CN102318453B - 带有电连接器的电路基板用外壳及具有该外壳的电子单元 - Google Patents
带有电连接器的电路基板用外壳及具有该外壳的电子单元 Download PDFInfo
- Publication number
- CN102318453B CN102318453B CN200980102931.XA CN200980102931A CN102318453B CN 102318453 B CN102318453 B CN 102318453B CN 200980102931 A CN200980102931 A CN 200980102931A CN 102318453 B CN102318453 B CN 102318453B
- Authority
- CN
- China
- Prior art keywords
- fixed part
- case member
- bar
- circuit board
- jut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003780 insertion Methods 0.000 claims description 53
- 230000037431 insertion Effects 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 40
- 239000013536 elastomeric material Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 description 37
- 238000005452 bending Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/728—Coupling devices without an insulating housing provided on the edge of the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/73—Means for mounting coupling parts to apparatus or structures, e.g. to a wall
- H01R13/74—Means for mounting coupling parts in openings of a panel
- H01R13/741—Means for mounting coupling parts in openings of a panel using snap fastening means
- H01R13/743—Means for mounting coupling parts in openings of a panel using snap fastening means integral with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/26—Connectors or connections adapted for particular applications for vehicles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-014078 | 2008-01-24 | ||
JP2008014078A JP5030159B2 (ja) | 2008-01-24 | 2008-01-24 | 電気コネクタ付回路基板用ケース及びそれを備えた電子ユニット |
JP2008-115427 | 2008-04-25 | ||
JP2008115427A JP5074999B2 (ja) | 2008-04-25 | 2008-04-25 | 電気コネクタ付回路基板用ケース及びそれを備えた電子ユニット |
PCT/JP2009/000131 WO2009093424A1 (ja) | 2008-01-24 | 2009-01-15 | 電気コネクタ付回路基板用ケース及びそれを備えた電子ユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102318453A CN102318453A (zh) | 2012-01-11 |
CN102318453B true CN102318453B (zh) | 2015-01-28 |
Family
ID=40900936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980102931.XA Expired - Fee Related CN102318453B (zh) | 2008-01-24 | 2009-01-15 | 带有电连接器的电路基板用外壳及具有该外壳的电子单元 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8269116B2 (zh) |
KR (1) | KR20100113545A (zh) |
CN (1) | CN102318453B (zh) |
DE (1) | DE112009000175T5 (zh) |
WO (1) | WO2009093424A1 (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6315228B2 (ja) * | 2013-05-29 | 2018-04-25 | カシオ計算機株式会社 | 投影装置、支持板、及び、投影装置の投影方法 |
KR101428933B1 (ko) | 2013-07-05 | 2014-08-08 | 현대오트론 주식회사 | 방열판을 이용한 차량의 전자 제어 장치 및 그 제조 방법 |
EP3089296B1 (en) * | 2014-06-19 | 2018-02-28 | AutoNetworks Technologies, Ltd. | Electrical junction box and connector housing |
DE102014213957B4 (de) * | 2014-07-17 | 2017-10-19 | Robert Bosch Gmbh | Elektronikmodul mit eingesteckter elektrischer Kontaktierung |
DE102014213954B4 (de) * | 2014-07-17 | 2017-10-19 | Robert Bosch Gmbh | Elektronikmodul mit eingesteckter elektrischer Kontaktierung |
CN106505336B (zh) | 2015-09-07 | 2018-12-14 | 矢崎总业株式会社 | 连接器 |
DE102015224354A1 (de) * | 2015-12-04 | 2017-06-08 | Robert Bosch Gmbh | Vorrichtung und Herstellungsverfahren einer Vorrichtung mit einer innerhalb eines Gehäuses angeordneten Leiterplatte, welche von außen kontaktierbar ist |
JP6630190B2 (ja) * | 2016-03-02 | 2020-01-15 | 矢崎総業株式会社 | コネクタ付きケースおよびコネクタ付きケースの製造方法 |
FR3056835B1 (fr) * | 2016-09-28 | 2020-08-28 | Valeo Japan Co Ltd | Connecteur electrique haute tension pour compresseur electrique |
