CN102316967A - 流体控制方法及流体控制装置 - Google Patents
流体控制方法及流体控制装置 Download PDFInfo
- Publication number
- CN102316967A CN102316967A CN2010800072264A CN201080007226A CN102316967A CN 102316967 A CN102316967 A CN 102316967A CN 2010800072264 A CN2010800072264 A CN 2010800072264A CN 201080007226 A CN201080007226 A CN 201080007226A CN 102316967 A CN102316967 A CN 102316967A
- Authority
- CN
- China
- Prior art keywords
- fluid
- acid
- fluid control
- concentration
- mixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/85—Investigating moving fluids or granular solids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/80—Forming a predetermined ratio of the substances to be mixed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/40—Mixing liquids with liquids; Emulsifying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/40—Static mixers
- B01F25/42—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
- B01F25/43—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction
- B01F25/432—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction with means for dividing the material flow into separate sub-flows and for repositioning and recombining these sub-flows; Cross-mixing, e.g. conducting the outer layer of the material nearer to the axis of the tube or vice-versa
- B01F25/4323—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction with means for dividing the material flow into separate sub-flows and for repositioning and recombining these sub-flows; Cross-mixing, e.g. conducting the outer layer of the material nearer to the axis of the tube or vice-versa using elements provided with a plurality of channels or using a plurality of tubes which can either be placed between common spaces or collectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F33/00—Other mixers; Mixing plants; Combinations of mixers
- B01F33/30—Micromixers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/80—Forming a predetermined ratio of the substances to be mixed
- B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
- F15D1/00—Influencing flow of fluids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/33—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using ultraviolet light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/64—Wet etching of semiconductor materials
- H10P50/642—Chemical etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Weting (AREA)
- Accessories For Mixers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009030366A JP5340760B2 (ja) | 2009-02-12 | 2009-02-12 | 流体制御方法及び流体制御装置 |
| JP2009-030366 | 2009-02-12 | ||
| PCT/JP2010/051973 WO2010092985A1 (ja) | 2009-02-12 | 2010-02-10 | 流体制御方法及び流体制御装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102316967A true CN102316967A (zh) | 2012-01-11 |
Family
ID=42561826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800072264A Pending CN102316967A (zh) | 2009-02-12 | 2010-02-10 | 流体控制方法及流体控制装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110315228A1 (https=) |
| JP (1) | JP5340760B2 (https=) |
| KR (1) | KR20110114613A (https=) |
| CN (1) | CN102316967A (https=) |
| TW (1) | TWI494729B (https=) |
| WO (1) | WO2010092985A1 (https=) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102814143A (zh) * | 2012-09-13 | 2012-12-12 | 中国海洋石油总公司 | 即时混配装置 |
| CN102901713A (zh) * | 2011-07-28 | 2013-01-30 | 株式会社东进世美肯 | 铜膜蚀刻工序控制方法及铜膜蚀刻液组合物的再生方法 |
| CN105301174A (zh) * | 2014-07-16 | 2016-02-03 | 中国科学院苏州纳米技术与纳米仿生研究所 | 用于微流控芯片的试剂滴定方法及装置、微流控芯片 |
