CN102295895B - 具有优异的粘合性能和耐热性的热固性双面粘合膜 - Google Patents
具有优异的粘合性能和耐热性的热固性双面粘合膜 Download PDFInfo
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Abstract
本发明提供一种具有优异的粘合性能和耐热性的热固性双面粘合膜,所述双面粘合膜用于固定导线空间以防止电干扰并提供待堆叠的裸片之间的粘合,可以防止诸如由在高温加工期间在封装内部吸收的水内容物的高水蒸气压而引起的界面的剥落或爆米花式爆裂现象的问题。本发明的具有优异的粘合性能和耐热性的热固性双面粘合膜是处于裸片之间且具有涂布在聚酰亚胺膜两侧上的粘合层的粘合膜,其中对于每100重量份含有1~10重量%羧基的NBR,所述粘合层包含5~200重量份的环氧树脂、50~200重量份的酚醛树脂以及2~40重量份的选自胺类或酸酐类固化剂中的一种或多种固化剂,其中按照环球法测量,所述酚醛树脂的软化点为60℃~120℃。
Description
技术领域
本发明主要涉及一种用于堆叠式CSP(chip scale package,芯片级封装)的粘合膜,更具体地,本发明涉及一种具有优异的粘合性能和耐热性的热固性双面粘合膜,所述双面粘合膜是用于固定导线空间以防止电干扰并提供待堆叠的裸片(die)之间的粘合的双面粘合膜,其具有优异的粘合性能和耐热性,并且其能防止诸如由在高温加工期间在封装内部吸收的水内容物的高水蒸气压而引起的封装的界面剥落或爆米花式爆裂(popcorn cracking)现象的问题。
背景技术
最近,随着半导体芯片的高度一体化和小型化的新趋势,发展了CSP(芯片级封装)。如由其名称可注意到的,在这样的芯片级封装中,认为芯片尺寸几乎与封装尺寸相同。
堆叠式CSP是作为目前封装趋势的一部分的更先进封装中的一种。换句话说,在一个芯片之上安装一个或多个芯片,以便在尺寸与传统封装几乎相同的封装内提供高得多的容量。堆叠式CSP具有提高容量以及降低存储器尺寸的优点,从而通过利用传统BGA表面安装技术将薄膜核心衬底材料和晶片背磨技术结合来使电子装置的功能加倍。利用这种技术,可以有效地利用主板的面积并减小其重量和尺寸,从而最终实现在系统级别上降低成本的目的。另外,由于堆叠式CSP使市场上的存储器能够与不同设备相连接,所以其提供了进一步降低用于整体系统的费用的方法。
随着芯片尺寸逐渐变小,芯片和衬底之间的间隙已经变得更小,并且相应于新封装的粘合剂的开发也已经变得必不可少。因此,正在开发多种新技术。虽然在现有技术中主要使用糊料,但是由于生产率和树脂渗出问题,所以正在开发粘合膜形式的新技术。
目前,正在将大多数封装转换成CSP型而不考虑其衬底,并且大多数组装公司正在积极参与作为环境友好产品一部分的无铅产品的开发。然而,与传统的铅焊料相比,这种产品具有熔点(约220℃)更高的缺点。为了解决这样的缺点,由于用于组装的其它产品也应该解决由这样的高温或其它封装问题所引起的爆米花式爆裂问题,所以需要的可靠性水平越来越高。例如,虽然当使用传统焊料时熔点较低,为约220℃,但是由于目前的无铅焊料的熔点较高,为260℃左右,所以在封装内部吸收的水内容物可能通过在这种高温加工期间的高温而产生高的水蒸气压,这又能够引起诸如封装的爆米花式爆裂现象或界面剥落的问题。
因此,急需开发一种可以解决上述问题的粘合膜。
发明内容