KR20180068017A (ko) * | 2016-12-13 | 2018-06-21 | 현대자동차주식회사 | 전력 변환장치 |
US20180192533A1 (en) * | 2017-01-04 | 2018-07-05 | Noritz Corporation | Case for housing electric board |
US10727619B2 (en) * | 2017-03-06 | 2020-07-28 | Mitsubishi Electric Corporation | Control unit having press-fit structure |
USD888676S1 (en) * | 2018-08-29 | 2020-06-30 | Samsung Electronics Co., Ltd. | Case for a circuit board |
USD888675S1 (en) * | 2018-08-29 | 2020-06-30 | Samsung Electronics Co., Ltd. | Case for a circuit board |
JP7081548B2 (ja) * | 2019-03-27 | 2022-06-07 | 株式会社オートネットワーク技術研究所 | コネクタ |
JP7131495B2 (ja) * | 2019-06-21 | 2022-09-06 | 株式会社オートネットワーク技術研究所 | コネクタ装置 |
CN112993624B (zh) * | 2021-02-05 | 2022-09-06 | 深圳市豪塑科技有限公司 | 一种双位连接器及其组装方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6445568B1 (en) * | 1999-11-25 | 2002-09-03 | Daimlerchrysler Ag | Plastic housing with condensation protection for electric and electronic assemblies |
US6560115B1 (en) * | 1999-05-14 | 2003-05-06 | Fujitsu Ten Limited | Combination structure of electronic equipment |
US6858801B1 (en) * | 2001-05-29 | 2005-02-22 | Thomas Edward Brown | Circuit shell enclosure |
CN1942066A (zh) * | 2005-09-26 | 2007-04-04 | 株式会社捷太格特 | 电子控制单元 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11284386A (ja) | 1998-03-31 | 1999-10-15 | Matsushita Electric Ind Co Ltd | Emiシールド構造 |
JP3334642B2 (ja) | 1998-09-16 | 2002-10-15 | 住友電装株式会社 | 電気接続箱 |
JP4381038B2 (ja) * | 2003-06-06 | 2009-12-09 | 株式会社東芝 | 送受信装置およびケーブルモデムモジュール装置 |
US7066660B2 (en) * | 2003-08-29 | 2006-06-27 | Finisar Corporation | Optoelectronic packaging assembly |
JP2007280795A (ja) * | 2006-04-07 | 2007-10-25 | Molex Japan Co Ltd | 電子接続箱ユニット |
-
2009
- 2009-01-15 CN CN200980102931.XA patent/CN102318453B/zh not_active Expired - Fee Related
- 2009-01-15 DE DE112009000175T patent/DE112009000175T5/de not_active Withdrawn
- 2009-01-15 WO PCT/JP2009/000131 patent/WO2009093424A1/ja active Application Filing
- 2009-01-15 KR KR1020107017355A patent/KR20100113545A/ko not_active Application Discontinuation
- 2009-01-15 US US12/864,177 patent/US8269116B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6560115B1 (en) * | 1999-05-14 | 2003-05-06 | Fujitsu Ten Limited | Combination structure of electronic equipment |
US6445568B1 (en) * | 1999-11-25 | 2002-09-03 | Daimlerchrysler Ag | Plastic housing with condensation protection for electric and electronic assemblies |
US6858801B1 (en) * | 2001-05-29 | 2005-02-22 | Thomas Edward Brown | Circuit shell enclosure |
CN1942066A (zh) * | 2005-09-26 | 2007-04-04 | 株式会社捷太格特 | 电子控制单元 |
Also Published As
Publication number | Publication date |
---|---|
KR20100113545A (ko) | 2010-10-21 |
WO2009093424A1 (ja) | 2009-07-30 |
US8269116B2 (en) | 2012-09-18 |
CN102318453A (zh) | 2012-01-11 |
DE112009000175T5 (de) | 2012-01-12 |
US20100300723A1 (en) | 2010-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: FURUKAWA AS CO., LTD. Effective date: 20121012 Owner name: FURUKAWA ELECTRIC CO., LTD. Free format text: FORMER OWNER: MITSUBISHI CABLE INDUSTRIES, LTD. Effective date: 20121012 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20121012 Address after: Tokyo, Japan Applicant after: Furukawa Electric Co., Ltd. Applicant after: Furukawa AS Co., Ltd. Address before: Tokyo, Japan Applicant before: Mitsubishi Cable Industries, Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150128 Termination date: 20160115 |
|
EXPY | Termination of patent right or utility model |