CN102293068B - 多层印刷电路板 - Google Patents

多层印刷电路板 Download PDF

Info

Publication number
CN102293068B
CN102293068B CN201080005398.8A CN201080005398A CN102293068B CN 102293068 B CN102293068 B CN 102293068B CN 201080005398 A CN201080005398 A CN 201080005398A CN 102293068 B CN102293068 B CN 102293068B
Authority
CN
China
Prior art keywords
link
pattern
signal wiring
conductive layer
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080005398.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN102293068A (zh
Inventor
小山兼司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102293068A publication Critical patent/CN102293068A/zh
Application granted granted Critical
Publication of CN102293068B publication Critical patent/CN102293068B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201080005398.8A 2009-01-30 2010-01-28 多层印刷电路板 Expired - Fee Related CN102293068B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2009019297 2009-01-30
JP2009-019297 2009-01-30
JP2009279911A JP5409312B2 (ja) 2009-01-30 2009-12-09 多層プリント回路板
JP2009-279911 2009-12-09
PCT/JP2010/051547 WO2010087506A1 (en) 2009-01-30 2010-01-28 Multilayer printed circuit board

Publications (2)

Publication Number Publication Date
CN102293068A CN102293068A (zh) 2011-12-21
CN102293068B true CN102293068B (zh) 2014-03-05

Family

ID=42026336

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080005398.8A Expired - Fee Related CN102293068B (zh) 2009-01-30 2010-01-28 多层印刷电路板

Country Status (4)

Country Link
US (1) US8530750B2 (cg-RX-API-DMAC10.html)
JP (1) JP5409312B2 (cg-RX-API-DMAC10.html)
CN (1) CN102293068B (cg-RX-API-DMAC10.html)
WO (1) WO2010087506A1 (cg-RX-API-DMAC10.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201316895A (zh) * 2011-10-14 2013-04-16 Hon Hai Prec Ind Co Ltd 可抑制電磁干擾的電路板
JP5348259B2 (ja) * 2012-02-02 2013-11-20 横河電機株式会社 絶縁回路及び通信機器
US8913401B2 (en) 2012-11-14 2014-12-16 Fuji Xerox Co., Ltd. Multilayer wiring board
JP5803961B2 (ja) * 2013-03-21 2015-11-04 株式会社豊田自動織機 基板間隔保持部材及びインバータ装置
WO2015140856A1 (ja) * 2014-03-18 2015-09-24 パナソニックＩｐマネジメント株式会社 電子機器
JP6399969B2 (ja) * 2015-05-22 2018-10-03 三菱電機株式会社 プリント基板
JP7373705B2 (ja) 2018-02-15 2023-11-06 パナソニックＩｐマネジメント株式会社 回路基板、電子機器
KR102616482B1 (ko) 2018-07-26 2023-12-26 삼성전자주식회사 전원 배선에서 발생된 전자기파를 상쇄하기 위한 접지 배선을 포함하는 인쇄 회로 기판 및 이를 포함하는 전자 장치
JP7547036B2 (ja) * 2019-08-09 2024-09-09 キヤノン株式会社 プリント基板
JP7160012B2 (ja) * 2019-10-03 2022-10-25 株式会社デンソー 電子制御装置
WO2021131599A1 (ja) * 2019-12-27 2021-07-01 日立Astemo株式会社 電子制御装置
JP7705765B2 (ja) * 2021-09-22 2025-07-10 理想科学工業株式会社 電子機器
CN115175441B (zh) * 2022-08-01 2024-03-12 哈尔滨理工大学 真空低介电常数及低电导率的微电流传输电路板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10208791A (ja) * 1997-01-21 1998-08-07 Canon Inc 筐体内部のフレームグラウンド間接続方法
JPH11177274A (ja) * 1997-12-08 1999-07-02 Canon Inc プリント配線基板とケーブルおよび筐体との接続方法、および電子機器
US6573804B2 (en) * 2000-03-14 2003-06-03 Canon Kabushiki Kaisha Electronic apparatus having a printed circuit board with multi-point grounding
JP3703362B2 (ja) * 2000-03-14 2005-10-05 キヤノン株式会社 電子機器
US6507495B1 (en) * 2000-06-28 2003-01-14 Dell Products L.P. Three-dimensional technique for improving the EMC characteristics of a printed circuit board
US6937480B2 (en) * 2001-05-14 2005-08-30 Fuji Xerox Co., Ltd. Printed wiring board
JP2003163467A (ja) * 2001-05-14 2003-06-06 Fuji Xerox Co Ltd プリント配線基板及びプリント配線基板設計支援装置
KR100731544B1 (ko) * 2006-04-13 2007-06-22 한국전자통신연구원 다층배선 코플래너 웨이브가이드
JP5025376B2 (ja) * 2006-09-11 2012-09-12 キヤノン株式会社 プリント配線板及び電子機器

Also Published As

Publication number Publication date
CN102293068A (zh) 2011-12-21
US8530750B2 (en) 2013-09-10
JP2010199553A (ja) 2010-09-09
JP5409312B2 (ja) 2014-02-05
WO2010087506A1 (en) 2010-08-05
US20110247869A1 (en) 2011-10-13

Similar Documents

Publication Publication Date Title
US8530750B2 (en) Multilayer printed circuit board
JP5063529B2 (ja) プリント回路板
US8748753B2 (en) Printed circuit board
US8304667B2 (en) Multilayer printed circuit board
JP6391885B1 (ja) 回路基板
JP2010506380A (ja) 多層基板
WO2011018934A1 (ja) 信号線路
US8476533B2 (en) Printed circuit board
KR102447839B1 (ko) 회로 기판 및 이를 포함하는 전자 기기
JP6504960B2 (ja) プリント基板
JP6843312B1 (ja) 回路基板及び電子機器
CN105450195B (zh) 共模滤波器
WO2012039120A2 (en) Printed circuit board
WO2018229978A1 (ja) プリント配線板
JP6425632B2 (ja) プリント基板
CN201657491U (zh) 线路板
JP6612008B1 (ja) 電子機器
US7667980B2 (en) Printed circuit boards for countering signal distortion
JP2011146454A (ja) ノイズ対策構造
JP6399969B2 (ja) プリント基板
JP2003133747A (ja) 多層プリント配線板
CN206790805U (zh) 电路基板
WO2025142317A1 (ja) 電流制御モジュール、並びに、これを備えるバッテリー及び電子機器
WO2020235092A1 (ja) フィルタ回路
JP2012069814A (ja) プリント回路板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140305

Termination date: 20210128