| CN106249773A (zh) * | 2016-08-31 | 2016-12-21 | 张源兴 | 混合酸中单项酸检测控制装置 |
| CN106841088A (zh) * | 2017-01-17 | 2017-06-13 | 西安景辉信息科技有限公司 | 一种油料水分测定仪用传感器及其实施方法 |
| CN108869410A (zh) * | 2018-06-11 | 2018-11-23 | 中国科学院工程热物理研究所 | 一种叶片以及用于叶片的流体控制方法 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5180263B2 (ja) * | 2010-07-23 | 2013-04-10 | 倉敷紡績株式会社 | 基板処理装置 |
| JP5741056B2 (ja) * | 2011-02-25 | 2015-07-01 | 栗田工業株式会社 | ガス溶解水の製造装置 |
| CN104094383A (zh) * | 2011-08-22 | 2014-10-08 | 1366科技公司 | 用于硅晶片的湿法酸化学蚀刻的制剂 |
| JP5752530B2 (ja) * | 2011-08-31 | 2015-07-22 | 倉敷紡績株式会社 | 基板処理装置 |
| JP5642137B2 (ja) * | 2012-10-25 | 2014-12-17 | 日機装株式会社 | 溶液の調製装置および溶液の調製方法 |
| TWI641936B (zh) * | 2012-11-13 | 2018-11-21 | 美商慧盛材料美國責任有限公司 | 漿料供應及/或化學品摻合物供應設備、方法、使用方法及製造方法 |
| US9770804B2 (en) | 2013-03-18 | 2017-09-26 | Versum Materials Us, Llc | Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture |
| RU2017115832A (ru) * | 2014-11-07 | 2018-12-07 | Окси Солюшнз Ас | Устройство для растворения газа в жидкости |
| CN108495809B (zh) * | 2016-01-28 | 2023-04-25 | 明测生物医疗有限公司 | 使用微流体装置的多段式靶细胞富集 |
| AU2018215821B2 (en) | 2017-02-06 | 2023-02-02 | Efa - Engineering For All Ltd. | Portable digital diagnostic device |
| JP6909620B2 (ja) * | 2017-04-20 | 2021-07-28 | 株式会社Screenホールディングス | 基板処理方法 |
| JP7110558B2 (ja) * | 2017-09-01 | 2022-08-02 | 日産自動車株式会社 | 混合燃料供給装置及び混合燃料供給方法 |
| JP6899760B2 (ja) * | 2017-12-18 | 2021-07-07 | 三菱重工機械システム株式会社 | 液体混合装置 |
| JP2019158794A (ja) * | 2018-03-16 | 2019-09-19 | シスメックス株式会社 | 検体処理方法、検体処理チップおよび検体処理装置 |
| JP2020055214A (ja) * | 2018-10-02 | 2020-04-09 | 東芝テック株式会社 | 液体吐出ヘッド及びプリンタ |
| CN111640661B (zh) * | 2019-03-01 | 2024-01-30 | 东京毅力科创株式会社 | 基板处理方法、基板处理装置以及存储介质 |
| WO2021236009A1 (en) | 2020-05-18 | 2021-11-25 | National University Of Singapore | Microfluidic device and liquid control system therefor |
| CN112763450A (zh) * | 2020-12-14 | 2021-05-07 | 中国原子能科学研究院 | 一种同时测定水溶液中硝酸铝和硝酸浓度的方法 |
| TWI880391B (zh) * | 2023-10-11 | 2025-04-11 | 弘塑科技股份有限公司 | 流體流量校正系統及校正方法 |
| CN118253246B (zh) * | 2024-02-29 | 2025-03-14 | 安瑞科(廊坊)能源装备集成有限公司 | 甲醇溶液的自动配制装置、方法和电子设备 |
| WO2025239355A1 (ja) * | 2024-05-15 | 2025-11-20 | 慶應義塾 | マイクロ流体デバイスにおける流体の粘度を制御するためのシステム及びマイクロ流体デバイスにおける流体の粘度を制御する方法 |
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| JP2000254569A (ja) * | 1999-03-10 | 2000-09-19 | Melt Giken Kk | ホットメルト剤用可変tダイ |
| JP2005214863A (ja) * | 2004-01-30 | 2005-08-11 | Kurabo Ind Ltd | 紫外光による水および水溶液測定方法 |
| CN1712567A (zh) * | 2004-06-25 | 2005-12-28 | 长濑产业株式会社 | 酸性蚀刻液再生方法和酸性蚀刻液再生装置 |
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| GB8712135D0 (en) * | 1987-05-22 | 1988-01-27 | Plessey Co Plc | Fibre-optic vapour/liquid ratio sensor |
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| JP4110304B2 (ja) * | 1998-06-30 | 2008-07-02 | 株式会社フジキン | 流体制御装置および流体制御装置組立て方法 |
| JP3921565B2 (ja) * | 1998-07-10 | 2007-05-30 | 株式会社フジキン | 流体制御装置 |
| DE19959249A1 (de) * | 1999-12-08 | 2001-07-19 | Inst Mikrotechnik Mainz Gmbh | Modulares Mikroreaktionssystem |
| US7037416B2 (en) * | 2000-01-14 | 2006-05-02 | Caliper Life Sciences, Inc. | Method for monitoring flow rate using fluorescent markers |
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| JP4258489B2 (ja) * | 2000-07-31 | 2009-04-30 | 日本化成株式会社 | エッチング液の製造方法およびエッチング方法 |
| TW511180B (en) * | 2000-07-31 | 2002-11-21 | Mitsubishi Chem Corp | Mixed acid solution in etching process, process for producing the same, etching process using the same and process for producing semiconductor device |
