CN102272578B - 太赫兹检查装置 - Google Patents

太赫兹检查装置 Download PDF

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Publication number
CN102272578B
CN102272578B CN200980153214XA CN200980153214A CN102272578B CN 102272578 B CN102272578 B CN 102272578B CN 200980153214X A CN200980153214X A CN 200980153214XA CN 200980153214 A CN200980153214 A CN 200980153214A CN 102272578 B CN102272578 B CN 102272578B
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CN200980153214XA
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Chinese (zh)
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CN102272578A (zh
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尾内敏彦
笠井信太郎
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Canon Inc
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Canon Inc
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3581—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3563—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing solids; Preparation of samples therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/103—Scanning by mechanical motion of stage

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Toxicology (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
CN200980153214XA 2009-01-05 2009-12-16 太赫兹检查装置 Expired - Fee Related CN102272578B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009000465A JP5173850B2 (ja) 2009-01-05 2009-01-05 検査装置
JP2009-000465 2009-01-05
PCT/JP2009/071366 WO2010076874A1 (en) 2009-01-05 2009-12-16 Terahertz examining apparatus

Publications (2)

Publication Number Publication Date
CN102272578A CN102272578A (zh) 2011-12-07
CN102272578B true CN102272578B (zh) 2013-08-14

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CN200980153214XA Expired - Fee Related CN102272578B (zh) 2009-01-05 2009-12-16 太赫兹检查装置

Country Status (4)

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US (1) US8440971B2 (enExample)
JP (1) JP5173850B2 (enExample)
CN (1) CN102272578B (enExample)
WO (1) WO2010076874A1 (enExample)

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US7733100B2 (en) 2005-08-26 2010-06-08 Dcg Systems, Inc. System and method for modulation mapping
JP5462779B2 (ja) * 2010-12-27 2014-04-02 大日本スクリーン製造株式会社 基板検査装置及び基板検査方法
JP5580251B2 (ja) * 2011-06-13 2014-08-27 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ接合強度検査装置及び方法
JP5972536B2 (ja) * 2011-07-26 2016-08-17 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置および基板検査方法
US9140542B2 (en) * 2012-02-08 2015-09-22 Honeywell Asca Inc. Caliper coating measurement on continuous non-uniform web using THz sensor
JP2013174548A (ja) * 2012-02-27 2013-09-05 Otsuka Denshi Co Ltd 測定装置および測定方法
CN102621070B (zh) * 2012-04-13 2013-09-18 吴周令 一种二维太赫兹成像系统及其成像方法
US9228826B2 (en) 2012-08-29 2016-01-05 Electronics And Telecommunications Research Institute Apparatus and method for contactless thickness measurement
KR101374321B1 (ko) * 2012-08-29 2014-03-17 한국전자통신연구원 비접촉 두께 측정 장치 및 그것의 두께 측정 방법
JP2014122875A (ja) 2012-11-26 2014-07-03 Canon Inc 層状物体の測定装置および方法
CN103105368A (zh) * 2013-01-25 2013-05-15 大连理工大学 一种分析聚变装置第一镜杂质沉积层厚度及其结构的方法
CN103115893A (zh) * 2013-01-30 2013-05-22 大连理工大学 一种检测托卡马克钨第一壁灰尘沉积层成分及厚度的装置
WO2015051806A1 (en) * 2013-10-11 2015-04-16 Danmarks Tekniske Universitet Method for characterisation of electrical properties
FR3013128B1 (fr) * 2013-11-13 2016-01-01 Univ Aix Marseille Dispositif et methode de mise au point tridimensionnelle pour microscope
CN105628642A (zh) * 2016-01-08 2016-06-01 上海理工大学 一种提高太赫兹光学检测系统频谱信噪比的方法
DE102016119728A1 (de) * 2016-10-17 2018-04-19 Inoex Gmbh Lnnovationen Und Ausrüstungen Für Die Extrusionstechnik Terahertz-Messgerät
WO2018105332A1 (ja) * 2016-12-06 2018-06-14 パイオニア株式会社 検査装置、検査方法、コンピュータプログラム及び記録媒体
KR102350650B1 (ko) * 2017-03-30 2022-01-12 한양대학교 산학협력단 두께 측정 장치, 두께 측정 방법 및 두께 측정 프로그램
EP3627098A4 (en) * 2017-05-16 2021-02-24 Pioneer Corporation TEST DEVICE, TEST METHOD, LIBRARY GENERATION DEVICE, LIBRARY GENERATION PROCESS, COMPUTER PROGRAM AND RECORDING MEDIA
CN107703562B (zh) * 2017-09-26 2019-03-19 北京无线电计量测试研究所 一种用于高带宽平衡光电探测器共模抑制比校准的装置与方法
US11143590B2 (en) 2018-03-22 2021-10-12 3M Innovative Properties Company Time-domain terahertz measurement system having a single reference surface
DE102018124175A1 (de) 2018-10-01 2020-04-02 Sikora Ag Verfahren und Vorrichtung zum Steuern einer Produktionsanlage für plattenförmige oder strangförmige Körper
EP3742191A1 (en) * 2019-05-24 2020-11-25 Helmut Fischer GmbH Terahertz measuring device and method of operating a terahertz measuring device
DE102022105479B3 (de) * 2022-03-09 2023-08-03 Sikora Aktiengesellschaft Vorrichtung und Verfahren zum Bestimmen von Dimensionsdaten eines Objekts
CN114885179B (zh) * 2022-05-23 2024-10-22 浙大城市学院 一种太赫兹时域光谱透射成像数据压缩重构方法
CN115127779B (zh) * 2022-06-16 2025-04-15 中国科学院上海光学精密机械研究所 高功率激光系统的色散测量方法

Citations (4)

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GB2359716B (en) * 2000-02-28 2002-06-12 Toshiba Res Europ Ltd An imaging apparatus and method
DE102007011820A1 (de) * 2007-03-12 2008-09-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum schnellen Messen von Proben mit geringem optischen Wegunterschied mittels elektromagnetischer Strahlung im Terahertz-Bereich
CN201340905Y (zh) * 2009-01-22 2009-11-04 山东科技大学 太赫兹波带片
CN102087211A (zh) * 2010-12-08 2011-06-08 南京邮电大学 生物薄膜的太赫兹光谱分析装置及检测方法

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US5710430A (en) 1995-02-15 1998-01-20 Lucent Technologies Inc. Method and apparatus for terahertz imaging
US5939721A (en) 1996-11-06 1999-08-17 Lucent Technologies Inc. Systems and methods for processing and analyzing terahertz waveforms
JP4476462B2 (ja) 2000-03-27 2010-06-09 株式会社栃木ニコン 半導体の電気特性評価装置
JP2002096634A (ja) 2000-09-25 2002-04-02 Asahi Glass Co Ltd 取付用部材付き窓用板材の製造方法
GB2399626B (en) * 2003-03-21 2006-04-05 Teraview Ltd Spectroscopy apparatus and associated technique
GB2405466B (en) * 2003-08-27 2006-01-25 Teraview Ltd Method and apparatus for investigating a non-planner sample
JP4721416B2 (ja) * 2005-09-05 2011-07-13 キヤノン株式会社 検体検査素子、及び検体検査装置
US7459687B2 (en) * 2006-04-06 2008-12-02 New Jersey Institute Of Technology Non-linear terahertz spectroscopy for defect density identification in high k dielectric films
JP4829669B2 (ja) * 2006-04-28 2011-12-07 キヤノン株式会社 検体情報取得装置、及び検体情報取得方法
JP5037929B2 (ja) * 2006-12-18 2012-10-03 キヤノン株式会社 テラヘルツ波を用いた対象物の情報取得装置及び方法
GB2446166B (en) * 2007-01-29 2010-05-12 Teraview Ltd A pharmaceutical analysis method and apparatus
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2359716B (en) * 2000-02-28 2002-06-12 Toshiba Res Europ Ltd An imaging apparatus and method
DE102007011820A1 (de) * 2007-03-12 2008-09-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum schnellen Messen von Proben mit geringem optischen Wegunterschied mittels elektromagnetischer Strahlung im Terahertz-Bereich
CN201340905Y (zh) * 2009-01-22 2009-11-04 山东科技大学 太赫兹波带片
CN102087211A (zh) * 2010-12-08 2011-06-08 南京邮电大学 生物薄膜的太赫兹光谱分析装置及检测方法

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Publication number Publication date
US8440971B2 (en) 2013-05-14
JP2010156664A (ja) 2010-07-15
JP5173850B2 (ja) 2013-04-03
WO2010076874A1 (en) 2010-07-08
CN102272578A (zh) 2011-12-07
US20110267600A1 (en) 2011-11-03

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