CN102284796B - 在盖膜上加工窗口的方法 - Google Patents
在盖膜上加工窗口的方法 Download PDFInfo
- Publication number
- CN102284796B CN102284796B CN201110151022.4A CN201110151022A CN102284796B CN 102284796 B CN102284796 B CN 102284796B CN 201110151022 A CN201110151022 A CN 201110151022A CN 102284796 B CN102284796 B CN 102284796B
- Authority
- CN
- China
- Prior art keywords
- window
- epiphragma
- cover plate
- covering film
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 241001232787 Epiphragma Species 0.000 claims description 61
- 238000003698 laser cutting Methods 0.000 claims description 16
- 230000004888 barrier function Effects 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 6
- 238000003754 machining Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110151022.4A CN102284796B (zh) | 2011-06-07 | 2011-06-07 | 在盖膜上加工窗口的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110151022.4A CN102284796B (zh) | 2011-06-07 | 2011-06-07 | 在盖膜上加工窗口的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102284796A CN102284796A (zh) | 2011-12-21 |
CN102284796B true CN102284796B (zh) | 2015-03-11 |
Family
ID=45331693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110151022.4A Active CN102284796B (zh) | 2011-06-07 | 2011-06-07 | 在盖膜上加工窗口的方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102284796B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103143843B (zh) * | 2013-03-20 | 2015-05-13 | 沈阳飞机工业(集团)有限公司 | 一种带定位孔模线样板在返修过程中的定位方法 |
CN105750737B (zh) * | 2014-12-18 | 2018-01-09 | 泰科电子(上海)有限公司 | 切割系统 |
CN107717238B (zh) * | 2017-09-30 | 2019-11-05 | 武汉华星光电技术有限公司 | 盖板、层叠结构及柔性显示屏激光切割工程方法 |
CN108260278B (zh) * | 2017-11-30 | 2020-05-22 | 江门崇达电路技术有限公司 | 一种制作ptfe垫片的辅助工具及制作该垫片的方法 |
CN113351999A (zh) * | 2021-05-31 | 2021-09-07 | 昆山大洋电路板有限公司 | 一种基于激光镭雕的成品板铜面无损伤改版再加工工艺 |
CN113795087B (zh) * | 2021-11-15 | 2022-05-03 | 深圳市大族数控科技股份有限公司 | 开窗方法及开窗设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6851617B2 (en) * | 2002-04-19 | 2005-02-08 | Avery Dennison Corporation | Laser imageable RFID label/tag |
CN101480758A (zh) * | 2009-01-22 | 2009-07-15 | 华中科技大学 | 一种紫外激光切割挠性印刷电路板的工艺方法 |
EP2111086A1 (en) * | 2008-04-18 | 2009-10-21 | Nitto Denko Corporation | Method of manufacturing wiring circuit board |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04264791A (ja) * | 1991-02-19 | 1992-09-21 | Sumitomo Electric Ind Ltd | フレキシブル回路基板 |
JPH10242617A (ja) * | 1997-02-28 | 1998-09-11 | Murata Mfg Co Ltd | セラミックグリーンシートの加工方法及びレーザ加工装置 |
JPH11121900A (ja) * | 1997-10-15 | 1999-04-30 | Sumitomo Electric Ind Ltd | 回路基板の製造方法 |
JP2001347499A (ja) * | 2000-06-05 | 2001-12-18 | Sony Corp | 微細装置の製造方法 |
WO2002081142A1 (fr) * | 2001-04-02 | 2002-10-17 | Taiyo Yuden Co., Ltd. | Procede d'usinage de materiau translucide par faisceau laser et materiau translucide usine |
TWI228951B (en) * | 2001-04-27 | 2005-03-01 | Benq Corp | A manufacturing method of flexible circuit board |
JP3841715B2 (ja) * | 2002-04-25 | 2006-11-01 | 日本メクトロン株式会社 | 回路基板の製造法 |
-
2011
- 2011-06-07 CN CN201110151022.4A patent/CN102284796B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6851617B2 (en) * | 2002-04-19 | 2005-02-08 | Avery Dennison Corporation | Laser imageable RFID label/tag |
EP2111086A1 (en) * | 2008-04-18 | 2009-10-21 | Nitto Denko Corporation | Method of manufacturing wiring circuit board |
CN101480758A (zh) * | 2009-01-22 | 2009-07-15 | 华中科技大学 | 一种紫外激光切割挠性印刷电路板的工艺方法 |
Non-Patent Citations (1)
Title |
---|
"UV激光切割挠性电路覆盖膜的应用研究";吕洪杰;《印制电路信息》;20091130(第11期);第61-64页 * |
Also Published As
Publication number | Publication date |
---|---|
CN102284796A (zh) | 2011-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102284796B (zh) | 在盖膜上加工窗口的方法 | |
US7091624B2 (en) | Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same | |
US9779993B2 (en) | Wafer processing method including attaching a protective tape to a front side of a functional layer to prevent debris adhesion | |
CN100435606C (zh) | 制造软硬复合电路板的方法 | |
CN102769996B (zh) | 阶梯盲槽pcb板的加工方法 | |
CN105407658B (zh) | 一种防止软板金手指偏位的软硬结合板的制作方法 | |
CN108040428A (zh) | 一种高阶hdi叠孔刚挠结合电路板的制作方法 | |
CN107613676B (zh) | 一种多层线路板层偏改善方法 | |
WO2012071759A1 (zh) | 一种高密度sim卡封装件及其生产方法 | |
CN101480758A (zh) | 一种紫外激光切割挠性印刷电路板的工艺方法 | |
JP5614458B2 (ja) | 筺体及びその製造方法 | |
US20150072506A1 (en) | Wafer processing method | |
CN104768334A (zh) | 一种动态地调整贴装位置的贴装方法及其装置 | |
CN105792526A (zh) | 一种双面板的盲槽制作方法 | |
CN105530757A (zh) | 一种铝基柔性电路板的制造方法 | |
CN102045948A (zh) | 采用无流动半固化片压合金属基板的pcb板制作方法 | |
CN103124468A (zh) | 金属基覆铜层压板和使用其制造金属芯印刷电路板的方法 | |
JP2011077429A (ja) | ワーク分割方法 | |
CN103152984B (zh) | 线路板上装配口的加工方法 | |
CN103426836A (zh) | 感测元件封装结构及其制作方法 | |
CN106102328A (zh) | 一种印制板cob围坝制作方法 | |
CN109152223B (zh) | 一种软硬结合板的制作方法 | |
CN103231171A (zh) | 印制电路板的盲孔加工方法 | |
CN106271424A (zh) | 电阻应变计密封层成型方法 | |
CN105449931B (zh) | 一种平面电机 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: Dazu laser Building No. 9 Nanshan District high tech Park North new road Shenzhen city Guangdong province 518055 Applicant after: HANS LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Applicant after: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Address before: 518000 Shenzhen Province, Nanshan District high tech park, North West New Road, No. 9 Applicant before: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen Applicant before: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: DAZU LASER SCI. + TECH. CO., LTD., SHENZHEN TO: HAN'S LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 518101 workshop 5 / F, 1 / 2 / F, 14 / F, 17 / F, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518055, the Han Dynasty laser building, No. 9 West West Road, Nanshan District hi tech park, Guangdong, Shenzhen Co-patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |