述粘接膜的固化物的储能模量E’为0.5～2.5GPa。
5.根据权利要求1～4中的任意一项所述的粘接膜，其中，所述绝缘性粘接层和/或所述导电性粘接层包含膜形成材、环氧树脂以及潜在性固化剂。
6.一种粘接膜，其中，层叠有含有导电粒子的导电性粘接层和绝缘性粘接层，
所述绝缘性粘接层含有双酚F型苯氧树脂。
7.一种连接结构，其为将具有第1连接端子的第1电路部件和具有第2连接端子的第2电路部件，以将所述第1连接端子和所述第2连接端子相向的方式进行配置，使粘接膜介于相向配置的所述第1连接端子与所述第2连接端子之间，并进行加热加压，使所述第1连接端子与所述第2连接端子电连接而构成的电路部件的连接结构，
其中，所述粘接膜具有含有导电粒子的导电性粘接层和绝缘性粘接层，
进行加热加压后的、固化了的所述绝缘性粘接层的主面的面积C，除以固化了的所述导电性粘接层的主面的面积D的值即C/D为1.2～3.0。
8.根据权利要求7所述的电路连接结构，其中，所述第1和第2电路部件中的至少一方为IC芯片。
9.根据权利要求7或8所述的连接结构，其中，所述第1和第2连接端子中的至少一方的表面，包含选自由金、银、锡、铂族的金属以及铟-锡氧化物组成的组中的至少1种。
10.根据权利要求7～9中的任意一项所述的连接结构，其中，用选自氮化硅、有机硅化合物以及聚酰亚胺树脂组成的组中的至少1种，对所述第1和第2电路部件中的至少一方的表面进行涂覆或附着处理。
11.一种连接方法，其为将具有第1连接端子的第1电路部件和具有第2连接端子的第2电路部件，以将所述第1连接端子和所述第2连接端子相向的方式进行配置，使粘接膜介于相向配置的所述第1连接端子与所述第2连接端子之间，并进行加热加压，使相向配置的所述第1连接端子与所述第2连接端子电连接的电路部件的连接方法，
其中，所述粘接膜具有含有导电粒子的导电性粘接层和绝缘性粘接层，
进行加热加压后的、固化了的所述绝缘性粘接层的主面的面积C，除以固化了的所述导电性粘接层的主面的面积D的值即C/D为1.2～3.0。
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