本发明提供一种具有优异的粘合性能和耐热性的热固性双面粘合膜,其具有优异的粘合性能和耐热性,且可以防止诸如由在高温加工期间在封装内部吸收的水内容物的高水蒸气压而引起的界面的剥落或爆米花式爆裂现象的问题。
从本公开的下列详细说明中,本发明的这些和其它目的将显而易见。
通过一种具有优异的粘合性能和耐热性的热固性双面粘合膜来实现上述目的,所述热固性双面粘合膜是处于裸片之间且具有涂布在聚酰亚胺膜两侧上的粘合层的粘合膜,其中对于每100重量份含有1~10重量%羧基的NBR,所述粘合层包含5~200重量份的环氧树脂、50~200重量份的酚醛树脂(phenol resin)以及2~40重量份的选自胺类或酸酐类固化剂中的一种或多种固化剂,并且其中按照环球法测量,所述酚醛树脂的软化点为60~120℃。
本文中,在125℃/1.5kg/1秒的条件下将一个裸片(2cm×2cm)与另一个裸片(2cm×2cm)粘合,接着进行固化步骤(175℃/1小时)之后,所述粘合膜的裸片剪切应力在室温(25℃)下为5kg以上,在260℃下为100g以上。
发明效果
本发明具有下列效果:提供优异的粘合性能和耐热性;防止诸如由在高温加工期间在封装内部吸收的水内容物的高水蒸气压而引起的界面的剥落或爆米花式爆裂现象的问题。
附图说明
图1是堆叠式芯片级封装的剖视图;
图2是本发明实施方案的在裸片之间的粘合膜的剖视图。
附图标记说明
1:导线
2:模塑材料
3:粘合膜
4:焊接掩模
5:图案
6:衬底
7:子裸片
8:母裸片
10:聚酰亚胺膜
20:粘合层
30:剥离膜
具体实施方式
在下文中,将参考附图对本发明的优选实施方案进行详细描述。应理解,本发明优选实施方案的详细描述仅通过例举给出,因此,在本发明主旨和范围内的各种变化和修改对于本领域的技术人员将变得显而易见。
图1是堆叠式芯片级封装的剖视图,图2是本发明实施方案的在裸片之间的粘合膜的剖视图。
如从图2可以注意到的,本发明具有优异的粘合性能和耐热性的热固性双面粘合膜具有涂布在聚酰亚胺膜(10)两侧上的粘合层(20)。本文中,每个粘合层(20)包含含有羧基的NBR、环氧树脂、酚醛树脂、固化剂等,并且在粘合层(20)的上面层压有剥离膜(30)。
用于本发明具有优异的粘合性能和耐热性的热固性双面粘合膜的聚酰亚胺膜(10)的厚度可以根据封装所需高度自由选择。
对于每100重量份的NBR,本发明具有优异的粘合性能和耐热性的热固性双面粘合膜的粘合层(20)包含5~200重量份的多官能团环氧树脂和5~200重量份的多官能团酚醛树脂,并可另外包含固化剂、橡胶交联剂和其它添加剂。
含有羧基的NBR具有3000~200000的重均分子量,并含有20~50重量%的丙烯腈和1~10重量%的羧基。在这种情况下,如果重均分子量低于3000,则在高温下的粘合强度会变差,而如果高于200000,则在溶剂中的溶解度会降低,由于在溶液制备期间粘度增加而导致加工性降低,而且室温下的粘合强度也会下降。如果NBR含有小于20重量%的丙烯腈,则在溶剂中的溶解度会降低,而如果NBR含有大于50重量%的丙烯腈,则电绝缘性会变差。另外,如果NBR含有1~10重量%的羧基,则在NBR和其它树脂、以及粘合衬底之间的结合变得更容易,从而提高了粘合强度。不具有羧基的NBR会具有差的粘合强度。
此外,对于每100重量份的NBR,本发明的粘合剂优选含有5~200重量份的环氧树脂,这种环氧树脂的例子可包括双酚A型环氧树脂、双酚F型环氧树脂和酚醛环氧树脂。环氧当量(g/eq)可以为100~1000。
而且,对于每100重量份的NBR,期望本发明的粘合剂含有50~200重量份的酚醛树脂,如果酚醛树脂大于200重量份,则粘合层会变得太脆而几乎不可能使所述粘合层成为膜的形式。另外,优选酚醛树脂的分子量为200~900,并且优选按照环球法测量的酚醛树脂的软化点为60~120℃。如果使用软化点低于60℃的酚醛树脂,则可能如在糊料情况下那样发生树脂渗出,相反,如果软化点太高,则必须施加非常高的温度以将粘合膜粘合至裸片,从而降低了粘合强度。因此,需要使用具有适当软化点(60~120℃)的树脂。
对于固化剂,按照每100重量份的NBR,优选单独或组合使用2~40重量份的胺类固化剂和酸酐类固化剂。另外,对于每100重量份的NBR,可以使用1~5重量份的有机或无机过氧化物作为橡胶交联剂。
利用上述组合物制备的粘合层(20)具有200~1500CPS的粘度,并被涂布在聚酰亚胺膜(10)的两侧上,以便在干燥后厚度可以为10~30μm。之后,在50~180℃下将其上涂布有粘合层(20)的聚酰亚胺膜(10)固化2~10分钟,然后利用剥离膜(30)进行包覆以制造粘合膜。粘合层的厚度可以根据封装所需高度而适当变化。
虽然用于本发明具有优异的粘合性能和耐热性的热固性双面粘合膜的剥离膜(30)的厚度没有任何特别限制,但是其通常优选具有38μm。待使用的这种剥离膜的例子可以包括聚乙烯、聚对苯二甲酸乙二醇酯、聚丙烯膜以及在必要时通过硅树脂赋予剥离性能的上述膜。
优选的是,在125℃/1.5kg/1秒的条件下将一个裸片(2cm×2cm)与另一个裸片(2cm×2cm)粘合,接着进行固化步骤(175℃/1小时)之后,本发明具有优异的粘合性能和耐热性的热固性双面粘合膜的裸片剪切应力在室温(25℃)下为5kg以上,在260℃下为100g以上。
在下文中,将通过优选实施例和比较例详细描述本发明。
[实施例1]
首先,将50重量份酚醛清漆环氧树脂(环氧当量199)、150重量份由下述结构式1表示的酚醛树脂以及作为固化剂的10重量份六甲氧基甲基三聚氰胺和10重量份邻苯二甲酸酐添加至120重量份的NBR(含27重量%的丙烯腈和5重量%的羧基)中。然后加入2重量份作为橡胶交联剂的二枯基过氧化物(dicumyl peroxide),并通过使用丙酮溶剂,调节丙酮的量,从而使得粘度变为400CPS。在如上制备的溶液中的所有成分在室温下溶解之后,将这种粘合溶液涂布在厚度为25μm的聚酰亚胺膜的两侧上,使得干燥后的厚度为12μm。在干燥步骤(150℃下干燥3分钟)之后,在其上层压厚度为38μm的聚对苯二甲酸乙二醇酯膜,从而制得粘合膜。
(结构式1,软化点:110℃)
[实施例2]
除了使用如下述结构式2所示的酚醛树脂来代替上面使用的酚醛树脂之外,以与实施例1相同的方法,使用由与实施例1相同的组合物制备的粘合溶液来制造粘合膜。
(结构式2,软化点:85℃)
[实施例3]
除了使用如下述结构式3所示的酚醛树脂来代替上面使用的酚醛树脂之外,以与实施例1相同的方法,使用由与实施例1相同的组合物制备的粘合溶液来制造粘合膜。
(结构式3)
[比较例1]
除了使用不含羧基的NBR来代替上面使用的NBR之外,以与实施例1相同的方法,使用由与实施例1相同的组合物制备的粘合溶液来制造粘合膜。
[比较例2]
除了将酚醛树脂的量提高至250重量份之外,以与实施例1相同的方法,使用由与实施例1相同的组合物制备的粘合溶液来制造粘合膜。
[比较例3]
除了将酚醛树脂的量降低至50重量份之外,以与实施例1相同的方法,使用由与实施例1相同的组合物制备的粘合溶液来制造粘合膜。