| JP2002236131A (ja) * | 2000-12-08 | 2002-08-23 | Minolta Co Ltd | マイクロチップ |
| US7010391B2 (en) * | 2001-03-28 | 2006-03-07 | Handylab, Inc. | Methods and systems for control of microfluidic devices |
| US20040109793A1 (en) * | 2002-02-07 | 2004-06-10 | Mcneely Michael R | Three-dimensional microfluidics incorporating passive fluid control structures |
| US6892745B2 (en) * | 2002-04-10 | 2005-05-17 | Honeywell International Inc. | Flow control valve with integral sensor and controller and related method |
| DE60312186T2 (de) * | 2002-09-06 | 2007-11-08 | Epigem Ltd. | Modulares mikrofluidsystem |
| JP2004113987A (ja) * | 2002-09-27 | 2004-04-15 | Shibaura Mechatronics Corp | 液体の混合装置、混合方法及び基板の処理装置 |
| JP3964850B2 (ja) * | 2003-10-14 | 2007-08-22 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP2006023200A (ja) * | 2004-07-08 | 2006-01-26 | Kurabo Ind Ltd | 光学プローブ及びそれを用いた分光測定装置 |
| JP2006029485A (ja) * | 2004-07-20 | 2006-02-02 | Pentax Corp | マイクロバルブ及び該バルブを有するマイクロ流体デバイス |
| JP4677805B2 (ja) * | 2005-03-22 | 2011-04-27 | 株式会社フジキン | 流体制御装置 |
| EP1922364A4 (en) * | 2005-08-09 | 2010-04-21 | Univ North Carolina | METHOD AND MATERIALS FOR PRODUCING MICROFLUIDIC DEVICES |
| US20090145485A1 (en) * | 2005-08-11 | 2009-06-11 | Eksigent Technologies, Llc | Microfluidic methods and apparatuses for fluid mixing and valving |
| JP2007133829A (ja) * | 2005-11-14 | 2007-05-31 | Hamlet Motoyama Japan:Kk | 流体制御装置と圧力調節弁と制御方法 |
| JP2008147637A (ja) * | 2006-11-16 | 2008-06-26 | Kurita Water Ind Ltd | エッチング方法およびエッチング装置 |
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-
2009
- 2009-02-12 JP JP2009030366A patent/JP5340760B2/ja not_active Expired - Fee Related
-
2010
- 2010-02-10 CN CN2010800072264A patent/CN102316967A/zh active Pending
- 2010-02-10 KR KR1020117018132A patent/KR20110114613A/ko not_active Ceased
- 2010-02-10 WO PCT/JP2010/051973 patent/WO2010092985A1/ja not_active Ceased
- 2010-02-10 US US13/201,155 patent/US20110315228A1/en not_active Abandoned
- 2010-02-12 TW TW099104628A patent/TWI494729B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000254569A (ja) * | 1999-03-10 | 2000-09-19 | Melt Giken Kk | ホットメルト剤用可変tダイ |
| JP2005214863A (ja) * | 2004-01-30 | 2005-08-11 | Kurabo Ind Ltd | 紫外光による水および水溶液測定方法 |
| CN1712567A (zh) * | 2004-06-25 | 2005-12-28 | 长濑产业株式会社 | 酸性蚀刻液再生方法和酸性蚀刻液再生装置 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102901713A (zh) * | 2011-07-28 | 2013-01-30 | 株式会社东进世美肯 | 铜膜蚀刻工序控制方法及铜膜蚀刻液组合物的再生方法 |
| CN102814143A (zh) * | 2012-09-13 | 2012-12-12 | 中国海洋石油总公司 | 即时混配装置 |
| CN105301174A (zh) * | 2014-07-16 | 2016-02-03 | 中国科学院苏州纳米技术与纳米仿生研究所 | 用于微流控芯片的试剂滴定方法及装置、微流控芯片 |
| CN105301174B (zh) * | 2014-07-16 | 2017-07-18 | 中国科学院苏州纳米技术与纳米仿生研究所 | 用于微流控芯片的试剂滴定方法及装置、微流控芯片 |
| CN106249773A (zh) * | 2016-08-31 | 2016-12-21 | 张源兴 | 混合酸中单项酸检测控制装置 |
| CN106841088A (zh) * | 2017-01-17 | 2017-06-13 | 西安景辉信息科技有限公司 | 一种油料水分测定仪用传感器及其实施方法 |
| CN108869410A (zh) * | 2018-06-11 | 2018-11-23 | 中国科学院工程热物理研究所 | 一种叶片以及用于叶片的流体控制方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5340760B2 (ja) | 2013-11-13 |
| TWI494729B (zh) | 2015-08-01 |
| WO2010092985A1 (ja) | 2010-08-19 |
| JP2010184203A (ja) | 2010-08-26 |
| US20110315228A1 (en) | 2011-12-29 |
| KR20110114613A (ko) | 2011-10-19 |
| TW201044130A (en) | 2010-12-16 |
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Application publication date: 20120111 |