CN102272925B - 用于制造照明用具的方法 - Google Patents

用于制造照明用具的方法 Download PDF

Info

Publication number
CN102272925B
CN102272925B CN200980153425.3A CN200980153425A CN102272925B CN 102272925 B CN102272925 B CN 102272925B CN 200980153425 A CN200980153425 A CN 200980153425A CN 102272925 B CN102272925 B CN 102272925B
Authority
CN
China
Prior art keywords
chip mounting
sub
solder
area
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200980153425.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN102272925A (zh
Inventor
S.格雷奇
K.米勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN102272925A publication Critical patent/CN102272925A/zh
Application granted granted Critical
Publication of CN102272925B publication Critical patent/CN102272925B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN200980153425.3A 2008-12-30 2009-11-27 用于制造照明用具的方法 Active CN102272925B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008063325.9 2008-12-30
DE102008063325A DE102008063325A1 (de) 2008-12-30 2008-12-30 Verfahren zur Fertigung von Leuchtmitteln
PCT/DE2009/001693 WO2010075831A1 (de) 2008-12-30 2009-11-27 Verfahren zur fertigung von leuchtmitteln

Publications (2)

Publication Number Publication Date
CN102272925A CN102272925A (zh) 2011-12-07
CN102272925B true CN102272925B (zh) 2014-01-01

Family

ID=41725366

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980153425.3A Active CN102272925B (zh) 2008-12-30 2009-11-27 用于制造照明用具的方法

Country Status (7)

Country Link
US (1) US8809082B2 (https=)
EP (2) EP2544234A1 (https=)
JP (1) JP5766122B2 (https=)
KR (1) KR101681343B1 (https=)
CN (1) CN102272925B (https=)
DE (1) DE102008063325A1 (https=)
WO (1) WO2010075831A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008063325A1 (de) 2008-12-30 2010-07-01 Osram Opto Semiconductors Gmbh Verfahren zur Fertigung von Leuchtmitteln
CN103201834B (zh) * 2011-11-04 2016-03-02 松下知识产权经营株式会社 半导体装置及其制造方法
DE102012215705B4 (de) * 2012-09-05 2021-09-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optisches bauelement, baugruppe, verfahren zum herstellen eines gehäuses und verfahren zum herstellen einer baugruppe
ITTR20120012A1 (it) * 2012-11-20 2013-02-19 Tecnologie E Servizi Innovativi T S I S R L Mpcb-led-sink20 - circuito stampato su base metallica con trasferimento diretto del calore dal pad termico dei led di potenza allo strato metallico della mpcb con capacita' di abbassare la temperatura della giunzione del led di ulteriori 20 °c rispet
DE102013201775A1 (de) * 2013-02-04 2014-08-07 Osram Gmbh Beleuchtungsmodul und Verfahren zur Herstellung eines Beleuchtungsmoduls
DE102013101262A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer
US9215794B2 (en) * 2013-05-06 2015-12-15 Shenzhen China Star Optoelectronics Technology Co., Ltd. Circuit board and display device
DE102013215588A1 (de) * 2013-08-07 2015-02-12 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Leiterplattenanordnung, Steuervorrichtung für ein Kühlerlüftermodul und Verfahren
JP2015176975A (ja) * 2014-03-14 2015-10-05 パナソニックＩｐマネジメント株式会社 半導体装置
CN109188631B (zh) * 2018-09-26 2022-06-24 昂纳信息技术（深圳）有限公司 一种尾纤的防脱落方法及光学装置
JP2021118350A (ja) * 2020-01-23 2021-08-10 富士電機株式会社 電子装置及び電子装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006119723A1 (de) * 2005-05-13 2006-11-16 Osram Opto Semiconductors Gmbh Projektionseinrichtung
US20060289887A1 (en) * 2005-06-24 2006-12-28 Jabil Circuit, Inc. Surface mount light emitting diode (LED) assembly with improved power dissipation
CN101154656A (zh) * 2006-09-30 2008-04-02 香港微晶先进封装技术有限公司 多芯片发光二极管模组结构及其制造方法
WO2008040307A2 (de) * 2006-09-25 2008-04-10 Osram Opto Semiconductors Gmbh Verfahren zur herstellung einer anordnung optoelektronischer bauelemente und anordnung optoelektronischer bauelemente
DE102008001221A1 (de) * 2007-04-24 2008-10-30 Ceramtec Ag Bauteil mit einem keramischen Körper mit metallisierter Oberfläche