[比较例4]
除了使用结构相同但软化点为125℃的酚醛树脂代替所述酚醛树脂之外,以与实施例1相同的方法,使用由与实施例1相同的组合物制备的粘合溶液来制造粘合膜。
基于下列试验例来对如上制造的本发明实施例和比较例的粘合膜的性能进行评价,并将结果示于表1中。
[试验例1:膜形态的保存测试]
这是为了检查在对按照实施例和比较例制备的粘合膜施加物理冲击之后,粘合膜的形态是否能够保存的试验,并且打算对在使用本粘合膜制造半导体封装期间所述粘合膜是否会因对其施加切削冲击而破裂进行测试。
测试方法如下:将如上制造的粘合膜切成5cm×5cm的尺寸以放在厚度为1cm的玻璃板上,接着从20cm的高度落下尺寸为1cm×1cm(重量:100g)的重物至粘合膜上;此后,通过肉眼观察粘合层以检查所述粘合层是否破裂。如果没有发现裂纹,则标记为“合格”,而如果发现裂纹,则标记为“不合格”。
[试验例2:室温下裸片剪切应力的测试]
使用半自动裸片粘合机设备在室温下测量粘合膜的裸片剪切应力,在125℃/1.5kg/1秒的条件下将一个裸片(2cm×2cm)与另一个裸片(2cm×2cm)粘合之后,接着在175℃/1小时下进行固化步骤。通常,需要5kg以上的裸片剪切应力来防止在环氧模塑材料或其它半导体组装加工期间粘合裸片的变形。
[试验例3:高温下裸片剪切应力的测试]
在以与室温下的裸片剪切应力测试相同的方式进行粘合和固化之后,在260℃下测量粘合膜的裸片剪切应力。
需要100g以上的剪切应力来防止由粘合强度的下降而导致的在焊接加工期间施加的260℃高温下与粘合膜粘合的裸片的变形。
[试验例4:PCT(高压锅试验)测量]
在如同室温下裸片剪切应力的测量中那样,将一个裸片与另个一裸片粘合,接着在85℃/85%RH/84小时的条件下进行PCT测量之后,使用X射线检查气泡的存在或粘合膜和裸片之间的脱层。如果没有发现气泡或脱层,标记为“合格”,而如果发现气泡或脱层,则标记为“不合格”。
作为参考,在裸片之间使用的商用粘合膜在上述所有4种试验中都不应该有任何“不合格”。
[表1]
如同从表1中可以看出的,本发明实施方案的在裸片间使用的粘合膜在作为粘合膜所需的基本性能:膜形态的保存、室温下的裸片剪切应力、高温下的裸片剪切应力和PCT测量的试验中显示了优异的结果。
在本发明人已经进行的各种实施方案中,特别参考其实施例和实施方案对本发明进行了详细描述,但是应理解,在不背离本发明主旨和范围的情况下,本领域的技术人员可以进行变化和修改。
Claims (2)
1.热固性双面粘合膜在待堆叠的裸片之间的粘合中的用途,所述热固性双面粘合膜为处于裸片之间且具有涂布在聚酰亚胺膜两侧上的粘合层的粘合膜,
其中对于每100重量份含有1~10重量%羧基的NBR,所述粘合层包含5~200重量份的环氧树脂、50~200重量份的酚醛树脂以及2~40重量份的选自胺类或酸酐类固化剂中的一种或多种固化剂,以及
其中按照环球法测量,所述酚醛树脂的软化点为60℃~120℃,以及
所述NBR具有3000~200000的重均分子量,并含有20~50重量%的丙烯腈。
2.权利要求1的用途,其中在125℃/1.5kg/1秒的条件下将一个2cm×2cm的裸片与另一个2cm×2cm的裸片粘合,接着在175℃/1小时的条件下进行固化步骤之后,所述粘合膜的裸片剪切应力在25℃室温下为5kg以上,在260℃下为100g以上。
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