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2528000B2 (de) * 1975-06-24 1979-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung einer Lötfläche relativ großer Abmessungen
US6546620B1 (en) * 2000-06-29 2003-04-15 Amkor Technology, Inc. Flip chip integrated circuit and passive chip component package fabrication method
US6660559B1 (en) * 2001-06-25 2003-12-09 Amkor Technology, Inc. Method of making a chip carrier package using laser ablation
DE10351120A1 (de) * 2003-11-03 2005-06-09 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Lötstopbarriere
DE102004016697B4 (de) * 2004-02-27 2007-10-11 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von Halbleiterchips umfassend ein Verbindungsverfahren, das Löten mit einem Lot umfasst, und Halbleiterchip
EP1575084B1 (en) * 2004-03-01 2010-05-26 Imec Method for depositing a solder material on a substrate
CN100571353C (zh) 2005-05-13 2009-12-16 奥斯兰姆奥普托半导体有限责任公司 投影设备
KR100658939B1 (ko) 2005-05-24 2006-12-15 엘지전자 주식회사 발광 소자의 패키지
KR100699161B1 (ko) 2005-10-06 2007-03-22 엘지전자 주식회사 발광 소자 패키지 및 그의 제조 방법
KR20080007961A (ko) 2006-07-19 2008-01-23 알티전자 주식회사 엘이디 모듈의 냉각 장치 및 그 제조 방법
JP5145729B2 (ja) 2007-02-26 2013-02-20 富士電機株式会社 半田接合方法およびそれを用いた半導体装置の製造方法
DE102008063325A1 (de) 2008-12-30 2010-07-01 Osram Opto Semiconductors Gmbh Verfahren zur Fertigung von Leuchtmitteln

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006119723A1 (de) * 2005-05-13 2006-11-16 Osram Opto Semiconductors Gmbh Projektionseinrichtung
US20060289887A1 (en) * 2005-06-24 2006-12-28 Jabil Circuit, Inc. Surface mount light emitting diode (LED) assembly with improved power dissipation
WO2008040307A2 (de) * 2006-09-25 2008-04-10 Osram Opto Semiconductors Gmbh Verfahren zur herstellung einer anordnung optoelektronischer bauelemente und anordnung optoelektronischer bauelemente
CN101154656A (zh) * 2006-09-30 2008-04-02 香港微晶先进封装技术有限公司 多芯片发光二极管模组结构及其制造方法
DE102008001221A1 (de) * 2007-04-24 2008-10-30 Ceramtec Ag Bauteil mit einem keramischen Körper mit metallisierter Oberfläche

Also Published As

Publication number Publication date
US20120107973A1 (en) 2012-05-03
CN102272925A (zh) 2011-12-07
KR20110100307A (ko) 2011-09-09
US8809082B2 (en) 2014-08-19
EP2371000B1 (de) 2016-10-26
EP2544234A1 (de) 2013-01-09
EP2371000A1 (de) 2011-10-05
JP2012514340A (ja) 2012-06-21
KR101681343B1 (ko) 2016-11-30
WO2010075831A1 (de) 2010-07-08
DE102008063325A1 (de) 2010-07-01
JP5766122B2 (ja) 2015-08-19

Similar Documents

Publication Publication Date Title
CN102272925B (zh) 用于制造照明用具的方法
CN101410670B (zh) 光电头灯、用于生产光电头灯的方法和发光二极管芯片
US9000474B2 (en) Wiring substrate, light emitting device, and manufacturing method of wiring substrate
JP6116949B2 (ja) 発光素子搭載用の配線基板、発光装置、発光素子搭載用の配線基板の製造方法及び発光装置の製造方法
KR100296202B1 (ko) 발광표시소자
CN102165588B (zh) 具有支承衬底和多个发射辐射的半导体器件的光电子模块及其制造方法
JPH09223820A (ja) 表示装置
WO2008009630A1 (de) Strahlungsemittierende einrichtung mit mehreren strahlungsemittierenden bauelementen und beleuchtungseinrichtung
WO2014064871A1 (ja) 発光装置およびその製造方法ならびに発光装置実装体
JP2001203396A (ja) 光照射装置
JP6316731B2 (ja) 配線基板及びその製造方法、並びに半導体パッケージ
US10217731B2 (en) Method of producing optoelectronic modules and an assembly having a module
JP6603301B2 (ja) 発光モジュール
US20250160053A1 (en) Production method, optoelectronic semiconductor component, and carrier
JP2006080003A (ja) 照明装置用反射板とその製造方法、及びこれを用いた照明装置とその製造方法
JP2018056397A (ja) メタルベース基板の製造方法、半導体装置の製造方法、メタルベース基板、及び、半導体装置
TW202347814A (zh) 半導體發光裝置
JP2016525792A (ja) 印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ
JP2009038202A (ja) 発光素子実装用基板、発光素子モジュール、照明装置、表示装置及び交通信号機
KR20170009750A (ko) 발광 다이오드 패키지 제조 방법
CN118715623A (zh) 制造方法、光电子半导体器件和载体

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant